Jobs / United States / Intel Corporation
Module Engineering - PhD Intern (Advanced Wet Etch and Cleans)
Intel Corporation · 🇺🇸 US, Oregon, Hillsboro
Sponsorship verdict
Sponsorship possible
One solid signal, not two — worth applying, and worth asking about sponsorship early.
- Employer is on a government sponsor recordThe US Department of Labor certified 1,731 H-1B/E-3 labor condition applications for this employer between Oct 2025 and Jun 2026 (latest Jun 2026) — the step every H-1B hire needs first. USCIS also records 1,112 H-1B approvals in FY2023. Source: LCA disclosure data (US Department of Labor (OFLC)).
- The posting doesn’t mention sponsorshipSilence isn’t a refusal — ask the recruiter before investing much time.
- No salary bar for this routeH-1B has no fixed salary bar: the employer must pay at least the prevailing wage for the role and area. Cap-subject employers enter a lottery weighted by wage level. Source: https://www.federalregister.gov/documents/2025/12/29/2025-23853/weighted-selection-process-for-registrants-and-petitioners-seeking-to-file-cap-subject-h-1b, rules effective 2026-02-27.
- What Intel Corporation paid sponsored hires in similar roles50 certified filings for “Engineering Manager” (Architectural and Engineering Managers) in OR: $182k–$209k, median $182k. Most were filed at wage level III (52%) — 3 lottery entries, ≈46% projected selection odds for cap-subject employers. Source: US Department of Labor LCA disclosure data (Oct 2025 – Jun 2026).
- Confirmed live todayWhen a source last listed this job as open.
US H-1B: cap-subject employers enter a lottery weighted by wage level — Level I gets 1 entry, Level IV gets 4 (DHS projected selection odds ≈15% at Level I to ≈61% at Level IV). Universities and non-profit research employers are cap-exempt. The $100,000 fee for new petitions from abroad is currently blocked by a court order (appeal pending).
A verdict summarises public evidence; it is not legal advice and never a guarantee — the employer and the immigration authority decide. Sign in to factor in where you can already work.
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Sponsor Radar — Intel Corporation
The US Department of Labor certified 1,731 H-1B/E-3 labor condition applications for this employer between Oct 2025 and Jun 2026 (latest Jun 2026) — the step every H-1B hire needs first. USCIS also records 1,112 H-1B approvals in FY2023. Source: LCA disclosure data (US Department of Labor (OFLC)).
Past sponsorship or register membership never guarantees sponsorship for this vacancy or for you. Full Sponsor Radar for Intel Corporation →
About the role
Job Details: Job Description: The Role and Impact As a Module Engineering PhD Intern, you will contribute to the development and optimization of semiconductor manufacturing processes for a specific module. You will engage in sustaining and improving manufacturing equipment performance, troubleshooting issues, and supporting qualification activities. This internship offers an excellent opportunity to apply your academic research to practical engineering challenges, gain hands-on experience, and explore your future career potential in a fast-paced, innovation-driven environment. Business group Intel Foundry is dedicated to advancing semiconductor manufacturing technologies and delivering innovative solutions that meet the needs of customers worldwide. As a part of this organization, you will join a team focused on optimizing manufacturing processes, sustaining equipment performance, and driving production excellence, while contributing to Intel's broader mission of technological leadership. Key Responsibilities • Support the development and optimization of semiconductor manufacturing processes for a specific module. • Sustain and improve manufacturing equipment performance to ensure operational reliability and efficiency. • Assist in troubleshooting equipment issues and performing qualification activities to meet production standards. • Collaborate with engineering teams to refine process control methodologies and achieve production goals. • Apply advanced statistical analysis and experimental design to improve process reliability and throughput. • Gain hands-on experience with materials and device characterization techniques, including SEM and TEM. • Contribute to continuous improvement initiatives for process control systems and methodologies. Qualifications: Minimum Qualifications • Must be actively pursuing a PhD degree in Materials Science Engineering, Physics, Chemistry, Electrochemistry or Chemical Engineering • 3+ months of educational, research, laboratory, internship, or industry experience. • Demonstrated hands-on experience through academic research, laboratory work, internships, coursework, or technical projects. • Basic understanding of semiconductor manufacturing processes, process integration, or advanced manufacturing methodologies. Preferred Qualifications • Experience with data analysis, statistical methods, and process optimization techniques. • Strong academic performance with a cumulative GPA of 3.0 or higher preferred. • Demonstrated deep expertise in chemical reaction kinetics, selective wet etching, interfacial surface chemistry, corrosion/passivation mechanisms, or surfactant-assisted cleaning/drying mechanisms (e.g., Marangoni drying, supercritical CO2). • Hands-on experience with advanced thin-film, surface, and chemical characterization techniques (e.g., Ellipsometry, AFM, SEM/TEM, XPS, contact angle goniometry, FTIR, TXRF, or ICP-MS). • Experience with automated fluidic systems, wet processing instrumentation design, single-wafer spin hardware, or experimental fluid dynamics/mass-transfer troubleshooting. • Demonstrated experience utilizing Python, MATLAB, JMP, or Machine Learning for design of experiments (DOE), multivariate statistical analysis, or process automation. • Strong publication record, conference presentations, or filed patent applications demonstrating systematic problem-solving in experimental chemical and materials science. Take the next step in your career journey by joining a collaborative, innovative team where your contributions will help shape the future of semiconductor technology. Job Type: Student / Intern Shift: Shift 1 (United States of America) Primary Location: US, Oregon, Hillsboro Additional Locations: Posting Statement: All qu