Jobs / United States / Intel Corporation
Module Development Engineer
Intel Corporation · 🇺🇸 US, Oregon, Hillsboro
Sponsorship verdict
Sponsorship possible
One solid signal, not two — worth applying, and worth asking about sponsorship early.
- Employer is on a government sponsor recordThe US Department of Labor certified 1,731 H-1B/E-3 labor condition applications for this employer between Oct 2025 and Jun 2026 (latest Jun 2026) — the step every H-1B hire needs first. USCIS also records 1,112 H-1B approvals in FY2023. Source: LCA disclosure data (US Department of Labor (OFLC)).
- The posting doesn’t mention sponsorshipSilence isn’t a refusal — ask the recruiter before investing much time.
- No salary bar for this routeH-1B has no fixed salary bar: the employer must pay at least the prevailing wage for the role and area. Cap-subject employers enter a lottery weighted by wage level. Source: https://www.federalregister.gov/documents/2025/12/29/2025-23853/weighted-selection-process-for-registrants-and-petitioners-seeking-to-file-cap-subject-h-1b, rules effective 2026-02-27.
- What Intel Corporation paid sponsored hires in similar roles287 certified filings for “Process Engineer” (Materials Engineers) in OR: $113k–$133k, median $133k. Most were filed at wage level III (87%) — 3 lottery entries, ≈46% projected selection odds for cap-subject employers. Source: US Department of Labor LCA disclosure data (Oct 2025 – Jun 2026).
- Confirmed live todayWhen a source last listed this job as open.
US H-1B: cap-subject employers enter a lottery weighted by wage level — Level I gets 1 entry, Level IV gets 4 (DHS projected selection odds ≈15% at Level I to ≈61% at Level IV). Universities and non-profit research employers are cap-exempt. The $100,000 fee for new petitions from abroad is currently blocked by a court order (appeal pending).
A verdict summarises public evidence; it is not legal advice and never a guarantee — the employer and the immigration authority decide. Sign in to factor in where you can already work.
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Sponsor Radar — Intel Corporation
The US Department of Labor certified 1,731 H-1B/E-3 labor condition applications for this employer between Oct 2025 and Jun 2026 (latest Jun 2026) — the step every H-1B hire needs first. USCIS also records 1,112 H-1B approvals in FY2023. Source: LCA disclosure data (US Department of Labor (OFLC)).
Past sponsorship or register membership never guarantees sponsorship for this vacancy or for you. Full Sponsor Radar for Intel Corporation →
About the role
Job Details: Job Description: As a Module Development Engineer, you will be at the forefront of Intel's semiconductor manufacturing innovation, driving the design and development of advanced manufacturing processes and enabling technologies. Your contributions will shape Intel's ability to deliver cutting-edge devices, enhance production efficiency, and influence the future of semiconductor technology. In this role, you will collaborate with world-class teams and industry-leading suppliers to pioneer materials, equipment, and process integration strategies that push the boundaries of technological possibilities. By joining Intel, you will have the opportunity to make a profound impact on our technology roadmap and help maintain Intel's leadership in a dynamic and competitive marketplace. Key Responsibilities: • Develop and optimize advanced manufacturing processes including material selection, parameter adjustments, equipment metrology, and system design • Conduct feasibility studies and pathfinding activities to support innovative device architectures and manufacturing roadmaps • Design and implement modifications to operating equipment to improve efficiency and production output • Collaborate with equipment and material suppliers to establish enabling technology solutions and integrate them into manufacturing processes • Perform process technology feasibility studies using theoretical simulations and practical engineering methods • Stay informed on industry trends and technological advancements to align manufacturing processes with evolving semiconductor needs • Drive the development of cost-sensitive technology roadmaps in partnership with vendors and internal stakeholders Qualifications: Qualifications Minimum qualifications are required to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. Requirements listed would be obtained through a combination of industry relevant job experience, internship experiences and or schoolwork/classes/research. Minimum Qualifications: • PhD in a STEM discipline such as Electrical Engineering, Materials Science, Applied Physics, Chemical Engineering, Chemistry, or a closely related field with at least 6+ months relevant experience Relevant experience includes, but is not limited to: • Fundamental knowledge of plasma physics, surface reactions, thin film processes, and semiconductor materials • Experience with experimental design, data collection, and statistical analysis • Ability to analyze process results and clearly document findings in technical reports and presentations • Strong problem solving skills and ability to work independently while collaborating in cross functional teams • Effective written and verbal communication skills in a technical environment • Willingness to work in a fab or lab environment and follow strict safety and contamination control protocols Preferred Qualifications: • PhD research focus specifically related to plasma etch, pattern transfer, or advanced logic/memory process integration • Hands on experience with production or pilot line dry etch tools (e.g., Lam, Applied Materials, TEL, ASM, Hitachi) • Knowledge of advanced node challenges such as high aspect ratio etching, CD control, etch selectivity, and damage mitigation • Experience with Design of Experiments (DOE) and statistical process control (SPC) • Familiarity with process integration, yield learning, or technology development methodologies • Programming or scripting experience for data analysis or automation (e.g., Python, MATLAB, JMP, or similar tools) • Exposure to foundry or industrial semiconductor Research and Development environments through intern