Sponsorship verdict
Sponsorship possible
One solid signal, not two. Worth applying, and worth asking about sponsorship early.
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✓
Employer is on a government sponsor recordThe US Department of Labor certified 1,731 H-1B/E-3 labor condition applications for this employer between Oct 2025 and Jun 2026 (latest Jun 2026) — the step every H-1B hire needs first.
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The posting doesn’t mention sponsorshipSilence isn’t a refusal — ask the recruiter before investing much time.
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No salary bar for this routeH-1B has no fixed salary bar: the employer must pay at least the prevailing wage for the role and area.
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✓
What Intel Corporation paid sponsored hires in similar roles287 certified filings for “Process Engineer” (Materials Engineers) in OR: $113k–$133k, median $133k.
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✓
Confirmed live todayWhen a source last listed this job as open.
Details and sources
- Employer is on a government sponsor record
- The US Department of Labor certified 1,731 H-1B/E-3 labor condition applications for this employer between Oct 2025 and Jun 2026 (latest Jun 2026) — the step every H-1B hire needs first. Source: LCA disclosure data (US Department of Labor (OFLC)).
- No salary bar for this route
- H-1B has no fixed salary bar: the employer must pay at least the prevailing wage for the role and area. Cap-subject employers enter a lottery weighted by wage level. Source: https://www.federalregister.gov/documents/2025/12/29/2025-23853/weighted-selection-process-for-registrants-and-petitioners-seeking-to-file-cap-subject-h-1b, rules effective 2026-02-27.
- What Intel Corporation paid sponsored hires in similar roles
- 287 certified filings for “Process Engineer” (Materials Engineers) in OR: $113k–$133k, median $133k. Most were filed at wage level III (87%) — 3 lottery entries, ≈46% projected selection odds for cap-subject employers. Source: US Department of Labor LCA disclosure data (Oct 2025 – Jun 2026).
US H-1B: cap-subject employers enter a lottery weighted by wage level — Level I gets 1 entry, Level IV gets 4 (DHS projected selection odds ≈15% at Level I to ≈61% at Level IV). Universities and non-profit research employers are cap-exempt. The $100,000 fee for new petitions from abroad is currently blocked by a court order (appeal pending).
A verdict summarises public evidence. It is not legal advice and never a guarantee: the employer and the immigration authority decide. Sign in to factor in where you can already work.
About the role
Job Details:
Job Description:
Embark with us on a journey of growth and transformation as we create exceptionally engineered technology and bring AI everywhere. As a valued team member, your adaptability and attention to detail will contribute to our drive for results and relentless pursuit of quality, ensuring we meet our customers' needs with precision.
Join us and build on our legacy of innovation and collaboration as we deliver world‑changing technology that improves the life of every person on the planet.
Life at Intel: https://jobs.intel.com/en/life-at-intel
At Intel's Logic Technology Development (LTD) we have continued to extend Moore's law to be world leaders in computing technology. To achieve the necessary scaling of our semiconductor manufacturing process, we have led the industry in developing enhancements such as strained silicon for carrier transport enhancement, high-k metal gates, and FINFETs. LTD has been at the center of every new development that has kept Moore's Law moving forward. Defect Metrology plays a key role in the development of every new silicon process development. Our analysis builds the plan that allows LTD to take technology from the research phase to the high-volume manufacturing phase while maintaining high-quality standards. In the MIE organization, we engineer world-class yields on F25 processes by driving defects down to Best-in-Class targets.
As a Defect Metrology engineer, you will be responsible for identifying all defects that impact yield and performance in an advanced silicon process technology. You will characterize the process using cutting-edge metrology tools. With this characterization, you will be responsible for investigating and identifying the root cause owners and developing defect reduction roadmaps to achieve program milestone commitments to our customers. You will then work directly with the process modules and integration teams to drive that roadmap by developing and qualifying process fixes through Model-Based Problem Solving (MBPS). You will also respond to exclusionary baseline shifts in defect trends to isolate the root cause and implement preventative actions consistent with 8D methodology. This role provides an opportunity to influence Intel's future process technologies that will keep Moore's Law moving forward.
Responsibilities include but are not limited to:
• Owning a segment of the process to ensure adequate metrology is placed to detect and respond to all yield-limiting defects prior to reaching end-of-line sort
• Manage data collection strategies, data integrity and quality for the metrology scans in the segment
• Investigate and respond to exclusionary baseline shifts to ensure segment defect health is restored to capable, demonstrated baseline
• Develop new recipes and response action plans as part of New Product Introduction (NPI)
• Provide navigation and leadership to meet Intel's yield objectives, utilizing state-of-the-art metrology tools and test vehicles (QTM, Short Loop, etc.)
• Organizing and presenting defect summaries to F25, LTD, MDCE engineering teams.
• Partnering with Intel Integration, Yield, and failure analysis labs to identify root cause for all defect issues.
• Hold the team and collaborators accountable for quality through Integrated Module Team (IMT) and Focus Team (FT) forums.
• Work collaboratively as a part of the overall LTD Defect metrology group.
• Role-model and establish a team culture of trust, collaboration, safety, accountability, and sustaining excellence.
• Build strong relationships with other LTD teams based on mutual trust and respect.
The Ideal Candidate Must Demonstrate:
• Strong data analysis and problem-solving skills
• Team player with flexibility and adaptability to changing business needs
Apply on employer site ↗