Skills this job asks for
Product managementLeadershipCommunication
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Sponsorship verdict
Sponsorship possible
One solid signal, not two. Worth applying, and worth asking about sponsorship early.
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✓
Employer is on a government sponsor recordThe US Department of Labor certified 1,731 H-1B/E-3 labor condition applications for this employer between Oct 2025 and Jun 2026 (latest Jun 2026) — the step every H-1B hire needs first.
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The posting doesn’t mention sponsorshipSilence isn’t a refusal — ask the recruiter before investing much time.
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No salary bar for this routeH-1B has no fixed salary bar: the employer must pay at least the prevailing wage for the role and area.
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✓
What Intel Corporation paid sponsored hires in similar roles287 certified filings for “Process Engineer” (Materials Engineers) in OR: $113k–$133k, median $133k.
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✓
Confirmed live todayWhen a source last listed this job as open.
Details and sources
- Employer is on a government sponsor record
- The US Department of Labor certified 1,731 H-1B/E-3 labor condition applications for this employer between Oct 2025 and Jun 2026 (latest Jun 2026) — the step every H-1B hire needs first. Source: LCA disclosure data (US Department of Labor (OFLC)).
- No salary bar for this route
- H-1B has no fixed salary bar: the employer must pay at least the prevailing wage for the role and area. Cap-subject employers enter a lottery weighted by wage level. Source: https://www.federalregister.gov/documents/2025/12/29/2025-23853/weighted-selection-process-for-registrants-and-petitioners-seeking-to-file-cap-subject-h-1b, rules effective 2026-02-27.
- What Intel Corporation paid sponsored hires in similar roles
- 287 certified filings for “Process Engineer” (Materials Engineers) in OR: $113k–$133k, median $133k. Most were filed at wage level III (87%) — 3 lottery entries, ≈46% projected selection odds for cap-subject employers. Source: US Department of Labor LCA disclosure data (Oct 2025 – Jun 2026).
US H-1B: cap-subject employers enter a lottery weighted by wage level — Level I gets 1 entry, Level IV gets 4 (DHS projected selection odds ≈15% at Level I to ≈61% at Level IV). Universities and non-profit research employers are cap-exempt. The $100,000 fee for new petitions from abroad is currently blocked by a court order (appeal pending).
A verdict summarises public evidence. It is not legal advice and never a guarantee: the employer and the immigration authority decide. Sign in to factor in where you can already work.
About the role
Job Details:
Job Description:
Embark with us on a journey of growth and transformation as we create exceptionally engineered technology and bring AI everywhere. As a valued team member, your adaptability and attention to detail will contribute to our drive for results and relentless pursuit of quality, ensuring we meet our customers' needs with precision.
Join us and build on our legacy of innovation and collaboration as we deliver world‑changing technology that improves the life of every person on the planet.
Life at Intel: https://jobs.intel.com/en/life-at-intel
At Intel's Logic Technology Development (LTD) we have continued to extend Moore's law to be world leaders in computing technology. To achieve the necessary scaling of our semiconductor manufacturing process, we have led the industry in developing enhancements such as strained silicon for carrier transport enhancement, high-k metal gates, and FINFETs. LTD has been at the center of every new development that has kept Moore's Law moving forward. TMI Integration plays a key role in the development of every new silicon process development. Our analysis builds the plan that allows LTD to take technology from the research phase to the high-volume manufacturing phase while maintaining high-quality standards. In the MIE organization, we engineer world-class yields on D1 processes by driving critical Fab and E-Test parameters to Best-in-Class targets. As a TMI Integration engineer, you will be responsible for identifying all the process parameters that impact yield and performance in an advanced silicon process technology. You will characterize the process using cutting-edge metrology tools. With this characterization, you will be responsible for creating a yield cliff parameter improvement roadmap. You will then work directly with modules and TD integration to drive that roadmap by developing and qualifying process fixes. This role provides an opportunity to influence Intel's future process technologies that will keep Moore's Law moving forward.
Responsibilities will include but will not be limited to:
• Provide navigation and leadership to meet Intel's yield objectives.
• Organizing and presenting process parameter summaries to LTD engineering teams.
• Partnering with Intel TD Integration, Yield, and Module engineers to drive root cause understanding for all critical process parameters.
• Institute ramp to manufacturing volumes to demonstrate the technology meets requirements while simultaneously transferring the technology to counterparts in manufacturing via the Copy Exactly Methodology.
• Hold the team and collaborators accountable for quality through TMIs and FTs.
• Role-model and establish a team culture of trust, collaboration, safety, accountability, and excellence.
• Build strong relationships with other LTD process and design teams based on mutual trust and respect.
• An ideal candidate should be willing to demonstrate the below behavioral traits - Strong data analysis and problem debug skills, Excellent communication skills, Understand and adhere to key Intel values.
Qualifications:
You must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates Experience listed below would be obtained through a combination of your schoolwork, classes, research and/or relevant previous job and/or internship experiences.
Minimum Qualifications:
The ideal candidate must possess at least one of the following:
• Bachelor's degree in Computer/Data Science, Physics, Materials Science and Engineering, Chemical Engineering, Electrical Engineering, Mechanical Engineering, Nuclear Engineering, Optics, Chemis
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