Senior PCB Layout Engineer – Automotive HPC Embedded Platforms

Job Description Own PCB layout implementation for automotive HPC and chiplet-based platforms, translating approved schematics, electrical constraints, and mechanical requirements into manufacturable multilayer and HDI board designs. Deliver release-ready layouts that meet signal integrity, power integrity, reliability, and fabrication requirements. Key Responsibilities: • Own component placement, fine-pitch BGA escape routing, and detailed routing for multilayer and HDI PCBs used in automotive HPC and chiplet-based systems. • Implement constraint-driven routing for DDR/LPDDR, PCIe, Ethernet, and SerDes, controlling impedance, length matching, differential-pair geometry, crosstalk, and return paths in collaboration with SI/PI engineers. • Define PCB stack-ups, material requirements, via structures, and HDI build-up with hardware, SI/PI, mechanical, and fabrication teams, balancing electrical performance, reliability, and manufacturing capability. • Implement power and ground planes, decoupling placement, and power routing to agreed current-carrying, thermal, EMI/EMC, and power integrity requirements using Cadence Allegro, Altium Designer, or equivalent ECAD tools. • Create and verify component footprints, pad stacks, and ECAD library data; maintain layout databases and controlled design revisions throughout the release process. • Prepare fabrication and assembly release packages, including Gerber/ODB++ data, drill files, stack-up specifications, fabrication and assembly drawings, placement data, and associated BOM documentation. • Conduct layout reviews, design-rule checks, and DFM/DFA/DFT checks; resolve fabrication and assembly queries with suppliers and implement agreed layout corrections in line with applicable automotive requirements and processes. • Maintain PCB layout guidelines, checklists, and release documentation; communicate layout risks, design trade-offs, and delivery status proactively to cross-functional teams. Qualifications • Bachelor’s degree in Electrical or Electronic Engineering, or an equivalent qualification. • 5+ years of hands-on PCB layout experience, with demonstrated ownership of complex, high-density, high-speed boards from placement through manufacturing release. • Strong expertise in multilayer stack-ups, HDI, fine-pitch BGA escape routing, microvias, via-in-pad, and constraint-driven routing, including knowledge of fabrication capabilities and reliability trade-offs. • Practical experience routing DDR/LPDDR, PCIe, Ethernet, and SerDes, with a solid understanding of impedance control, timing constraints, return paths, decoupling, and SI/PI-driven layout practices. • Proficiency in Cadence Allegro, Altium Designer, or equivalent PCB layout tools, including constraint management, footprint and pad-stack creation, library management, and revision-controlled release workflows. • Working knowledge of PCB fabrication and assembly processes, DFM/DFA/DFT, and relevant IPC standards; experience preparing manufacturing deliverables and resolving supplier feedback. Automotive PCB experience is preferred. • Ability to interpret schematics and mechanical constraints, explain layout trade-offs, and work independently with hardware, SI/PI, mechanical, and manufacturing teams. Soft skills • Result oriented • Strong analytical and problem-solving mindset • Structured and quality-driven working approach • Ability to work effectively in cross-functional and global teams • Good English communication (spoken & written) Further details regarding compensation and benefits will be shared during the interview process.