Advanced Packaging Development Engineer

Job Details: Job Description: The Role and Impact   As a Packaging Module Development Engineer, you will drive the design and optimization of innovative packaging processes and equipment essential to Intel's next-generation semiconductor technologies. Your day-to-day responsibilities will include developing solutions to enhance reliability, manufacturability, and performance in high-volume manufacturing environments. These contributions will play a critical role in advancing Intel's leadership in semiconductor packaging technologies.     Business Group   This role is part of Intel Corporation's Advanced Packaging Technology Manufacturing (APTM) organization, which focuses on developing and scaling cutting-edge semiconductor packaging solutions. APTM supports Intel's broader mission by delivering technologies that empower high-performance, edge, and mobile computing applications, enabling global customer success and technological leadership.     Key Responsibilities    • Develop, optimize, and qualify packaging assembly processes, materials, and equipment to meet quality, reliability, yield, and cost targets. • Drive experimental design using methodologies such as Statistical Process Control (SPC) and Design of Experiments (DOE). • Innovate new techniques, materials, and tools to address emerging challenges in packaging reliability and manufacturability. • Collaborate with cross-functional teams to mitigate technical risks and ensure product development success. • Establish process specifications and material requirements while working with suppliers to meet stringent quality standards. • Document technical findings, process improvements, and advancements through detailed reports and technical papers. • Provide support for equipment performance and process health in both development and high-volume manufacturing environments. Core Competencies • Strong communication skills to collaborate across diverse teams and stakeholders.  • Strong analytical skills, including data analysis and risk assessment to inform decision-making. Qualifications: The Minimum qualifications are required to be initially considered for this position.  Minimum qualifications listed below would be obtained through a combination of industry relevant job experience, internship experience and / or schoolwork/classes/research. The preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.  Minimum Qualifications: • Bachelor's degree in Engineering, Physics, Chemistry, or a related STEM field with 3+ years of industry experience. -OR- • Master's degree in Engineering, Physics, Chemistry, or a related STEM field with 2+ years of industry experience. -OR- • PhD in Engineering, Physics, Chemistry, or a related STEM field with no prior professional experience.  • Experience with process development and/or equipment qualification for manufacturing applications.  Preferred Qualifications   • Experience leading technical teams and collaborating across matrixed organizations to drive innovation.  • Experience in Statistical Process Control (SPC), Design of Experiments (DOE), and process characterization techniques • Experience with semiconductor fabrication processes, packaging flows, and assembly methodologies.  • Proven ability to deliver results in time-sensitive technical projects with a focus on process improvement. Knowledge of quality systems, documentation standards, and tools for packaging reliability evaluation. • Proficiency in programming languages such as Python, MATLAB, or SQL to analyze complex datasets. Join Intel's world-class technology development team and use your expertise to push the boundaries of innovation in semiconductor packaging. Take the next step