Jobs / United States / Intel Corporation
Module Engineering (PhD Intern)
Intel Corporation · 🇺🇸 US, Oregon, Hillsboro
Sponsorship verdict
Sponsorship possible
One solid signal, not two — worth applying, and worth asking about sponsorship early.
- Employer is on a government sponsor recordThe US Department of Labor certified 1,731 H-1B/E-3 labor condition applications for this employer between Oct 2025 and Jun 2026 (latest Jun 2026) — the step every H-1B hire needs first. USCIS also records 1,112 H-1B approvals in FY2023. Source: LCA disclosure data (US Department of Labor (OFLC)).
- The posting doesn’t mention sponsorshipSilence isn’t a refusal — ask the recruiter before investing much time.
- No salary bar for this routeH-1B has no fixed salary bar: the employer must pay at least the prevailing wage for the role and area. Cap-subject employers enter a lottery weighted by wage level. Source: https://www.federalregister.gov/documents/2025/12/29/2025-23853/weighted-selection-process-for-registrants-and-petitioners-seeking-to-file-cap-subject-h-1b, rules effective 2026-02-27.
- What Intel Corporation paid sponsored hires in similar roles50 certified filings for “Engineering Manager” (Architectural and Engineering Managers) in OR: $182k–$209k, median $182k. Most were filed at wage level III (52%) — 3 lottery entries, ≈46% projected selection odds for cap-subject employers. The pay stated here ($120,898.00-120,902.00 USD) is below what this employer usually pays sponsored hires for this role. Source: US Department of Labor LCA disclosure data (Oct 2025 – Jun 2026).
- Confirmed live todayWhen a source last listed this job as open.
US H-1B: cap-subject employers enter a lottery weighted by wage level — Level I gets 1 entry, Level IV gets 4 (DHS projected selection odds ≈15% at Level I to ≈61% at Level IV). Universities and non-profit research employers are cap-exempt. The $100,000 fee for new petitions from abroad is currently blocked by a court order (appeal pending).
A verdict summarises public evidence; it is not legal advice and never a guarantee — the employer and the immigration authority decide. Sign in to factor in where you can already work.
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Sponsor Radar — Intel Corporation
The US Department of Labor certified 1,731 H-1B/E-3 labor condition applications for this employer between Oct 2025 and Jun 2026 (latest Jun 2026) — the step every H-1B hire needs first. USCIS also records 1,112 H-1B approvals in FY2023. Source: LCA disclosure data (US Department of Labor (OFLC)).
Past sponsorship or register membership never guarantees sponsorship for this vacancy or for you. Full Sponsor Radar for Intel Corporation →
About the role
Job Details: Job Description: The Role and Impact As a Module Engineering PhD Intern, you will play a key role in developing and optimizing semiconductor manufacturing processes for a specific module. You will gain hands-on experience by sustaining and improving manufacturing equipment, troubleshooting issues, and supporting qualification activities. This internship offers a unique opportunity to apply your academic knowledge, build practical skills, and contribute to real-world projects in a dynamic environment that fosters growth and innovation. Business Group Intel Foundry is focused on advancing semiconductor manufacturing technologies and delivering innovative solutions to meet customer needs worldwide. As part of this organization, you will join a group dedicated to sustaining high-performance manufacturing processes and driving process optimization to support Intel's broader mission of technological excellence. Key Responsibilities • Support the development and implementation of manufacturing processes for a specific module in semiconductor production. • Sustain and enhance manufacturing equipment performance to ensure operational reliability and efficiency. • Assist in troubleshooting equipment issues and performing qualification activities to achieve production standards. • Collaborate with engineering teams to optimize process control methodologies and enhance process efficiency. • Apply statistical analysis and experimental design to improve process reliability and throughput. • Gain hands-on experience with materials and device characterization techniques, such as SEM and TEM. • Contribute to continuous improvement initiatives for process control systems and methodologies. Qualifications: Minimum Qualifications • Currently pursuing a Ph.D. degree in Materials Science, Chemical Engineering, Chemistry, Physics, Electrical Engineering, or another STEM-related field. • Knowledge of semiconductor processing fundamentals, including lithography, etching, polishing, and deposition techniques. • Familiarity with statistical data analysis and experimental design methodologies. • Experience in materials and physical device characterization techniques like SEM or TEM, gained through coursework, academic research, or hands-on training. Preferred Qualifications • Expertise in advanced semiconductor device structures, fabrication techniques, and process integration. • Proficiency in statistical analysis tools and programming languages such as JMP, Python, MATLAB, or C++. • Hands-on research experience in device fabrication, physical characterization, or materials testing. • Strong foundational knowledge in process control systems and semiconductor device physics. Explore the opportunity to grow your expertise in cutting-edge semiconductor manufacturing while contributing to innovative solutions in a collaborative environment. Apply today and take the first step toward shaping the future of technology. Job Type: Student / Intern Shift: Shift 1 (United States of America) Primary Location: US, Oregon, Hillsboro Additional Locations: Posting Statement: All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance. Position of Trust N/A Benefits We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation