Jobs / United States / Intel Corporation
Senior Development Engineer - Density Fill
Intel Corporation · 🇺🇸 4 Locations
Sponsorship verdict
Sponsorship possible
One solid signal, not two — worth applying, and worth asking about sponsorship early.
- Employer is on a government sponsor recordThe US Department of Labor certified 1,731 H-1B/E-3 labor condition applications for this employer between Oct 2025 and Jun 2026 (latest Jun 2026) — the step every H-1B hire needs first. USCIS also records 1,112 H-1B approvals in FY2023. Source: LCA disclosure data (US Department of Labor (OFLC)).
- The posting doesn’t mention sponsorshipSilence isn’t a refusal — ask the recruiter before investing much time.
- No salary bar for this routeH-1B has no fixed salary bar: the employer must pay at least the prevailing wage for the role and area. Cap-subject employers enter a lottery weighted by wage level. Source: https://www.federalregister.gov/documents/2025/12/29/2025-23853/weighted-selection-process-for-registrants-and-petitioners-seeking-to-file-cap-subject-h-1b, rules effective 2026-02-27.
- What Intel Corporation paid sponsored hires in similar roles287 certified filings for “Process Engineer” (Materials Engineers) in OR: $113k–$133k, median $133k. Most were filed at wage level III (87%) — 3 lottery entries, ≈46% projected selection odds for cap-subject employers. Source: US Department of Labor LCA disclosure data (Oct 2025 – Jun 2026).
- Confirmed live todayWhen a source last listed this job as open.
US H-1B: cap-subject employers enter a lottery weighted by wage level — Level I gets 1 entry, Level IV gets 4 (DHS projected selection odds ≈15% at Level I to ≈61% at Level IV). Universities and non-profit research employers are cap-exempt. The $100,000 fee for new petitions from abroad is currently blocked by a court order (appeal pending).
A verdict summarises public evidence; it is not legal advice and never a guarantee — the employer and the immigration authority decide. Sign in to factor in where you can already work.
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Sponsor Radar — Intel Corporation
The US Department of Labor certified 1,731 H-1B/E-3 labor condition applications for this employer between Oct 2025 and Jun 2026 (latest Jun 2026) — the step every H-1B hire needs first. USCIS also records 1,112 H-1B approvals in FY2023. Source: LCA disclosure data (US Department of Labor (OFLC)).
Past sponsorship or register membership never guarantees sponsorship for this vacancy or for you. Full Sponsor Radar for Intel Corporation →
About the role
Job Details: Job Description: The Role and Impact Join Intel's Design Technology Platform (DTP) organization and become an integral part of a highly skilled team driving the development of cutting-edge technologies. As an EDA Tools Software Engineer, you will design, develop, test, and debug software tools and methodologies that directly support Intel's hardware product design and manufacturing processes. Your work will enable design teams to innovate faster, meet complex manufacturability constraints, and deliver industry-leading products to market. By contributing to Intel's advanced process technologies, you will play a pivotal role in achieving leadership in design automation and fostering a culture of innovation. Key Responsibilities • Design, develop, and debug Fill components of Process Design Kits (PDKs), • Provide algorithmic solutions using tools such as Calibre, ICV, and Pegasus to address density deficiencies and ensure manufacturability compliance. • Collaborate with process developers, design rule owners, and end users to define requirements and implement state-of-the-art solutions. • Automate workflows to enhance efficiency, accuracy, and deployment across design teams. • Develop comprehensive test cases and systems to validate software tools and ensure seamless integration with various design methodologies. • Innovate and drive advancements in EDA tools and methodologies to meet the evolving needs of Intel's technology ecosystem. • Partner with cross-functional teams and external EDA vendors to define and implement new tool features and methodologies. • Maintain documentation, including training materials and user guides, to support customers and ensure robust deployment. In this role, you will have a unique opportunity to make a lasting impact by enabling Intel's success in the competitive semiconductor landscape. Take the next step in your career and join a team where your expertise will help shape the future of technology innovation. Qualifications: Minimum Qualifications • Bachelor's degree in Electrical Engineering, Computer Engineering, or a related field with 8+ years of experience, Master's degree with 5+ years of experience, or PhD with 2+ years of experience. • Minimum 5 years of hands-on experience with at least one industry-standard physical verification platform (Calibre, ICV, or Pegasus), including methodology development, rule deck debugging, or production deployment. • 3+ years of direct experience developing, maintaining, or debugging physical verification rule decks using SVRF, TVF, PXL, or PVL/PVTCL for DRC, density, or fill verification applications. • Solid understanding of semiconductor device physics, process technology, and design rules. • Experience in developing algorithmic solutions for physical design challenges in advanced manufacturing nodes. • Strong knowledge of Unix/Linux platforms and computing environments. Preferred Qualifications • 5+ years of hands-on experience developing, deploying, or supporting density fill methodologies for semiconductor technologies at 16nm and below, including ownership of fill rule implementation, density compliance, or manufacturability optimization. • Experience with advanced physical verification techniques, including DRC, and density/fill modules. • Industry experience with other foundry technologies in this domain is strongly desirable • Familiarity with custom layout tools such as Cadence Virtuoso or Synopsys Custom Designer. • Deep understanding of technology scaling challenges and their impact on physical design rules. • Proven track record of collaborating across multiple internal and external teams to deliver optimal solutions. • Exceptional analytical and problem-solving skills with the ability to address