Jobs / Ireland / Intel Corporation
Device Engineer
Intel Corporation · 🌍 Ireland, Leixlip
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Sponsor Radar — Intel Corporation
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About the role
Job Details: Job Description: Intel Ireland Device Engineering team (Yield department) is looking for Device Engineering talents (reporting to manger of Device team) to join our advanced technology Fab. As a Device Engineer/Senior Device Engineer, you will focus on most advanced FinFETs technology device engineering/development working closely with Integration, Module, yield teams to achieve yield ramp-up, process and device optimization in the high-volume manufacturing Fab, supporting internal and external customers. Device engineers' responsibilities include (but are not limited to): • Drive factory product Power and Performance roadmap and member/leader of the Performance TMI team to ensure the factory products hit customer specifications required, including device targeting, customization, variability improvement etc. • Own engineering projects to execute HVM yield roadmap, device targeting and attain performance targets. • Work with Technology Development team to develop new device technology, customize device architecture per customer request and import to production fabs. • Participate or lead cross-organizational team of engineers to identify root cause of device-related yield/performance issues and define mitigation plan to meet committed production yield/performance targets. • Own NPI (New Product Introduction) in production fab and perform device-related process optimizations to meet foundry customers product specifications and requirements. • Develop a model to predict device performance accurately in early-to-mid stage of Si progression and drive systematic solution to maintain baseline device performance. • Work with Process Integration engineers to drive process simplification and implement cost reduction engineering opportunities in line. • Level of experience will be considered in determining applicants job grade. Qualifications: Candidate should possess the following behavioral skills: Skills Required: • Problem Solving: Demonstrated experience in rapidly analyzing complex process problems and identifying effective solution paths. • Teamwork and Partnership: Strong teamwork skills and the ability to build effective partnerships. • Communication: Excellent written and verbal communication skills, with the ability to summarize and communicate information effectively to influence action at all levels. • Self-Motivation: A motivated self-starter with the ability to work independently as well as collaboratively in a team environment. • Flexibility: Maturity and adaptability in facing uncertainties and changing priorities or responsibilities. • Goal Commitment: Commitment to achieving aggressive goals with a positive, can-do attitude and ability to act with velocity and a strong sense of urgency. Qualifications: Minimum Qualifications: • Relevant Bachelors, Masters and/or a PhD degree in Device physics, Electronics, physics chemistry or related technical field. • 5-10 years' experience in advanced node semiconductor industry in Device or FEOL/BEOL Integration. • 5-10 years' experience in FinFET technology development or high-volume manufacturing. • 5-10 years' experience with Device Physics and hands-on application in real-world fab environment. Preferred Qualifications: • Advanced degree (Master's or Ph.D.) in Electrical Engineering, Physics or Materials Science major. • Experience driving product performance roadmaps working in multi discipline team with Process Engineers, Integration Engineers and Yield Analysis to deliver reliable, cost effective and stable/capable products. • Experience working on process transfers to High Volume Manufacturing Factories, solving complex integrated issues delivering matched yields and product performance. • Demonstrated interpersonal skills