Jobs / United States / Intel Corporation
TD Memory Quality and Reliability Engineer
Intel Corporation · 🇺🇸 3 Locations
Sponsorship verdict
Sponsorship possible
One solid signal, not two — worth applying, and worth asking about sponsorship early.
- Employer is on a government sponsor recordThe US Department of Labor certified 1,731 H-1B/E-3 labor condition applications for this employer between Oct 2025 and Jun 2026 (latest Jun 2026) — the step every H-1B hire needs first. USCIS also records 1,112 H-1B approvals in FY2023. Source: LCA disclosure data (US Department of Labor (OFLC)).
- The posting doesn’t mention sponsorshipSilence isn’t a refusal — ask the recruiter before investing much time.
- No salary bar for this routeH-1B has no fixed salary bar: the employer must pay at least the prevailing wage for the role and area. Cap-subject employers enter a lottery weighted by wage level. Source: https://www.federalregister.gov/documents/2025/12/29/2025-23853/weighted-selection-process-for-registrants-and-petitioners-seeking-to-file-cap-subject-h-1b, rules effective 2026-02-27.
- What Intel Corporation paid sponsored hires in similar roles11 certified filings for “Quality Reliability Engineer” (Industrial Engineers) in AZ: $103k–$130k, median $117k. Most were filed at wage level II (50%) — 2 lottery entries, ≈31% projected selection odds for cap-subject employers. Source: US Department of Labor LCA disclosure data (Oct 2025 – Jun 2026).
- Confirmed live todayWhen a source last listed this job as open.
US H-1B: cap-subject employers enter a lottery weighted by wage level — Level I gets 1 entry, Level IV gets 4 (DHS projected selection odds ≈15% at Level I to ≈61% at Level IV). Universities and non-profit research employers are cap-exempt. The $100,000 fee for new petitions from abroad is currently blocked by a court order (appeal pending).
A verdict summarises public evidence; it is not legal advice and never a guarantee — the employer and the immigration authority decide. Sign in to factor in where you can already work.
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Sponsor Radar — Intel Corporation
The US Department of Labor certified 1,731 H-1B/E-3 labor condition applications for this employer between Oct 2025 and Jun 2026 (latest Jun 2026) — the step every H-1B hire needs first. USCIS also records 1,112 H-1B approvals in FY2023. Source: LCA disclosure data (US Department of Labor (OFLC)).
Past sponsorship or register membership never guarantees sponsorship for this vacancy or for you. Full Sponsor Radar for Intel Corporation →
About the role
Job Details: Job Description: About Us The Technology Development (TD) Quality and Reliability organization enables successful deployment of Intel's leading-edge process technologies through silicon-based quality, reliability, and technology readiness assessments. The Memory Quality and Reliability team partners with Design, Device Engineering, Product Development Engineering, and Yield organizations to develop, characterize and certify SRAM, Register File (RF), and Fuse array for advanced technology nodes. The team supports technology certification and PDK release milestones by establishing certification strategies, developing certification methodologies, performing silicon characterization, generating predictive Vccmin models, and assessing product risk for internal and external customers. Role Overview We are seeking an experienced Memory Quality and Reliability Engineer to drive post-silicon memory characterization, certification, and technology readiness activities for advanced SRAM, Register File (RF) and/or fuse array. In this role, you will help improving certification methodologies, analyzing large-scale silicon characterization data, developing Vccmin/Vmax predictive models, assessing silicon-to-simulation correlation (Sil2Sim), and providing risk assessments that guide technology development, product deployment, and PDK release decisions. You will work with design, device, process, test, and yield organizations to transform silicon learning into certification decisions and actionable technology improvements. Key Responsibilities • Plan and execute SRAM, RF, and/or Fuse technology certification supporting technology development and certification milestones. • Define and maintain certification methodologies and criteria, test strategies, and readiness requirements for memory array. • Drive memory array characterization across multiple operating conditions to evaluate Vmin, Vmax, aging behavior, variability, and design margins. • Analyze silicon characterization data to identify performance gaps, failure signatures, systematic trends, and technology risks. • Develop, validate, and maintain silicon-based Vccmin and Vmax predictive models used for technology certification, PDK releases, and product guidance. • Perform silicon-to-simulation (Sil2Sim) correlation assessments and drive understanding of discrepancies between measured silicon behavior and design predictions. • Collaborate with Yield, Design, Device Engineering, PDE, Defect Rel and FIFA teams to define root-cause hypotheses, resolution paths, and technology improvement recommendations on meeting technology commit for memory offers. • Generate certification reports, readiness assessments, and risk projections that support technology deployment decisions. • Present technical findings and recommendations to engineering leadership, program teams, and customers. • Drive continuous improvement of memory certification methodologies, modeling approaches, characterization flows, and data analytics infrastructure. • Provide technical mentorship and leadership within a highly collaborative cross-functional environment. Behavioral Traits • Demonstrated ability to influence across organizational boundaries and drive resolution of complex technical challenges. • Strong analytical and problem-solving skills with a data-driven decision-making approach. • Ability to work effectively in ambiguous, fast-paced technology development environments. • Excellent written and verbal communication skills, including presentation of complex technical topics to diverse stakeholders. • Self-motivated and capable of independently driving technical programs from problem definition through closure. Qualifications: Qualifications Minimum Qualifications • Ph.D. in Electrical Engineering, Comput