Jobs / United States / General Motors Company
Power Electronics Hardware Design Lead
General Motors Company · 🇺🇸 Warren, Michigan, United States of America
Sponsorship verdict
Sponsorship possible
One solid signal, not two — worth applying, and worth asking about sponsorship early.
- Employer is on a government sponsor recordThe US Department of Labor certified 606 H-1B/E-3 labor condition applications for this employer between Oct 2025 and Jun 2026 (latest Jun 2026) — the step every H-1B hire needs first. USCIS also records 267 H-1B approvals in FY2023. Source: LCA disclosure data (US Department of Labor (OFLC)).
- The posting doesn’t mention sponsorshipSilence isn’t a refusal — ask the recruiter before investing much time.
- No salary bar for this routeH-1B has no fixed salary bar: the employer must pay at least the prevailing wage for the role and area. Cap-subject employers enter a lottery weighted by wage level. Source: https://www.federalregister.gov/documents/2025/12/29/2025-23853/weighted-selection-process-for-registrants-and-petitioners-seeking-to-file-cap-subject-h-1b, rules effective 2026-02-27.
- What General Motors Company paid sponsored hires in similar roles3 certified filings for “Senior Hardware Design Engineer” (Computer Hardware Engineers) in MI: $150k–$165k, median $160k. Most were filed at wage level IV (100%) — 4 lottery entries, ≈61% projected selection odds for cap-subject employers. Source: US Department of Labor LCA disclosure data (Oct 2025 – Jun 2026).
- Confirmed live todayWhen a source last listed this job as open.
US H-1B: cap-subject employers enter a lottery weighted by wage level — Level I gets 1 entry, Level IV gets 4 (DHS projected selection odds ≈15% at Level I to ≈61% at Level IV). Universities and non-profit research employers are cap-exempt. The $100,000 fee for new petitions from abroad is currently blocked by a court order (appeal pending).
A verdict summarises public evidence; it is not legal advice and never a guarantee — the employer and the immigration authority decide. Sign in to factor in where you can already work.
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Sponsor Radar — General Motors Company
The US Department of Labor certified 606 H-1B/E-3 labor condition applications for this employer between Oct 2025 and Jun 2026 (latest Jun 2026) — the step every H-1B hire needs first. USCIS also records 267 H-1B approvals in FY2023. Source: LCA disclosure data (US Department of Labor (OFLC)).
Past sponsorship or register membership never guarantees sponsorship for this vacancy or for you. Full Sponsor Radar for General Motors Company →
About the role
Job Description General Motors is seeking a Power Electronics Hardware Design Lead for the development and release of high-voltage power electronics including DC-DC converters, inverters and on-board chargers, and related energy-conversion hardware for electrified vehicle programs. This is a hands-on technical leadership role responsible for receiving and translating system requirements, planning the design and verification approach, executing the hardware development, and personally contributing to the design and release of high-voltage power-electronics hardware. The successful candidate will apply advanced knowledge of power electronics and own design decisions from architecture and topology selection through validation, production, and launch support—balancing efficiency, power density, thermal performance, EMC, reliability, cost, manufacturability, and timing. The Hardware Design Lead will influence architecture and design decisions, develop practical mitigation strategies, lead root-cause investigations, and partner with internal engineering teams, suppliers, test organizations, and program leadership. Role Responsibilities · Receive and interpret system requirements, allocate them to hardware functions and interfaces, and translate them into verifiable automotive-grade high-voltage power converter solutions. · Define converter architecture, topology, operating modes, control and protection strategies, communication interfaces, diagnostics and key electrical requirements. · Drive best in class design solution from concept through release by sequencing technical activities, assigning ownership, removing technical blockers, and making timely engineering trade-off decisions. · Perform electrical, thermal, and magnetic analyses. Perform worst-case analyses across normal and fault conditions assessing stresses, losses, margins, tolerances, parasitics and derating. · Correlate analytical predictions and simulations with bench and vehicle test data · Lead design of power stage, magnetics, power switches, gate drives, sensing, capacitors, filters, connectors, cooling interfaces, and high-voltage PCB layout. · Make layout and packaging decisions covering stack-up, current paths, power loops, creepage and clearance, grounding, parasitics, thermal paths, signal integrity, and manufacturability. · Lead hardware design reviews in accordance with GM standard process, including design description, worst-case analysis (WCA) through Monte Carlo, EVA or other approved methods, and verifying through measurements. · Lead reliability and lifetime analysis using mission profiles, electrical and thermal loading, component derating, aging mechanisms, and accelerated-life testing. · Own assigned hardware throughout product lifecycle, from requirements definition and schematic development through design review, release, validation, production readiness, and launch; provide authoritative technical direction and resolution for design-related questions and issues. · Lead DFMEA, DRBFM, FMEDA, and DFA to identify failure modes, design risks, and mitigation actions according to ISO 26262:2018 · Lead system-level interaction analyses to assess interfaces among power electronics, controls, mechanical, thermal, and vehicle systems. · Supervise and provide technical direction for design-for-reliability, design-for-manufacturing, and design-risk reduction activities. · Collaborate cross-functionally with controls, mechanical, thermal, systems, validation manufacturing, supplier, and program-management teams to align requirements, interfaces, technical decisions, timing and risk mitigation through the product lifecycle. · Direct supplier technical execution, including architecture, component selection, simulations, design evidence, test plans,