Silicon Photonics Wafer Level Packaging Design Engineer (f/m/d)

• Design and develop wafer level packaging solutions, 2D/2.5D/3D, for advanced silicon photonics platforms • Create and optimise metallisation layouts (e.g. UBM, RDL, Solder, TSVs) to meet electrical, mechanical and manufacturing requirements. • Define and engineer package mechanical features, including die interfaces, alignment structures, stress management and assembly tolerances. • Perform thermal modelling and analysis to optimise heat dissipation, thermal resistance and package reliability across operating conditions. • Develop and execute package validation plans, including optical performance, mechanical, thermal, and reliability testing of finished hardware, analysing results and driving design improvements. • Collaborate with process, assembly and foundry partners to ensure package designs are compatible with wafer level fabrication, bonding and high-volume manufacturing processes. • Conduct package verification through simulation, design reviews and failure analysis, driving continuous improvement in performance, manufacturability and yield. • Support the integration of photonic devices by considering package impacts on optical alignment, optical coupling efficiency and overall system performance, working closely with photonic design teams. ]]> • A Master or PhD in Packaging Engineering, Photonics, Mechanical Engineering, Physics or a related discipline. • Proven experience in advanced semiconductor packaging with exposure to wafer-level packaging, flip-chip, interposer, chiplet, 2D, 2.5D or 3D integration technologies. • Experience using mechanical and thermal simulation tools (e.g. ANSYS, COMSOL or equivalent) for package design and optimisation. • Strong understanding of wafer level package metallisation design • A few years of industry or advanced research experience in wafer level packaging. • Experience with photonic device packaging, optical alignment challenges or co-packaged optics is advantageous. • Hands-on experience with electro-optical device characterization at wafer, die level or package level • Fluent English; German is a plus ]]>