Jobs / United States / Intel Corporation
Senior CPU Performance Architect
Intel Corporation · 🇺🇸 5 Locations
Sponsorship verdict
Posting rules out sponsorship
The posting rules out sponsorship or requires citizenship/clearance.
- Employer is on a government sponsor recordThe US Department of Labor certified 1,731 H-1B/E-3 labor condition applications for this employer between Oct 2025 and Jun 2026 (latest Jun 2026) — the step every H-1B hire needs first. USCIS also records 1,112 H-1B approvals in FY2023. Source: LCA disclosure data (US Department of Labor (OFLC)).
- The posting doesn’t mention sponsorshipSilence isn’t a refusal — ask the recruiter before investing much time.
- No salary bar for this routeH-1B has no fixed salary bar: the employer must pay at least the prevailing wage for the role and area. Cap-subject employers enter a lottery weighted by wage level. Source: https://www.federalregister.gov/documents/2025/12/29/2025-23853/weighted-selection-process-for-registrants-and-petitioners-seeking-to-file-cap-subject-h-1b, rules effective 2026-02-27.
- Citizenship requirement statedFrom the posting’s own wording.
- Security clearance mentionedFrom the posting’s own wording.
- Confirmed live todayWhen a source last listed this job as open.
US H-1B: cap-subject employers enter a lottery weighted by wage level — Level I gets 1 entry, Level IV gets 4 (DHS projected selection odds ≈15% at Level I to ≈61% at Level IV). Universities and non-profit research employers are cap-exempt. The $100,000 fee for new petitions from abroad is currently blocked by a court order (appeal pending).
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Why not apply?
Citizenship requirement stated — the posting’s wording suggests candidates who already hold work rights. Read the original listing carefully.
The posting mentions a security clearance — usually restricted to citizens of that country.
SponsorApply flags time-wasters so your applications go where they can land. These come from the posting's own wording — read the original listing to confirm. See better-fit alternatives →
Sponsor Radar — Intel Corporation
The US Department of Labor certified 1,731 H-1B/E-3 labor condition applications for this employer between Oct 2025 and Jun 2026 (latest Jun 2026) — the step every H-1B hire needs first. USCIS also records 1,112 H-1B approvals in FY2023. Source: LCA disclosure data (US Department of Labor (OFLC)).
Past sponsorship or register membership never guarantees sponsorship for this vacancy or for you. Full Sponsor Radar for Intel Corporation →
About the role
Job Details: Job Description: About Intel Foundry Services Intel Foundry is a systems foundry dedicated to transforming the global semiconductor industry by delivering cutting-edge silicon process and packaging technology leadership for the AI era. With a focus on scalability, AI advancement, and shaping the future, we provide an unparalleled blend of an industry-leading technology, a rich IP portfolio, a world-class design ecosystem, and an operationally resilient global manufacturing supply chain. Position Overview We seek a DFT Application Engineer to provide technical support to Intel Foundry Services customers on PDKs, DFT/DFM insertion, and ATPG validation methodologies. This critical role supports Aerospace, Defense, and Government (ADG) customers in achieving successful tape-outs while ensuring the highest quality standards through comprehensive DFT solutions and customer engagement. Key Responsibilities Customer Technical Support & Collaboration • Provide comprehensive DFT tool/flow/methodology support to address customer issues and challenges, ensuring successful tape-outs and maximum customer satisfaction • Work closely with internal Intel teams and external stakeholders including foundry customers' design teams, IP providers, and EDA vendors to resolve complex technical issues • Deliver customer-facing technical support and guidance on DFT implementation strategies DFT Methodology & Quality Leadership • Drive quality improvements in ASIC DFT/DFM and ATPG validation methodology, capability/flow, and documentation for both block-level and SoC-level implementations • Collaborate with RTL and Hard IP designers on DFT/DFM implementation methodology and work with physical designers on DFT/DFM physical implementation, validation, and timing signoff • Develop and optimize DFT insertion flows for advanced CMOS processes and multi-die designs Technical Content Development & Training • Develop application notes, comprehensive documentation, and deliver technical training presentations to customers and internal teams • Create best practice guidelines and methodology documentation for DFT implementation across various design complexities • Support knowledge transfer and capability building for both internal teams and customer organizations Essential Skills & Attributes • Customer-Focused: Strong customer-oriented attitude and mindset with commitment to customer success • Self-Motivated: Self-driven and results-oriented with ability to manage multiple complex tasks effectively • Collaborative: Excellent teamwork skills to drive innovative solutions for customer design implementation challenges • Analytical: Strong analytical problem-solving capabilities for complex DFT challenges • Communication: Effective communication skills with experience in collaboration, active listening, and providing constructive technical feedback Qualifications: The Minimum qualifications are required to be considered for this position. Minimum qualifications listed below would be obtained through a combination of industry relevant job experience, internship experience and / or schoolwork/classes/research. The preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. Minimum Qualifications • US Citizenship required • Ability to obtain US Government Security Clearance • Bachelor's degree in Electrical Engineering, Computer Engineering, or STEM-related field • 3+ years of experience with advanced CMOS processes (22nm and below) • 3+ years of combined experience in the following: implementing ASIC DFT/DFM insertion (MBIST, LBIST, SCAN, JTAG) at both ASIC design block level and full chip level, including ATPG validation and DFT timing/signoff at SOC level •