Jobs / United States / Intel Corporation
Module Engineer PhD Intern New 2027
Intel Corporation · 🇺🇸 US, Oregon, Hillsboro
Sponsorship verdict
Sponsorship possible
One solid signal, not two — worth applying, and worth asking about sponsorship early.
- Employer is on a government sponsor recordThe US Department of Labor certified 1,731 H-1B/E-3 labor condition applications for this employer between Oct 2025 and Jun 2026 (latest Jun 2026) — the step every H-1B hire needs first. USCIS also records 1,112 H-1B approvals in FY2023. Source: LCA disclosure data (US Department of Labor (OFLC)).
- The posting doesn’t mention sponsorshipSilence isn’t a refusal — ask the recruiter before investing much time.
- No salary bar for this routeH-1B has no fixed salary bar: the employer must pay at least the prevailing wage for the role and area. Cap-subject employers enter a lottery weighted by wage level. Source: https://www.federalregister.gov/documents/2025/12/29/2025-23853/weighted-selection-process-for-registrants-and-petitioners-seeking-to-file-cap-subject-h-1b, rules effective 2026-02-27.
- What Intel Corporation paid sponsored hires in similar roles287 certified filings for “Process Engineer” (Materials Engineers) in OR: $113k–$133k, median $133k. Most were filed at wage level III (87%) — 3 lottery entries, ≈46% projected selection odds for cap-subject employers. Source: US Department of Labor LCA disclosure data (Oct 2025 – Jun 2026).
- Confirmed live todayWhen a source last listed this job as open.
US H-1B: cap-subject employers enter a lottery weighted by wage level — Level I gets 1 entry, Level IV gets 4 (DHS projected selection odds ≈15% at Level I to ≈61% at Level IV). Universities and non-profit research employers are cap-exempt. The $100,000 fee for new petitions from abroad is currently blocked by a court order (appeal pending).
A verdict summarises public evidence; it is not legal advice and never a guarantee — the employer and the immigration authority decide. Sign in to factor in where you can already work.
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Sponsor Radar — Intel Corporation
The US Department of Labor certified 1,731 H-1B/E-3 labor condition applications for this employer between Oct 2025 and Jun 2026 (latest Jun 2026) — the step every H-1B hire needs first. USCIS also records 1,112 H-1B approvals in FY2023. Source: LCA disclosure data (US Department of Labor (OFLC)).
Past sponsorship or register membership never guarantees sponsorship for this vacancy or for you. Full Sponsor Radar for Intel Corporation →
About the role
Job Details: Job Description: The Role and Impact As a Module Engineering PhD Intern, you will actively contribute to the development and optimization of manufacturing processes for a specific module in semiconductor production. Your daily activities will include sustaining and improving manufacturing equipment performance, assisting in troubleshooting issues, and supporting qualification efforts. This hands-on internship offers an exciting opportunity to apply your academic knowledge, gain practical skills, and explore future career possibilities in a dynamic and innovation-driven environment. Business group Intel Foundry is dedicated to advancing semiconductor manufacturing technologies and delivering cutting-edge solutions to meet customer needs worldwide. As part of this organization, you will join a team focused on optimizing manufacturing processes and sustaining high-performance equipment, contributing to Intel's broader mission of driving technological excellence and innovation in semiconductor production. Key Responsibilities - Support the development and optimization of semiconductor manufacturing processes for a specific module. - Sustain and improve manufacturing equipment performance to ensure operational efficiency and reliability. - Assist in equipment troubleshooting, maintenance, and qualification activities to meet production standards. - Collaborate with engineering teams to enhance process control methodologies and achieve production goals. - Apply statistical analysis and experimental design techniques to improve process reliability and throughput. - Gain hands-on experience with materials and device characterization techniques, such as SEM and TEM. - Contribute to continuous improvement initiatives for process control systems and methodologies. Qualifications: You must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum qualifications and are considered a plus factor in identifying top candidates. Experience listed below would be obtained through a combination of your schoolwork, classes, research, relevant previous job, and/or internship experiences. Minimum Qualifications -Currently pursuing a PhD degree in Physics, Chemical Engineering, Materials Science, Electrical Engineering, or a semiconductor related STEM field. -Experience in Plasma etch (ICP/RIE/ALED/DRIE/CCP), cleanroom and fabrication experience and process development and optimization. -Experience in materials and device characterization techniques, including SEM, TEM, CD SEM, AFM, XPS, SIMS. -Knowledge in Large data statistical analysis or Machine Learning with focus on process optimizations, APC and variability reduction. Preferred Qualifications -Understanding of JMP, Python, or MATLAB to drive data-based decisions in process optimization and matching. -Prior internship at semiconductor manufacturing and foundry companies or equipment suppliers. -GPA 3.0 or higher. If you're ready to advance your expertise in semiconductor manufacturing, collaborate in a supportive environment, and contribute to innovative solutions that shape the future of technology, we encourage you to apply today. Job Type: Student / Intern Shift: Shift 1 (United States of America) Primary Location: US, Oregon, Hillsboro Additional Locations: Posting Statement: All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law,