Remote Operations Center Manufacturing Technician (Contract)

Job Details: Job Description: About APCC: Be a part of Intel's Advanced Packaging Command Center (APCC), the global command center for Advanced Packaging that provides remote capabilities, follow-on engineering, and operational support across Wafer Packaging Manufacturing (WPM). Through APCC, engineering expertise is focused to improve coordination across regions, drive standardization, and improve responsiveness, while strengthening end-to-end operational execution across regions and delivering consistent, high-quality execution at scale. Key Contribution: As a valued team member, you will: • Monitor and analyze real-time factory operations. • Collaborate closely with stakeholders to enable effective communication and coordination. • Support high equipment availability and predictable manufacturing results. • Help sustain Intel’s leadership in advanced packaging manufacturing.   A Remote Operations Center (ROC) Manufacturing Technician (MT) is responsible for managing factory operations in a high-volume manufacturing (HVM) facility from centralized computer workstations off the manufacturing floor.  Job responsibilities will include but will not be limited to:   • Plan and execute production material movement across all processes in WPM functions from a given remote workstation. • Monitor fab equipment health and availability and communicate clearly with production personnel to ensure production is operational fully. • Respond to equipment alarms at ROC and resolve them with collaboration from production personnel. • Execute real-time disposition on equipment alarms and production lots when required. • Monitor, manage, and troubleshoot all equipment errors and material flows adhering to safety, quality and output values as required. • Understand and perform complex production instructions with inputs from multiple stakeholders. • Complete shiftly documentation and effectively communicate progress with global team. • Improve workstation performance by actively participating in continuous improvement projects, learning and skill development. Qualifications: Minimum qualifications are required to be initially considered for this position. • Diploma in Electrical / Electronics / Mechanical / Mechatronics / Microelectronics / Chemical Process Engineering / Chemistry / Physics. • 1+ years of working experience in semiconductor manufacturing, wafer fabrication, advanced packaging, or manufacturing operations environments. • Fresh graduates are encouraged to apply. • Ability to work rotating shifts to provide continuous support across global manufacturing operations. Day shift time is from 6:50 am to 7:00 pm and night shift is 6:50 pm to 7:00 a.m. Please note that this schedule is subject to change at the discretion of the Management. • Strong English communication skills, including reading, writing, and verbal communication. • Experience with end-user computer skills and navigation and automation systems troubleshooting.   Preferred Qualifications: • Experience training others • Peer leadership • Data analysis skills • Effective communication and teamwork skills in a global, cross-functional environment. • Willingness to learn new technologies, inspection platforms, and manufacturing processes.   An ideal candidate should be willing to demonstrate the below behavioural traits:   • Judgment and initiative are required in resolving complex nonstandard problems and developing recommendations • Commitment with quality • Strong team and communication skills • Problem solving skills • Adjust to changing priorities in a fast-paced environment   Primary Location: Malaysia, Penang            Job Type: Intel Contract Employee Shift: Shift 9 A1 (Malaysia) Primary Location: Malaysia, Penang Additional Loca