Advanced Package Design Engineer

About SK hynix America: At SK hynix America, we are at the forefront of semiconductor innovation. As a global leader in HBM, DRAM, and NAND flash technologies, we develop the advanced memory solutions powering everything from advanced mobile technology to massive AI data centers. With major investments in the U.S. and a leading position in the global AI revolution, we build the critical infrastructure of the digital landscape and remain committed to sustainable operations. We invite innovative minds to be part of our journey. Here, you will be part of a collaborative team pioneering the next generation of memory technologies, expanding our market footprint, and defining the future of computing. Work Model: Onsite Job Summary: We are seeking a skilled Advanced Package Design Engineer to join our Packaging Engineering team in SK Hynix America. You will be responsible for designing and optimizing high-performance, high-density Interposers for chiplet-based architectures and heterogeneous integration solutions. You’ll collaborate closely with PCB, SI/PI, thermal, and manufacturing teams to deliver robust, manufacturable, and cost-effective package solutions Responsibilities: • Design silicon and organic interposers for advanced packaging solutions • Experience in EDA tools such as Virtuoso/APD, Synopsys Custom Compiler, Siemens Xpedition to create and verify advanced package layouts • Perform design studies and what if scenario analysis for advanced packaging schemes to optimize the overall package design. • Create and maintain layout design rules, stack-ups, and layout guidelines • Collaborate with internal and external stakeholders to ensure seamless advanced packaging technology development Qualifications: • Bachelor’s or Master’s degree in Electrical Engineering (Preferred), Mechanical Engineering, Material Science, or a related field. • 3+ years of experience in semiconductor package design or layout • Proven experience with layout tools Virtuoso/APD, Synopsys Custom Compiler, Siemens Xpedition • Understanding of high-speed signal routing, power distribution networks (PDN) • Familiar with 2.5D/3D packaging technologies, substrate design rules, and large body substrate technologies • Effective communication skills and ability to work in a fast-paced, cross-functional environment Preferred Qualifications: • Currently pursuing a PhD's degree in Electrical Engineering or a related field • 5+ years of experiences in advanced packaging layout design • Experience with SI/PI simulation tools (Ansys, HFSS, ADS) • Proven understanding of high-speed signal routing, power distribution networks (PDN) • Proven technical understanding of advanced packaging materials, their interactions, failure mechanisms and analytical techniques Benefits: • Top Tier health insurance at no employee cost • Paid day offs: Paid Time Off, Company Holidays, Parental Leave, Happy Fridays • 401k Matching • Flexible Spending Account (FSA) for Health Care & Dependent Care • Educational reimbursement up to $10,000 per year • Donation Matching and volunteering opportunities • Corporate discount programs • Free Breakfast/Lunch/Dinner provided to employees Compensation: Our compensation reflects the cost of labor across several U.S. geographic markets, and we pay differently based on those defined markets. Pay within the provided range varies by work location and may also depend on job-related skills and experience. Your Recruiter can share more about the specific salary range for the job location during the hiring process. Pay Range $110,000 — $155,000 USD Equal Employment Opportunity: SK hynix America is an Equal Employment Opportunity Employer. We provide equal employment opportunities to all qualified applicants and employees and pr