Jobs / United States / Intel Corporation
Product Failure Analysis Engineer - SCAN Design for Test
Intel Corporation · 🇺🇸 US, Oregon, Hillsboro
Sponsorship verdict
Sponsorship possible
One solid signal, not two — worth applying, and worth asking about sponsorship early.
- Employer is on a government sponsor recordThe US Department of Labor certified 1,731 H-1B/E-3 labor condition applications for this employer between Oct 2025 and Jun 2026 (latest Jun 2026) — the step every H-1B hire needs first. USCIS also records 1,112 H-1B approvals in FY2023. Source: LCA disclosure data (US Department of Labor (OFLC)).
- The posting doesn’t mention sponsorshipSilence isn’t a refusal — ask the recruiter before investing much time.
- No salary bar for this routeH-1B has no fixed salary bar: the employer must pay at least the prevailing wage for the role and area. Cap-subject employers enter a lottery weighted by wage level. Source: https://www.federalregister.gov/documents/2025/12/29/2025-23853/weighted-selection-process-for-registrants-and-petitioners-seeking-to-file-cap-subject-h-1b, rules effective 2026-02-27.
- What Intel Corporation paid sponsored hires in similar roles163 certified filings for “Component Design Engineer” (Electronics Engineers, Except Computer) in OR: $122k–$154k, median $135k. Most were filed at wage level III (50%) — 3 lottery entries, ≈46% projected selection odds for cap-subject employers. Source: US Department of Labor LCA disclosure data (Oct 2025 – Jun 2026).
- Confirmed live todayWhen a source last listed this job as open.
US H-1B: cap-subject employers enter a lottery weighted by wage level — Level I gets 1 entry, Level IV gets 4 (DHS projected selection odds ≈15% at Level I to ≈61% at Level IV). Universities and non-profit research employers are cap-exempt. The $100,000 fee for new petitions from abroad is currently blocked by a court order (appeal pending).
A verdict summarises public evidence; it is not legal advice and never a guarantee — the employer and the immigration authority decide. Sign in to factor in where you can already work.
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Sponsor Radar — Intel Corporation
The US Department of Labor certified 1,731 H-1B/E-3 labor condition applications for this employer between Oct 2025 and Jun 2026 (latest Jun 2026) — the step every H-1B hire needs first. USCIS also records 1,112 H-1B approvals in FY2023. Source: LCA disclosure data (US Department of Labor (OFLC)).
Past sponsorship or register membership never guarantees sponsorship for this vacancy or for you. Full Sponsor Radar for Intel Corporation →
About the role
Job Details: Job Description: At Intel, we create world-changing technology that enriches the lives of every person on earth. As a global leader in semiconductor innovation, we design and manufacture the world's most advanced chips — powering everything from personal computers and smartphones to data centers, AI systems, and autonomous vehicles. Our Oregon campus is one of our most important engineering hubs in the world, home to thousands of brilliant engineers who are shaping the future of technology. We believe that diversity of thought, background, and experience makes us stronger — and we're committed to building a workplace where everyone can do their best work. We are seeking an experienced Product Failure Analysis Engineer - SCAN Design for Test who is excited by the opportunity to help enable the success of Intel Foundry's leading-edge 18A technology. The ideal candidate brings 6-12 years of semiconductor experience with deep expertise in DFT, ATPG, scan diagnosis, and post-silicon debug, along with a proven track record of solving complex silicon issues in advanced process technologies. In this role, you will play a critical part in accelerating the ramp and quality of Intel Foundry products by driving root-cause analysis of silicon failures, partnering across design, test, technology development, and manufacturing organizations to quickly identify and resolve product and process issues. Your technical leadership will directly contribute to improving product quality, yield, reliability, and time-to-market for next-generation foundry customers. The successful candidate will have hands-on experience utilizing both logical diagnosis techniques (ATPG, scan diagnosis, fault isolation) and physical failure analysis methodologies (FIB, SEM, TEM, laser-based techniques, or equivalent) to isolate defects and determine corrective actions. Strong collaboration skills are essential, as you will work closely with DFT architects, design engineers, validation teams, process integration engineers, yield engineers, and high-volume manufacturing organizations. Beyond issue resolution, we are looking for an engineer who can help shape the future of failure analysis and silicon debug by developing innovative methodologies, automation frameworks, and diagnostic capabilities that improve debug efficiency and accelerate root-cause identification across Intel Foundry's advanced technology portfolio.. Key Responsibilities: • Lead Failure Analysis: Utilize state-of-the-art lab equipment — including FIB tools, probe tools, and automated systems — to isolate microscopic silicon circuit failures and identify root causes with precision and speed. • Drive Cross-Functional Collaboration: Partner with test and validation engineers, circuit designers, wafer fabrication process engineers, and high-volume manufacturing teams to resolve quality issues, develop temporary mitigations, and implement permanent remedies. • Advance Debug Technologies: Develop new debug tools, methodologies, and technologies that push the boundaries of silicon debug, contributing to breakthrough innovations in semiconductor manufacturing. • Ensure Design for Debug: Evaluate and resolve component engineering and physical design issues, ensuring products incorporate the necessary design-for-debug features to enable deep silicon isolation capabilities. • Support Continuous Improvement: Provide expert input on failure analysis investigation areas and design process improvements, ensuring products consistently perform to specification. As a Successful Candidate, You Will Bring: • A collaborative spirit — you thrive in cross-functional environments and build strong relationships across teams. • Intellectual curiosity — you love diving deep into complex problems and