ORAP Module Equipment Technician, Night Shift

Job Details: Job Description: At Intel, we create world-changing technology that improves the life of every person on the planet. This position is part of Intel's Wafer Packaging Manufacturing (WPM) organization within the Planar Group, dedicated to driving advanced packaging technologies and ensuring high-quality semiconductor production. We maintain industry-leading manufacturing standards to support the groundbreaking technologies that power global computing. We are seeking a Manufacturing Equipment Technician to join our night shift team in Hillsboro, Oregon. In this role, you will perform technical maintenance, operations, and equipment recovery inside a cleanroom environment to sustain safety, quality, yield, and output goals. Working within defined parameters, you will troubleshoot complex electromechanical systems, execute preventative maintenance, and collaborate directly with engineering teams to support factory ramp priorities.   Shift Information This role operates on Shift 4: 7pm to 7:30am on an alternating weekly schedule: Sun-Tues and alternating Saturday nights Key Responsibilities • Electromechanical Troubleshooting & Repair: Diagnose, isolate, and repair equipment faults on semiconductor tools using layout plans, blueprints, repair manuals, and technical schematics. • Preventative Maintenance & Calibration: Execute routine tool setups, precision calibrations, and scheduled preventative maintenance to ensure tool health and maximize uptime. • Process & Tool Qualification: Partner with Module Engineering to execute experiments, implement hardware/software configuration changes, and support cleanroom data collection. • Documentation & Data Analysis: Monitor and document equipment performance data to identify reliability trends, updating specifications and maintenance logs. • Factory Ramp Support: Assist with WPM factory ramp efforts, ensuring equipment is installed, converted, and verified according to design specifications.   Essential Physical Demands & Working Conditions • Lift 25-pound parts 1-2 times per shift (on average) • Climb and perform work on ladders 1-3 times per shift (on average) • Wear an air respirator, when required, per safety requirements ( on average 1 time per shift)   The Successful Candidate • Analytical Problem Solver: Logical troubleshooting approach to diagnose complex electromechanical issues methodically. • Safety & Compliance Champion: Uncompromising commitment to maintaining a safe, clean, and compliant cleanroom working environment. • Collaborative Teammate: Fosters a positive, high-performing shift culture across multi-shift handoffs. • Detail-Oriented: Meticulous approach to executing tasks within defined procedures and documenting maintenance outcomes.   Apply today to join Intel Oregon's Wafer Packaging Manufacturing team. Take ownership of cutting-edge technology, work with an industry-leading team, and build a rewarding technical career. Qualifications: You must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. Relevant experience can be obtained through schoolwork, classes and project work, internships, military training, and/or work experience. This Position is not eligible for Intel immigration sponsorship. Minimum Qualifications: Candidates must meet at least one of the following educational or experience criteria: - High School diploma with 4+months of direct hands-on experience in semiconductor manufacturing / equipment maintenance or a related field or an Associate of Science degree in a STEM-related field with no prior professional experience.  Preferred Qualifications: • 1+ years o