Jobs / United States / Intel Corporation
Packaging Process Development Engineer
Intel Corporation · 🇺🇸 US, Arizona, Phoenix
Sponsorship verdict
Sponsorship possible
One solid signal, not two — worth applying, and worth asking about sponsorship early.
- Employer is on a government sponsor recordThe US Department of Labor certified 1,731 H-1B/E-3 labor condition applications for this employer between Oct 2025 and Jun 2026 (latest Jun 2026) — the step every H-1B hire needs first. USCIS also records 1,112 H-1B approvals in FY2023. Source: LCA disclosure data (US Department of Labor (OFLC)).
- The posting doesn’t mention sponsorshipSilence isn’t a refusal — ask the recruiter before investing much time.
- No salary bar for this routeH-1B has no fixed salary bar: the employer must pay at least the prevailing wage for the role and area. Cap-subject employers enter a lottery weighted by wage level. Source: https://www.federalregister.gov/documents/2025/12/29/2025-23853/weighted-selection-process-for-registrants-and-petitioners-seeking-to-file-cap-subject-h-1b, rules effective 2026-02-27.
- What Intel Corporation paid sponsored hires in similar roles69 certified filings for “Process Engineer” (Materials Engineers) in AZ: $105k–$124k, median $110k. Most were filed at wage level III (51%) — 3 lottery entries, ≈46% projected selection odds for cap-subject employers. Source: US Department of Labor LCA disclosure data (Oct 2025 – Jun 2026).
- Confirmed live todayWhen a source last listed this job as open.
US H-1B: cap-subject employers enter a lottery weighted by wage level — Level I gets 1 entry, Level IV gets 4 (DHS projected selection odds ≈15% at Level I to ≈61% at Level IV). Universities and non-profit research employers are cap-exempt. The $100,000 fee for new petitions from abroad is currently blocked by a court order (appeal pending).
A verdict summarises public evidence; it is not legal advice and never a guarantee — the employer and the immigration authority decide. Sign in to factor in where you can already work.
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Sponsor Radar — Intel Corporation
The US Department of Labor certified 1,731 H-1B/E-3 labor condition applications for this employer between Oct 2025 and Jun 2026 (latest Jun 2026) — the step every H-1B hire needs first. USCIS also records 1,112 H-1B approvals in FY2023. Source: LCA disclosure data (US Department of Labor (OFLC)).
Past sponsorship or register membership never guarantees sponsorship for this vacancy or for you. Full Sponsor Radar for Intel Corporation →
About the role
Job Details: Job Description: Intel Corporation is one of the world's leading semiconductor companies, driving innovation across computing, connectivity, and artificial intelligence. With a legacy of over 50 years of technological breakthroughs, Intel empowers billions of people globally through world-class products and solutions. Our teams are made up of bold thinkers, problem-solvers, and innovators who are passionate about shaping the future of technology. At Intel, we believe in creating an inclusive workplace where diverse perspectives fuel creativity and drive meaningful impact. Intel's Packaging Module Development team is seeking a talented and driven Packaging Process Development Engineer to join our Arizona-based team. In this role, you will be at the forefront of advancing next-generation semiconductor packaging technologies, playing a critical part in Intel's product roadmap. You will develop and optimize innovative assembly processes and equipment, directly influencing the performance, reliability, and quality of Intel's cutting-edge products. This is a unique opportunity to make a lasting impact on the semiconductor industry while working alongside some of the brightest minds in the field. Key Responsibilities: • Develop and optimize assembly media and collaterals to achieve quality, reliability, cost, yield, productivity, and manufacturability targets. • Apply Design of Experiments (DOE) and Statistical Process Control (SPC) principles to refine media and collateral capabilities, documenting findings through detailed technical reports. • Design and maintain equipment to evaluate media and collateral performance under simulated field conditions, including temperature cycles, heat, humidity, and dynamic mechanical forces. • Ensure manufacturability of physical prototypes and oversee the full lifecycle of manufacturing workflows. • Define material specifications and collaborate closely with supplier quality and procurement teams to maintain compliance with quality and performance benchmarks. • Leverage a deep understanding of failure mechanisms to establish reliability benchmarks aligned with customer requirements. • Lead problem-solving initiatives and champion continuous improvement efforts for media and collaterals. • Standardize manufacturing qualification practices and quality systems while managing technical risks in alignment with product milestones and supplier delivery schedules. • Serve as a subject matter expert, providing technical consultation to internal teams and external partners on media and collateral solutions. As a Successful Candidate, You Will Bring: • Collaborative mindset – You thrive in cross-functional team environments and build strong relationships with colleagues, suppliers, and partners. • Analytical thinking – You approach complex problems with a structured, data-driven mindset and a passion for finding root causes. • Effective communication – You can clearly articulate technical concepts to both technical and non-technical audiences, both verbally and in writing. • Adaptability – You are comfortable navigating ambiguity and shifting priorities in a fast-paced, innovation-driven environment. • Attention to detail – You take pride in precision and thoroughness, ensuring quality and accuracy in everything you do. • Initiative & ownership – You proactively identify opportunities for improvement and take ownership of outcomes from start to finish. • Resilience – You remain focused and solution-oriented when faced with challenges or setbacks. Are you ready to make your mark on the future of semiconductor packaging? Join Intel's team of world-class innovators in Arizona and help redefine what's possible in next-generation packaging technologies. Apply today and take th