Jobs / United States / Psiquantum Corp
Fiber Assembly Process Engineer (hiring from Associate to Senior levels)
Psiquantum Corp · 🇺🇸 Milpitas, California, United States
Sponsorship verdict
Sponsorship possible
One solid signal, not two — worth applying, and worth asking about sponsorship early.
- Employer is on a government sponsor recordThe US Department of Labor certified 22 H-1B/E-3 labor condition applications for this employer between Oct 2025 and Jun 2026 (latest Jun 2026) — the step every H-1B hire needs first. USCIS also records 1 H-1B approvals in FY2023. Source: LCA disclosure data (US Department of Labor (OFLC)).
- The posting doesn’t mention sponsorshipSilence isn’t a refusal — ask the recruiter before investing much time.
- No salary bar for this routeH-1B has no fixed salary bar: the employer must pay at least the prevailing wage for the role and area. Cap-subject employers enter a lottery weighted by wage level. Source: https://www.federalregister.gov/documents/2025/12/29/2025-23853/weighted-selection-process-for-registrants-and-petitioners-seeking-to-file-cap-subject-h-1b, rules effective 2026-02-27.
- What Psiquantum Corp paid sponsored hires in similar roles8 certified filings for “Test Automation Engineer Photonics” (Robotics Engineers) in CA: $159k–$188k, median $159k. Most were filed at wage level III (63%) — 3 lottery entries, ≈46% projected selection odds for cap-subject employers. Source: US Department of Labor LCA disclosure data (Oct 2025 – Jun 2026).
- Confirmed live todayWhen a source last listed this job as open.
US H-1B: cap-subject employers enter a lottery weighted by wage level — Level I gets 1 entry, Level IV gets 4 (DHS projected selection odds ≈15% at Level I to ≈61% at Level IV). Universities and non-profit research employers are cap-exempt. The $100,000 fee for new petitions from abroad is currently blocked by a court order (appeal pending).
A verdict summarises public evidence; it is not legal advice and never a guarantee — the employer and the immigration authority decide. Sign in to factor in where you can already work.
Or apply yourself on the official page →
Sponsor Radar — Psiquantum Corp
The US Department of Labor certified 22 H-1B/E-3 labor condition applications for this employer between Oct 2025 and Jun 2026 (latest Jun 2026) — the step every H-1B hire needs first. USCIS also records 1 H-1B approvals in FY2023. Source: LCA disclosure data (US Department of Labor (OFLC)).
Past sponsorship or register membership never guarantees sponsorship for this vacancy or for you. Full Sponsor Radar for Psiquantum Corp →
About the role
[We will consider candidates at all levels - Associate to Senior] PsiQuantum’s mission is to build the first useful quantum computers—machines capable of delivering the breakthroughs the field has long promised. Since our founding in 2016, our singular focus has been to build and deploy million-qubit, fault-tolerant quantum systems. Quantum computers harness the laws of quantum mechanics to solve problems that even the most advanced supercomputers or AI systems will never reach. Their impact will span energy, pharmaceuticals, finance, agriculture, transportation, materials, and other foundational industries. Our architecture and approach is based on silicon photonics. By leveraging the advanced semiconductor manufacturing industry—including partners like GlobalFoundries—we use the same high-volume processes that already produce billions of chips for telecom and consumer electronics. Photonics offers natural advantages for scale: photons don’t feel heat, are immune to electromagnetic interference, and integrate with existing cryogenic cooling and standard fiber-optic infrastructure. In 2024, PsiQuantum announced government-funded projects to support the build-out of our first utility-scale quantum computers in Brisbane, Australia, and Chicago, Illinois. These initiatives reflect a growing recognition that quantum computing will be strategically and economically defining—and that now is the time to scale. PsiQuantum also develops the algorithms and software needed to make these systems commercially valuable. Our application, software, and industry teams work directly with leading Fortune 500 companies—including Lockheed Martin, Mercedes-Benz, Boehringer Ingelheim, and Mitsubishi Chemical—to prepare quantum solutions for real-world impact. Quantum computing is not an extension of classical computing. It represents a fundamental shift—and a path to mastering challenges that cannot be solved any other way. The potential is enormous, and we have a clear path to make it real. Come join us. Job Summary: The Senior Fiber Assembly Process Engineer will be responsible for the development of advanced assembly instrumentation for high-performance and high throughput fiber splicing, and study and address fiber and splice reliability at the scale of datacenters. This role combines fiber engineering, opto-mechanical automation, optical assembly manufacturing and semiconductor process development. Responsibilities: • Study and root-cause sources of fiber splice loss and loss variability. • Develop and deploy advanced fiber processing equipment working with industrial partners. • Develop advanced measurement methodologies for validating fiber and fiber splice losses at datacenter scale. • Use optical simulation tools to model behavior & performance fiber-fiber interfaces for a wide range of advanced fiber designs. • Assess modal properties, loss mechanisms, dispersion, coupling, and other key fiber characteristics relevant to demanding optical applications, through optical modeling and experimental validation, model closure. • Work with the optical packaging and assembly validation teams to develop and deliver test methods for the performance and reliability of fiber interfaces. Experience/Qualifications: • MSc or PhD in photonics, optics, physics, engineering, or a related field, or equivalent industry experience. • 5+ years of experience in fiber optics, optical system development and assembly. • Strong understanding of optical fibers and fiber splicing & measurement equipment. • Familiar with key opto-mechanical packaging and assembly equipment. • Proficiency in Python and JMP. • Experience with mechanical and/or optical instrumentation automation and control. • Familiarity with back-end semiconductor packaging is a plus.