Jobs / United States / Renesas Electronics America INC
(Sr.) Staff Package Design Engineer - MIS substrate/FC expose die (Experienced in Power or Gan is requried)
Renesas Electronics America INC · 🇺🇸 Kaohsiung, Kaohsiung City, TW
Sponsorship verdict
Sponsorship possible
One solid signal, not two — worth applying, and worth asking about sponsorship early.
- Employer is on a government sponsor recordThe US Department of Labor certified 56 H-1B/E-3 labor condition applications for this employer between Oct 2025 and Jun 2026 (latest Jun 2026) — the step every H-1B hire needs first. USCIS also records 18 H-1B approvals in FY2023. Source: LCA disclosure data (US Department of Labor (OFLC)).
- The posting doesn’t mention sponsorshipSilence isn’t a refusal — ask the recruiter before investing much time.
- No salary bar for this routeH-1B has no fixed salary bar: the employer must pay at least the prevailing wage for the role and area. Cap-subject employers enter a lottery weighted by wage level. Source: https://www.federalregister.gov/documents/2025/12/29/2025-23853/weighted-selection-process-for-registrants-and-petitioners-seeking-to-file-cap-subject-h-1b, rules effective 2026-02-27.
- What Renesas Electronics America INC paid sponsored hires in similar roles6 certified filings for “Sr. Staff Application Engineer” (Electronics Engineers, Except Computer) in TX: $132k–$180k, median $167k. Most were filed at wage level IV (67%) — 4 lottery entries, ≈61% projected selection odds for cap-subject employers. Source: US Department of Labor LCA disclosure data (Oct 2025 – Jun 2026).
- Confirmed live todayWhen a source last listed this job as open.
US H-1B: cap-subject employers enter a lottery weighted by wage level — Level I gets 1 entry, Level IV gets 4 (DHS projected selection odds ≈15% at Level I to ≈61% at Level IV). Universities and non-profit research employers are cap-exempt. The $100,000 fee for new petitions from abroad is currently blocked by a court order (appeal pending).
A verdict summarises public evidence; it is not legal advice and never a guarantee — the employer and the immigration authority decide. Sign in to factor in where you can already work.
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Sponsor Radar — Renesas Electronics America INC
The US Department of Labor certified 56 H-1B/E-3 labor condition applications for this employer between Oct 2025 and Jun 2026 (latest Jun 2026) — the step every H-1B hire needs first. USCIS also records 18 H-1B approvals in FY2023. Source: LCA disclosure data (US Department of Labor (OFLC)).
Past sponsorship or register membership never guarantees sponsorship for this vacancy or for you. Full Sponsor Radar for Renesas Electronics America INC →
About the role
Job Summary • Design and develop package and interconnect methods for Renesas’s packaging needs in the areas of Power SiP/modules, wafer level, flip-chip, multi-chip module and power device packaging, GaN related PKG is a plus. • Package technologies qualification for consumer & industrial power as well as automotive power applications. Key Responsibilities • Benchmark, select and qualify suitable materials, processes and assembly subcontractors (OSAT) or contract manufacturers (CM). • Work with OSAT/CM to develop, run DOE to optimize processes, establish process spec & monitor and resolve process issues early in the production to ensure only parts with superior quality shipped to customer. • Work with Product groups and Reliability team, qualify new packages and processes within required time frame & further address internal and external customer complains working with peers of Marketing, Product groups, Quality and Operations organization to satisfy growth in businesses. • Ensure smooth transition into production & implement ramp up monitor. • Participate in packaging roadmap development & focus on execution, develop and maintain technical expertise on advances and innovations in power SiP/modules, wafer level packaging, flip chip interconnects and panel level package. • Establish & maintain package design rules. • Doctorate/Masters / Bachelor’s degree in Physics, Chemistry, Mechanical, Electrical or Materials Engineering. • >10 years of relevant experience in package development emphasizing power SiP/module, wafer level & flip-chip packaging. • Strong understanding of power SiP/modules, wafer level/flip-chip packaging methods, assembly process knowledge, qualification methods, SPC and statistical analysis software. • Strong interpersonal and communication skills. • Strong analytical and presentation skills. • Knowledge of wire-bonding & multi-chip module technologies is a plus. Renesas is an embedded semiconductor solution provider driven by its Purpose, To Make Our Lives Easier . With a global team of over 21,000 engineers and problem solvers in more than 30 countries, we offer the opportunity to work on world‑leading technology for Automotive, Industrial, Infrastructure, and IoT, shaping a safer, healthier, greener, and smarter future. At Renesas, TAGIE is our culture, grounded in being Transparent, Agile, Global, Innovative, and Entrepreneurial. It shapes how we work, grow and deliver on our purpose together. This collaborative spirit and mindset drive our semiconductor technology to transform industries and impact millions of lives. We believe in rewarding our employees with a competitive benefits package alongside their salary. More information will be provided during the hiring process. Are you ready to join our team and shape the future with us? Renesas Electronics is an equal opportunity and affirmative action employer, committed to supporting diversity and fostering a work environment free of discrimination on the basis of sex, race, religion, national origin, gender, gender identity, gender expression, age, sexual orientation, military status, veteran status, or any other basis protected by law. For more information, please read our Diversity & Inclusion Statement .