DRAM Manufacturing Specialist

About Fractile Fractile was founded in 2022 on the bet that, eventually, the world’s most capable AI systems would be limited in their impact by the time taken to produce useful outputs. We bet everything on the logical conclusion: that the only way to truly unlock this latent value, to make speed viable at scale, was to radically reinvent the hardware that we run our frontier AI models on. Ever since, we have been building chips and systems that tackle this problem: how to efficiently generate output at thousands of tokens per second, while handling the complexity and capacity challenges of operating large models at very long contexts. The workloads that push to the limits of the current frontier are already transformational; it is the technical and economic limits on inference speed that are constraining progress. The defining work of the 21st century will be marked by the engine of inference delivering immense and diffuse chains of intellectual inquiry, in drug discovery, in software engineering, in materials discovery, in any field where progress is driven by deep reasoning and intelligence to resolve complex problems. About the role Based in Taiwan, you will be Fractile’s manufacturing technology interface with our DRAM suppliers and their manufacturing team. You will work closely with our silicon design, quality and operations teams to take DRAM devices from development and engineering samples through qualification and volume production. This is a hands-on technical role. You must have direct experience with DDR5 DRAM , understand DRAM architecture and operation down to gate and transistor level , and know how to define test strategies that detect manufacturing defects and verify device performance. You will be comfortable challenging supplier assumptions, investigating failures in detail and taking ownership of issues through to resolution. Key responsibilities • Own the technical manufacturing relationship with Fractile’s DRAM suppliers, ensuring clear requirements, credible qualification plans and readiness for production. • Work with Fractile’s design teams and DRAM partners to translate device requirements into manufacturing specifications, test coverage and acceptance criteria. • Review DRAM architecture and circuit implementation, including memory cells, access transistors, capacitors, wordlines, bitlines, sense amplifiers, decoders, peripheral logic and redundancy circuits. • Apply detailed knowledge of activation, sensing, restoration, precharge, refresh and read/write operations to assess device behaviour and investigate failures. • Define and review test strategies covering wafer probe, packaged-device testing, characterisation, qualification and production screening. • Working with Fractile’s Manufacturing Test Team you will ensure test programmes cover functional, parametric, timing, retention, coupling and disturb-related failures across appropriate voltage, temperature and frequency conditions. • Assess the effects of redundancy, repair and on-die ECC on test coverage, ensuring underlying defects are adequately detected and understood. • Analyse wafer maps, bit-failure maps, yield trends and characterisation data to identify root causes and drive corrective actions with suppliers. • Establish correlation between supplier test results and Fractile’s device and system evaluation, resolving gaps in coverage or inconsistent results. • Drive improvements in yield, outgoing quality and test efficiency as products move into volume production. • Assess and manage supplier process, material and test-programme changes, including their qualification requirements and impact on Fractile’s products. • Give internal teams clear visibility of technical risks, qualification progress and manufacturing readine