Jobs / United States / Hewlett Packard Enterprise Company

Hewlett Packard Enterprise Company

Mechanical/Thermal Hardware Engineer

Chippewa Falls, Wisconsin, United States of America Posted today

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Sponsorship verdict

Sponsorship possible

One solid signal, not two. Worth applying, and worth asking about sponsorship early.

  • Employer is on a government sponsor recordThe US Department of Labor certified 486 H-1B/E-3 labor condition applications for this employer between Oct 2025 and Jun 2026 (latest Jun 2026) — the step every H-1B hire needs first.
  • The posting doesn’t mention sponsorshipSilence isn’t a refusal — ask the recruiter before investing much time.
  • No salary bar for this routeH-1B has no fixed salary bar: the employer must pay at least the prevailing wage for the role and area.
  • What Hewlett Packard Enterprise Company paid sponsored hires in similar roles2 certified filings for “Electrical/Hardware Engineer II” (Computer Hardware Engineers) in CA: $137k–$208k, median $172k.
  • Confirmed live todayWhen a source last listed this job as open.
Details and sources
Employer is on a government sponsor record
The US Department of Labor certified 486 H-1B/E-3 labor condition applications for this employer between Oct 2025 and Jun 2026 (latest Jun 2026) — the step every H-1B hire needs first. Source: LCA disclosure data (US Department of Labor (OFLC)).
No salary bar for this route
H-1B has no fixed salary bar: the employer must pay at least the prevailing wage for the role and area. Cap-subject employers enter a lottery weighted by wage level. Source: https://www.federalregister.gov/documents/2025/12/29/2025-23853/weighted-selection-process-for-registrants-and-petitioners-seeking-to-file-cap-subject-h-1b, rules effective 2026-02-27.
What Hewlett Packard Enterprise Company paid sponsored hires in similar roles
2 certified filings for “Electrical/Hardware Engineer II” (Computer Hardware Engineers) in CA: $137k–$208k, median $172k. Most were filed at wage level IV (100%) — 4 lottery entries, ≈61% projected selection odds for cap-subject employers. Source: US Department of Labor LCA disclosure data (Oct 2025 – Jun 2026).

US H-1B: cap-subject employers enter a lottery weighted by wage level — Level I gets 1 entry, Level IV gets 4 (DHS projected selection odds ≈15% at Level I to ≈61% at Level IV). Universities and non-profit research employers are cap-exempt. The $100,000 fee for new petitions from abroad is currently blocked by a court order (appeal pending).

A verdict summarises public evidence. It is not legal advice and never a guarantee: the employer and the immigration authority decide. Sign in to factor in where you can already work.

About the role

Mechanical/Thermal Hardware Engineer    This role has been designed as ‘’Onsite’ with an expectation that you will primarily work from an HPE office. Who We Are: Hewlett Packard Enterprise is the global edge-to-cloud company advancing the way people live and work. We help companies connect, protect, analyze, and act on their data and applications wherever they live, from edge to cloud, so they can turn insights into outcomes at the speed required to thrive in today’s complex world. Our culture thrives on finding new and better ways to accelerate what’s next. We know varied backgrounds are valued and succeed here. We have the flexibility to manage our work and personal needs. We make bold moves, together, and are a force for good. If you are looking to stretch and grow your career our culture will embrace you. Open up opportunities with HPE. Job Description: Job Family Definition: Designs, analyzes, develops, modifies and evaluates materials, mechanical systems, equipment and packaging. Conducts feasibility, design margin and validation analysis and empirical testing on new and modified designs. Leads and/or assists in architecture development and assessment. Evaluates reliability of materials, properties, designs, and techniques used in production. May direct support personnel and/or partner organizations in the preparation of detailed design, design testing, prototype fabrication, and production tooling. Management Level Definition: Contributions include applying intermediate level of subject matter expertise to solve common technical problems. Acts as an informed team member providing analysis of information and recommendations for appropriate action. Works independently within an established framework and with moderate supervision. Responsibilities: • Designs portions of engineering solutions for mechanical and thermal hardware, electronics enclosures, and production tooling based on established engineering principles and in accordance with development technology practices and guidelines. • Develops and implements parameters and test plans for existing designs, including validation of tolerances, form/fit/function, shock and vibration, electromagnetic interference, safety, reliability, developing fan curves, system power measurements & acoustics. • Collaborates and communicates with internal and outsourced development partners on mechanical and thermal design and development. • Participates as a member of project team of other mechanical hardware engineers and internal and outsourced development partners to develop reliable, cost effective and high quality solutions for low to moderately- complex products. Education and Experience Required: • Bachelor's or Master's degree in Mechanical Engineering. • Typically 2-4 years experience. Knowledge and Skills: • Using ProEngineer, Solidworks, or other 3D CAD software as a mechanical design tool. • Ability to apply analytical and problem solving skills. • Designing sheet metal and plastic parts and associated production tooling and processes. • Using CFD and thermal mockups to validate thermal solution. • Strong written and verbal communication skills; mastery in English and local language. • Ability to effectively communicate design proposals and negotiate options. Accessibility HPE is committed to creating an inclusive and accessible workplace and encourages applications from all qualified individuals, including those with disabilities. If you believe you require accommodation during any stage of the application or interview process, please submit your request by completing our secure form linked here . Note: This option is reserved for applicants needing assistance/reasonable accommodation related to a disability. What We Can Offer You: Health & Wellbeing We

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