Jobs / United States / Intel Corporation
Module Engineer On-Shift (MEOS) – Day Shift (5)
Intel Corporation · 🇺🇸 US, Arizona, Phoenix
Sponsorship verdict
Sponsorship possible
One solid signal, not two — worth applying, and worth asking about sponsorship early.
- Employer is on a government sponsor recordThe US Department of Labor certified 1,731 H-1B/E-3 labor condition applications for this employer between Oct 2025 and Jun 2026 (latest Jun 2026) — the step every H-1B hire needs first. USCIS also records 1,112 H-1B approvals in FY2023. Source: LCA disclosure data (US Department of Labor (OFLC)).
- The posting doesn’t mention sponsorshipSilence isn’t a refusal — ask the recruiter before investing much time.
- No salary bar for this routeH-1B has no fixed salary bar: the employer must pay at least the prevailing wage for the role and area. Cap-subject employers enter a lottery weighted by wage level. Source: https://www.federalregister.gov/documents/2025/12/29/2025-23853/weighted-selection-process-for-registrants-and-petitioners-seeking-to-file-cap-subject-h-1b, rules effective 2026-02-27.
- What Intel Corporation paid sponsored hires in similar roles78 certified filings for “Software Engineer” (Software Developers) in AZ: $111k–$140k, median $120k. Most were filed at wage level II (59%) — 2 lottery entries, ≈31% projected selection odds for cap-subject employers. Source: US Department of Labor LCA disclosure data (Oct 2025 – Jun 2026).
- Confirmed live todayWhen a source last listed this job as open.
US H-1B: cap-subject employers enter a lottery weighted by wage level — Level I gets 1 entry, Level IV gets 4 (DHS projected selection odds ≈15% at Level I to ≈61% at Level IV). Universities and non-profit research employers are cap-exempt. The $100,000 fee for new petitions from abroad is currently blocked by a court order (appeal pending).
A verdict summarises public evidence; it is not legal advice and never a guarantee — the employer and the immigration authority decide. Sign in to factor in where you can already work.
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Sponsor Radar — Intel Corporation
The US Department of Labor certified 1,731 H-1B/E-3 labor condition applications for this employer between Oct 2025 and Jun 2026 (latest Jun 2026) — the step every H-1B hire needs first. USCIS also records 1,112 H-1B approvals in FY2023. Source: LCA disclosure data (US Department of Labor (OFLC)).
Past sponsorship or register membership never guarantees sponsorship for this vacancy or for you. Full Sponsor Radar for Intel Corporation →
About the role
Job Details: Job Description: Intel is one of the world's leading semiconductor companies, driving innovation that shapes the future of technology. Our Substrate Packaging Technology Development (SPTD) organization is at the forefront of advanced packaging solutions, with a mission to be the supplier of choice for leading-edge and affordable substrate packaging. At Intel, we believe in creating an inclusive, collaborative, and innovative workplace where every team member plays a vital role in changing the world through technology. We are looking for a motivated and detail-oriented Module Engineer On Shift (MEOS) to join our SPTD team in Chandler, Arizona. In this role, you will be a critical part of our 24x7 manufacturing operation, providing real-time factory support to ensure seamless lot movement through the production line. You will work in a dynamic, fast-paced environment where your problem-solving skills and engineering expertise will directly impact the quality and efficiency of our substrate packaging manufacturing processes. Shift 5 Details: • Shift Hours: 6:00 AM – 6:00 PM • Schedule: Alternating 3- and 4-day work weeks (Sunday–Tuesday and alternating Wednesday) This position is based in Arizona. Compensation for this role will be determined in accordance with the applicable salary range for the Arizona work location, as well as factors such as skills, qualifications, and experience. Key Responsibilities: • Factory Floor Support: Provide hands-on, real-time support for equipment, process, and product issues to maintain continuous 24x7 lot movement through the manufacturing line. • Shift Communication: Receive written and verbal pass-downs from outgoing shift peers; deliver comprehensive, quality pass-downs to incoming shift teams; align priorities with management at the start of each shift. • Troubleshooting & Error Recovery: Respond promptly to process issues, perform error recovery, manage lot disposition, and support new tool enabling activities. • Documentation: Write and update specifications and RFCs (Request for Change) as required to maintain accurate and current process records. • Inspection & Imaging: Execute non-standard procedures and perform inspection and imaging on panels to collect critical development data. • Stakeholder Communication: Communicate effectively via email with Tool and Lot Owners regarding key issues, ensuring timely resolution and transparency. • Ad-Hoc Support: Perform a variety of ad-hoc duties as required by the factory within your specific functional area. As a Successful Candidate, You Will Bring: • Strong Problem-Solving Skills – You approach challenges with curiosity and a solutions-oriented mindset. • Excellent Communication – You communicate clearly and confidently, both verbally and in writing, with peers, engineers, and stakeholders. • Adaptability – You thrive in a fast-paced environment and can pivot quickly when priorities shift. • Self-Motivation – You are a self-starter who can manage your own workload while also contributing to team success. • Collaborative Spirit – You work well with others and understand the importance of teamwork in a manufacturing environment. • Attention to Detail – You take pride in accuracy and thoroughness in everything you do. If you are passionate about semiconductor technology and want to be part of a team that is shaping the future of advanced packaging, we want to hear from you! Qualifications: You must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. Experience would be obtained through a combination of prior education level classes, and curr