Jobs / United States / Nvidia Corporation

Principal Power and Thermal Architect

Nvidia Corporation · 🇺🇸 US, CA, Santa Clara

Sponsorship verdict

Sponsorship possible

One solid signal, not two — worth applying, and worth asking about sponsorship early.

  • Employer is on a government sponsor recordThe US Department of Labor certified 2,374 H-1B/E-3 labor condition applications for this employer between Oct 2025 and Jun 2026 (latest Jun 2026) — the step every H-1B hire needs first. USCIS also records 394 H-1B approvals in FY2023. Source: LCA disclosure data (US Department of Labor (OFLC)).
  • The posting doesn’t mention sponsorshipSilence isn’t a refusal — ask the recruiter before investing much time.
  • No salary bar for this routeH-1B has no fixed salary bar: the employer must pay at least the prevailing wage for the role and area. Cap-subject employers enter a lottery weighted by wage level. Source: https://www.federalregister.gov/documents/2025/12/29/2025-23853/weighted-selection-process-for-registrants-and-petitioners-seeking-to-file-cap-subject-h-1b, rules effective 2026-02-27.
  • What Nvidia Corporation paid sponsored hires in similar roles62 certified filings for “Solutions Architect” (Sales Engineers) in CA: $139k–$199k, median $169k. Most were filed at wage level IV (51%) — 4 lottery entries, ≈61% projected selection odds for cap-subject employers. Source: US Department of Labor LCA disclosure data (Oct 2025 – Jun 2026).
  • Confirmed live todayWhen a source last listed this job as open.

US H-1B: cap-subject employers enter a lottery weighted by wage level — Level I gets 1 entry, Level IV gets 4 (DHS projected selection odds ≈15% at Level I to ≈61% at Level IV). Universities and non-profit research employers are cap-exempt. The $100,000 fee for new petitions from abroad is currently blocked by a court order (appeal pending).

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Sponsor Radar — Nvidia Corporation

2,374 H-1B filings certified since Oct 2025

The US Department of Labor certified 2,374 H-1B/E-3 labor condition applications for this employer between Oct 2025 and Jun 2026 (latest Jun 2026) — the step every H-1B hire needs first. USCIS also records 394 H-1B approvals in FY2023. Source: LCA disclosure data (US Department of Labor (OFLC)).

Past sponsorship or register membership never guarantees sponsorship for this vacancy or for you. Full Sponsor Radar for Nvidia Corporation →

About the role

NVIDIA has been transforming computer graphics, PC gaming, and accelerated computing for more than 25 years. It's a unique legacy of innovation that's fueled by great technology and amazing people. Today, we're harnessing the boundless possibilities of AI to build the next era of computing. An era in which our GPU acts as the brain of computers, robots, and self-driving cars that can understand the world. Accomplishing unprecedented goals calls for imagination, inventiveness, and exceptional talent from around the world. As a NVIDIAN, you'll be immersed in a diverse, encouraging environment where everyone is inspired to do their best work. Join our team and discover how you can build a lasting impact on the world. NVIDIA designs the silicon behind AI, accelerated computing, and graphics. Power and thermal architecture decisions sit behind every watt of performance and every degree of thermal headroom! We are the Silicon Co-Design Group (SCG). We are hiring a Principal Architect to scout the research and industry landscape, identify emerging system-level co-design ideas in power and thermal, and drive them across teams into product differentiation across NVIDIA's roadmap. This role shapes system, platform, and datacenter feature/behavior, and partners with teams across Nvidia. SCG scope spans across architecture, design, software, operations, platforms, and productization. What you'll be doing: • Architect next-generation system, platform, and datacenter-level power and thermal co-design solutions. Scan internal research, academia, standards bodies, and silicon, memory, packaging, and platform partners for what is emerging. • Build the product differentiation case for each candidate idea, performance, power, reliability, schedule, cost, and brainstorm what is worth pursuing. • Lead end-to-end co-design from concept to product. Drive alignment across architecture, VLSI, software, platform, packaging, and operations teams to land selected technologies in production. • Shape innovation across workload-aware power and thermal controls, closed-loop platform telemetry, datacenter-class power compliance, platform-scale energy buffering, advanced cooling intercepts, and emerging memory co-design. • Maintain a living intercept pipeline. Track candidates, productization status, decision gates, and product axes. Brief SCG and broader NVIDIA leadership on what is next. • Collaborate with system architects, platform and software engineers, manufacturing partners, and external researchers to bring next-generation products to market. What we need to see: • BS, MS, or PhD in Electrical Engineering, Computer Engineering, Computer Science, or equivalent experience. • 15+ years in system-level power, thermal, or related architecture, with deep expertise in at least one of: system power management, system thermal architecture, platform energy architecture, workload-aware power and thermal controls, or memory co-design. • External technical recognition, premier publications, patents, or industry standards contributions, and active contributions to standards bodies, consortia, or external technical communities. • Track record of taking research-grade ideas through system co-design and into measurable product impact. • Demonstrated multi-functional influence in aligning teams across the company without direct reporting authority. • Excellent problem-solving, partnership, and social skills. Ways to stand out from the crowd: • Curious about turning research into a production system co-design? Here is what makes a strong candidate. • PhD or equivalent experience with sustained research contributions after entering industry. • Machine learning or data-driven techniques applied to system power, thermal modeling, or design-space exploration.

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Source: Employer career site (Workday) First seen: 2026-08-28 Last confirmed: 2026-10-02 How our data works → Report this job

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