Jobs / United States / Intel Corporation
Module Engineering - Day Shift 5 or 7
Intel Corporation · 🇺🇸 US, Arizona, Phoenix
Sponsorship verdict
Posting rules out sponsorship
The posting rules out sponsorship or requires citizenship/clearance.
- Employer is on a government sponsor recordThe US Department of Labor certified 1,731 H-1B/E-3 labor condition applications for this employer between Oct 2025 and Jun 2026 (latest Jun 2026) — the step every H-1B hire needs first. USCIS also records 1,112 H-1B approvals in FY2023. Source: LCA disclosure data (US Department of Labor (OFLC)).
- The posting doesn’t mention sponsorshipSilence isn’t a refusal — ask the recruiter before investing much time.
- No salary bar for this routeH-1B has no fixed salary bar: the employer must pay at least the prevailing wage for the role and area. Cap-subject employers enter a lottery weighted by wage level. Source: https://www.federalregister.gov/documents/2025/12/29/2025-23853/weighted-selection-process-for-registrants-and-petitioners-seeking-to-file-cap-subject-h-1b, rules effective 2026-02-27.
- What Intel Corporation paid sponsored hires in similar roles9 certified filings for “Engineering Manager” (Architectural and Engineering Managers) in AZ: $163k–$233k, median $198k. Most were filed at wage level II (33%) — 2 lottery entries, ≈31% projected selection odds for cap-subject employers. Source: US Department of Labor LCA disclosure data (Oct 2025 – Jun 2026).
- Citizenship requirement statedFrom the posting’s own wording.
- Confirmed live todayWhen a source last listed this job as open.
US H-1B: cap-subject employers enter a lottery weighted by wage level — Level I gets 1 entry, Level IV gets 4 (DHS projected selection odds ≈15% at Level I to ≈61% at Level IV). Universities and non-profit research employers are cap-exempt. The $100,000 fee for new petitions from abroad is currently blocked by a court order (appeal pending).
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Why not apply?
Citizenship requirement stated — the posting’s wording suggests candidates who already hold work rights. Read the original listing carefully.
SponsorApply flags time-wasters so your applications go where they can land. These come from the posting's own wording — read the original listing to confirm. See better-fit alternatives →
Sponsor Radar — Intel Corporation
The US Department of Labor certified 1,731 H-1B/E-3 labor condition applications for this employer between Oct 2025 and Jun 2026 (latest Jun 2026) — the step every H-1B hire needs first. USCIS also records 1,112 H-1B approvals in FY2023. Source: LCA disclosure data (US Department of Labor (OFLC)).
Past sponsorship or register membership never guarantees sponsorship for this vacancy or for you. Full Sponsor Radar for Intel Corporation →
About the role
Job Details: Job Description: Shift 5: (Day shift compressed work week) 6 AM-6 PM (Sunday-Tuesday and alternating Wednesdays). Shift 7: (Day shift compressed work week) 6 AM-6 PM (Thursday-Saturday and alternating Wednesdays). About the Role Join Intel's Foundry Technology Manufacturing business unit and play a key role in shaping the future of semiconductor packaging. As a Module Engineer, you will develop and optimize assembly processes and equipment, applying innovative concepts to enable Intel's next-generation foundry packaging platform technologies. You will work at the intersection of engineering, manufacturing, and technology development to deliver world-class packaging solutions for our foundry customers. What You Will Do • Design and develop assembly processes and equipment, applying novel engineering concepts to advance Intel's foundry packaging roadmap and platform technologies. • Optimize manufacturing efficiency for foundry packages, developing processes that meet rigorous quality, reliability, cost, yield, productivity, and manufacturability requirements specific to foundry customer needs. • Define process and equipment specifications using Design of Experiments (DOE) and data analysis principles, documenting innovations and improvements through technical white papers. • Develop and maintain equipment used to evaluate silicon and package technologies under simulated field conditions, including thermal cycling, heat, humidity, and dynamic mechanical stress testing. • Ensure physical package designs are manufacturable within foundry process flows, and oversee the full cycle of package manufacturing processes, procedures, and production flows. • Establish material specifications for contract assemblers and raw material vendors, partnering closely with supplier quality and procurement teams to enforce process compliance and vendor performance standards. • Create new reliability screening techniques, acceleration methods, and quality tools to enable early detection of potential packaging quality and reliability risks within the foundry manufacturing environment. • Define reliability requirements aligned to foundry customer needs, and influence design decisions, material selection, and process development based on a fundamental understanding of failure mechanisms. • Lead continuous improvement initiatives using statistical methods and experimental design to innovate, troubleshoot, and enhance equipment and process performance. • Serve as a technical resource for foundry packaging challenges, responding to customer and partner requests and providing consultation on process improvements. • Drive standardization across product qualification frameworks, manufacturing quality systems, and methodologies, while actively engaging with packaging technology development and partner engineering teams to assess process maturity and mitigate risks to key product milestones. Qualifications: The Minimum qualifications are required to be initially considered for this position. Minimum qualifications listed below would be obtained through a combination of industry relevant job experience, internship experience and / or schoolwork/classes/research. The preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. Minimum Qualifications • US Citizenship required. • Bachelor's degree with 1+ years of experiencein one of the following fields: Mechanical Engineering, Materials Science Engineering, Chemical Engineering, Electrical Engineering, or in a STEM related field of study. -OR- • Master's degreein Mechanical Engineering, Materials Science Engineering, Chemical Engineering, Electrical Engineering, or in a STEM related field of study. • 6+ months of