Jobs / United States / General Motors Company
Entry-Level - Compute Platforms & SoC/MCU Semiconductor Systems Researcher
General Motors Company · 🇺🇸 Warren, Michigan, United States of America
Sponsorship verdict
Sponsorship possible
One solid signal, not two — worth applying, and worth asking about sponsorship early.
- Employer is on a government sponsor recordThe US Department of Labor certified 606 H-1B/E-3 labor condition applications for this employer between Oct 2025 and Jun 2026 (latest Jun 2026) — the step every H-1B hire needs first. USCIS also records 267 H-1B approvals in FY2023. Source: LCA disclosure data (US Department of Labor (OFLC)).
- The posting doesn’t mention sponsorshipSilence isn’t a refusal — ask the recruiter before investing much time.
- No salary bar for this routeH-1B has no fixed salary bar: the employer must pay at least the prevailing wage for the role and area. Cap-subject employers enter a lottery weighted by wage level. Source: https://www.federalregister.gov/documents/2025/12/29/2025-23853/weighted-selection-process-for-registrants-and-petitioners-seeking-to-file-cap-subject-h-1b, rules effective 2026-02-27.
- What General Motors Company paid sponsored hires in similar roles3 certified filings for “Researcher” (Materials Engineers) in MI: $114k–$144k, median $135k. Most were filed at wage level IV (67%) — 4 lottery entries, ≈61% projected selection odds for cap-subject employers. Source: US Department of Labor LCA disclosure data (Oct 2025 – Jun 2026).
- Confirmed live todayWhen a source last listed this job as open.
US H-1B: cap-subject employers enter a lottery weighted by wage level — Level I gets 1 entry, Level IV gets 4 (DHS projected selection odds ≈15% at Level I to ≈61% at Level IV). Universities and non-profit research employers are cap-exempt. The $100,000 fee for new petitions from abroad is currently blocked by a court order (appeal pending).
A verdict summarises public evidence; it is not legal advice and never a guarantee — the employer and the immigration authority decide. Sign in to factor in where you can already work.
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Sponsor Radar — General Motors Company
The US Department of Labor certified 606 H-1B/E-3 labor condition applications for this employer between Oct 2025 and Jun 2026 (latest Jun 2026) — the step every H-1B hire needs first. USCIS also records 267 H-1B approvals in FY2023. Source: LCA disclosure data (US Department of Labor (OFLC)).
Past sponsorship or register membership never guarantees sponsorship for this vacancy or for you. Full Sponsor Radar for General Motors Company →
About the role
Job Description The Role: GM R&D invents, evaluates, optimizes, and matures next-generation in-vehicle architectures, compute platforms, and communication systems that enable GM’s vision of the Software Defined Vehicle. We focus on how SoCs, MCUs, memory, networks, and low-level software come together into robust, safe, and cost-effective automotive platforms, spanning deeply embedded ECUs as well as high-performance compute platforms for infotainment and automated driving. Semiconductors and compute platforms , with a focus on SoCs, MCUs, memory subsystems, and associated board-level and platform software technologies for automotive ECUs, infotainment systems, and centralized/automated driving compute platforms. You are expected to define, propose, and develop research projects in alignment with GM R&D’s strategy and priorities, and to clearly define, communicate and demonstrate the value your work creates for GM and our customers. What You’ll Do: • Lead semiconductor-focused research projects that influence GM’s electrical and software architecture roadmaps (central compute, zonal ECUs, domain controllers, edge nodes, infotainment, and automated driving compute platforms). • Design and implement proof-of-concept prototypes on our R&D lab benches , using evaluation platforms and representative in-vehicle architecture benches to validate concepts before transfer to product teams. • Evaluate and benchmark SoCs/MCUs and memory technologies (CPU cores, accelerators, interconnects, DDR/LPDDR, flash, NVM, cache hierarchies) for latency, throughput, power, cost, and safety/security trade-offs. • Explore and prototype new compute and communication concepts using FPGAs, evaluation boards, and custom circuitry to de-risk new architectures and features (e.g., real-time safety-critical functions, mixed‑criticality workloads). • Contribute to ECU and board-level design concepts , working with internal teams and suppliers on power, clocks, reset, high-speed interfaces (PCIe, Ethernet, DDR), and bring-up strategies. • Drive low-level software concepts around boot flows, board support packages (BSPs), bare-metal or RTOS-based implementations, device drivers, and hardware abstraction needed for SDV architectures. • Collaborate closely with GM engineering, purchasing, and suppliers to align semiconductor choices with GM’s long-term architecture, safety, cybersecurity, and cost objectives. • Seek out and aggressively pursue technology insertion opportunities at GM , working with product engineering and program teams to move successful research outcomes into production programs, pilots, or platform roadmaps. • Publish and protect IP through internal reports, patents, and external publications where appropriate, and represent GM R&D at key technical conferences and workshops. Required Qualifications: • Pursuit/completion of an advanced degree (Masters or PhD) degree in one of the following areas: Computer Engineering, Computer Science, Electrical Engineering, or related field • Must be graduating between August 2026 - June 2027 • Able to work fulltime, 40 hours per week • Relevant research experience in semiconductors, SoC/MCU architecture, or embedded compute platforms. • Understanding of modern SoCs/MCUs, including: • CPU cores (e.g., Arm, RISC‑V), memory hierarchies, interconnects, and on-chip peripherals. • High-speed interfaces (e.g., PCIe, Ethernet, SerDes, DDR/LPDDR, GDDR, NVMe). · • Knowledge of automotive communication protocols (e.g., Ethernet, Time Sensitive Networking Standards, CAN, LIN, PCIe-based architectures, SOME/IP) and in-vehicle networks. • Hands-on experience in the use of oscilloscopes, logic analyzers, and JTAG for board bring-up and debug. • Experience with ECU or embedded syst