Skills this job asks for
NetworkingLeadershipProduct managementBudgeting
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Sponsorship verdict
Sponsorship possible
One solid signal, not two. Worth applying, and worth asking about sponsorship early.
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✓
Employer is on a government sponsor recordThe US Department of Labor certified 63 H-1B/E-3 labor condition applications for this employer between Oct 2025 and Jun 2026 (latest Jun 2026) — the step every H-1B hire needs first.
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The posting doesn’t mention sponsorshipSilence isn’t a refusal — ask the recruiter before investing much time.
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No salary bar for this routeH-1B has no fixed salary bar: the employer must pay at least the prevailing wage for the role and area.
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What Astera Labs INC paid sponsored hires in similar roles14 certified filings for “Tech Lead Design Verification Engineer” (Electrical Engineers) in CA: $160k–$218k, median $206k.
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Confirmed live todayWhen a source last listed this job as open.
Details and sources
- Employer is on a government sponsor record
- The US Department of Labor certified 63 H-1B/E-3 labor condition applications for this employer between Oct 2025 and Jun 2026 (latest Jun 2026) — the step every H-1B hire needs first. Source: LCA disclosure data (US Department of Labor (OFLC)).
- No salary bar for this route
- H-1B has no fixed salary bar: the employer must pay at least the prevailing wage for the role and area. Cap-subject employers enter a lottery weighted by wage level. Source: https://www.federalregister.gov/documents/2025/12/29/2025-23853/weighted-selection-process-for-registrants-and-petitioners-seeking-to-file-cap-subject-h-1b, rules effective 2026-02-27.
- What Astera Labs INC paid sponsored hires in similar roles
- 14 certified filings for “Tech Lead Design Verification Engineer” (Electrical Engineers) in CA: $160k–$218k, median $206k. Most were filed at wage level IV (70%) — 4 lottery entries, ≈61% projected selection odds for cap-subject employers. Source: US Department of Labor LCA disclosure data (Oct 2025 – Jun 2026).
US H-1B: cap-subject employers enter a lottery weighted by wage level — Level I gets 1 entry, Level IV gets 4 (DHS projected selection odds ≈15% at Level I to ≈61% at Level IV). Universities and non-profit research employers are cap-exempt. The $100,000 fee for new petitions from abroad is currently blocked by a court order (appeal pending).
A verdict summarises public evidence. It is not legal advice and never a guarantee: the employer and the immigration authority decide. Sign in to factor in where you can already work.
About the role
Astera Labs (NASDAQ: ALAB) provides rack-scale AI infrastructure through purpose-built connectivity solutions. By collaborating with hyperscalers and ecosystem partners, Astera Labs enables organizations to unlock the full potential of modern AI. Astera Labs’ Intelligent Connectivity Platform integrates CXL®, Ethernet, NVLink, PCIe®, and UALink™ semiconductor-based technologies with the company’s COSMOS software suite to unify diverse components into cohesive, flexible systems that deliver end-to-end scale-up, and scale-out connectivity. The company’s custom connectivity solutions business complements its standards-based portfolio, enabling customers to deploy tailored architectures to meet their unique infrastructure requirements. Discover more at www.asteralabs.com .
About the Role
We are seeking a Principal Electrical Design Engineer to define and drive the architecture, design, and technical strategy for advanced board-level hardware across next-generation networking and high-performance connectivity platforms. This role encompasses complex hardware systems including chassis boards, NIC cards, PCIe Gen6 platforms, and 800G Ethernet products.
This is a principal-level technical leadership role requiring deep domain expertise, strategic vision, and organizational influence. You will set the technical direction for board architecture, establish design methodologies, drive innovation in high-speed system design, and serve as the top technical authority across multiple programs. You will partner with and influence silicon, SI/PI, mechanical, firmware, manufacturing, system, and executive teams to deliver industry-leading products from concept through production and beyond.
Key Responsibilities
Technical Strategy and Architecture Leadership
• Define and own the board-level hardware architecture and technical roadmap across multiple product lines and platform generations
• Establish design standards, methodologies, and best practices that scale across the hardware engineering organization
• Drive architectural tradeoff decisions for complex multi-layer PCBs integrating high-speed digital, analog, and mixed-signal circuitry, balancing performance, cost, schedule, and manufacturability
• Get involved and drive discussions on stack-up strategy, impedance optimization and other SI relates development work
• Own power delivery architecture strategy including multi-rail regulation topologies, advanced sequencing schemes, transient response optimization, protection philosophies, and power budgeting across platform generations
• Define and evolve hardware implementation strategies for management and control interfaces such as I2C, SPI, GPIO, MDIO, and debug and observability architectures
Electrical Design Ownership
• Own schematic capture and board-level design for complex multi-layer PCBs with high-speed digital, analog, and mixed-signal circuitry
• Serve as the technical authority for board-level hardware development across high-performance server and connectivity platforms, including NIC cards, PCIe add-in cards, and chassis-integrated hardware
• Provide technical oversight and approval for schematic capture and board-level designs across multiple designs
• Lead component strategy and qualification roadmaps in partnership with suppliers, sourcing, and manufacturing teams
• Drive design-for-excellence initiatives including DFT, DFM, and DFR to systematically improve manufacturability, yield, reliability, and production readiness across all programs
Bring-Up, Validation, and Debug Leadership
• Define and own the bring-up and validation strategy for new hardware platforms, establishing frameworks that improve first-pass success rates across the organization
• Lead root-cause analysis of the most complex and escalated har
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