Skills this job asks for
EnglishSupply chainProject managementAgile
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Sponsorship verdict
No sponsorship evidence yet
No government record and no wording either way. Not a refusal: ask the recruiter.
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The posting doesn’t mention sponsorshipSilence isn’t a refusal — ask the recruiter before investing much time.
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Before you apply
Sponsorship unknown
No register record and no sponsorship wording in the posting. Worth asking the employer before investing significant time.
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About the role
Responsibilities
• Define & drive milestones: Establish major package‐development milestones and ensure on-time delivery through proactive planning, progress tracking, and risk mitigation.
• Design coordination: Coordinate package design and process development for electronic MEMS sensors in collaboration with internal engineering teams and external suppliers.
• Process engineering: Develop and optimize assembly processes for MEMS in automotive and consumer-electronics applications.
• Sample build & qualification: Oversee sample manufacturing and process qualification at assembly partners.
• Cross-functional collaboration: Communicate and work effectively in English with international stakeholders across product engineering, supply chain, and quality teams.
• Experience: 3–8 years in semiconductor packaging/assembly (LGA, BGA, DFN, WLCSP).
• Technical expertise: Strong background in semiconductor assembly technologies and materials.
• Project management: Proven ability in milestone tracking, reporting, systematic problem solving, multi-task handling and customer communication.
• Global teamwork: Demonstrated success in multicultural, international projects.
• Adaptability: Agile in adjusting project plans to evolving technical requirements and customer needs.
• Language & mobility: Excellent English skills (verbal and written); willingness to travel as required.
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Taipei, TW