Jobs / United States / Western Digital Technologies INC

Western Digital Technologies INC

Probe Process Engineer

Fremont, CA, US Posted 21 days ago

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Sponsorship verdict

Sponsorship possible

One solid signal, not two. Worth applying, and worth asking about sponsorship early.

  • Employer is on a government sponsor recordThe US Department of Labor certified 176 H-1B/E-3 labor condition applications for this employer between Oct 2025 and Jun 2026 (latest Jun 2026) — the step every H-1B hire needs first.
  • The posting doesn’t mention sponsorshipSilence isn’t a refusal — ask the recruiter before investing much time.
  • No salary bar for this routeH-1B has no fixed salary bar: the employer must pay at least the prevailing wage for the role and area.
  • What Western Digital Technologies INC paid sponsored hires in similar roles2 certified filings for “Staff Engineer, Process Engineering” (Chemical Engineers) in CA: $148k–$148k, median $148k.
  • Confirmed live todayWhen a source last listed this job as open.
Details and sources
Employer is on a government sponsor record
The US Department of Labor certified 176 H-1B/E-3 labor condition applications for this employer between Oct 2025 and Jun 2026 (latest Jun 2026) — the step every H-1B hire needs first. Source: LCA disclosure data (US Department of Labor (OFLC)).
No salary bar for this route
H-1B has no fixed salary bar: the employer must pay at least the prevailing wage for the role and area. Cap-subject employers enter a lottery weighted by wage level. Source: https://www.federalregister.gov/documents/2025/12/29/2025-23853/weighted-selection-process-for-registrants-and-petitioners-seeking-to-file-cap-subject-h-1b, rules effective 2026-02-27.
What Western Digital Technologies INC paid sponsored hires in similar roles
2 certified filings for “Staff Engineer, Process Engineering” (Chemical Engineers) in CA: $148k–$148k, median $148k. Source: US Department of Labor LCA disclosure data (Oct 2025 – Jun 2026).

US H-1B: cap-subject employers enter a lottery weighted by wage level — Level I gets 1 entry, Level IV gets 4 (DHS projected selection odds ≈15% at Level I to ≈61% at Level IV). Universities and non-profit research employers are cap-exempt. The $100,000 fee for new petitions from abroad is currently blocked by a court order (appeal pending).

A verdict summarises public evidence. It is not legal advice and never a guarantee: the employer and the immigration authority decide. Sign in to factor in where you can already work.

About the role

The Process Engineer will support wafer probe operations for both product development and high-volume manufacturing environments. This role is responsible for developing, sustaining, and optimizing wafer probe processes, test methodologies, SPC systems, probe card configurations, and test setup infrastructure. The engineer will work closely with Test Engineering, Product Development, Yield Engineering, Manufacturing, and Operations teams to ensure robust process control, measurement integrity, and successful new product introductions.    Essential Duties and Responsibilities: • Develop, qualify, and sustain wafer probe processes for new and existing products, including probe recipes, operating specifications, setup requirements, and engineering controls across both product development and high-volume manufacturing environments. • Define, validate, and maintain probe card configurations and wafer test setups, supporting qualifications, releases, maintenance strategies, and change management to ensure test readiness for engineering builds, qualifications, and production ramps. • Monitor and optimize process performance using SPC, EDC, and statistical analysis; develop and maintain control limits, OCAPs, screening methodologies, and engineering dashboards to ensure measurement integrity and data accuracy. • Investigate process excursions and implement data-driven corrective actions through characterization studies, gauge capability evaluations, and tool correlation analyses to improve yield, quality, and cycle time. • Lead wafer probe readiness for New Product Introductions (NPI), defining product-specific test plans, specifications, and qualification strategies while coordinating cross-functional activities to ensure seamless transfer from development to high-volume manufacturing. • Drive continuous improvement initiatives targeting yield enhancement, cycle time reduction, productivity gains, process simplification, measurement system improvements, and equipment utilization optimization. • Partner with Test Engineering, Product Engineering, Yield Engineering, Manufacturing, Operations, Quality, and IT teams to provide technical leadership in root cause analysis, corrective action implementation, engineering reviews, and documentation of best practices and knowledge transfer materials. • BS/MS in Electrical Engineering, Materials Science, Chemical Engineering, Physics, Mechanical Engineering, or related discipline. • Experience in  semiconductor manufacturing, wafer probe engineering, or test engineering. • Demonstrated proficiency in electrical measurement techniques with hands-on experience in laboratory and cleanroom environments. • Strong understanding of statistical process control (SPC), design of experiments (DOE), and semiconductor test methodologies. • Proficiency with data analysis tools such as SQL, Python, JMP, Minitab, or equivalent platforms. • Demonstrated knowledge of measurement system analysis (MSA), gauge R&R, and process capability studies. • Proven experience with yield optimization, maintenance protocols, and failure analysis. • Track record of driving process improvements through automation, machine learning, or AI-based initiatives. • Exceptional troubleshooting and root-cause analysis capabilities. • Strong communication and cross-functional collaboration skills with manufacturing, design, and quality teams. WD is committed to providing equal opportunities to all applicants and employees and will not discriminate against any applicant or employee based on their race, color, ancestry, religion (including religious dress and grooming standards), sex (including pregnancy, childbirth or related medical conditions, breastfeeding or related medical conditions), gender (including a person’s gender

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