Module Engineer

Job Details: Job Description: Job Description Role and Impact Join Intel Wafer Packaging Manufacturing WPM C4 Ireland as a Module Engineer, and play a key role in advancing one of Intel most important manufacturing operations. Wafer Packaging Manufacturing is a critical part of semiconductor production, where processed silicon wafers are transformed through advanced processes such as bumping and interconnect formation. These steps enable chips to be electrically connected into packages and final products. It is a highly technical, process driven environment. C4 sits at the center of this capability, directly supporting product delivery, factory output, and customer commitments. As we scale, our focus is on building strong, high performing processes that consistently deliver for our customers across safety, quality, and output. This is a hands on role in a highly automated fab, working closely with technicians, engineers, and global partners. It follows a hybrid working model, with a minimum of 4 days per week on site, reflecting the importance of direct engagement with tools, processes, and teams. You will collaborate across a global Virtual Factory network, across Ireland, Oregon, and New Mexico, to share best practices and drive alignment, with a direct impact on process capability, technology ramps, and overall customer experience. Why Join WPM C4 Ireland? • Real impact, your work directly enables product delivery and customer success. • Quality focused culture, with strong emphasis on disciplined execution and continuous improvement. • One factory mindset, working across a globally connected manufacturing network. • Exposure to advanced wafer bumping and packaging technologies. • Strong ownership, and opportunity to drive visible improvements. Key Responsibilities • Own module performance across safety, quality, output, and equipment metrics. • Sustain and optimize processes to ensure stable, repeatable, high quality output. • Use data and statistical methods to reduce variation and strengthen process control. • Drive continuous improvement initiatives to improve robustness and performance. • Partner with 24 by 7 technician teams to rapidly contain and resolve issues. • Lead structured problem solving across cross functional teams. • Collaborate with the Virtual Factory to align standards and deploy best practices. • Support technology ramps, tool installs, and high volume manufacturing transitions. • Work with suppliers to improve tool capability and reliability. • Reinforce a culture of ownership, accountability, and continuous improvement. What You Will Bring? • Strong analytical and problem solving capability. • Experience in manufacturing or technical environments. • Ability to collaborate and influence across teams. • Semiconductor experience is an advantage. • Results driven mindset, with a focus on consistency and continuous improvement. What Success Looks Like? • Stable and high performing processes, delivering consistent results. • Improved process capability and reduced variation. • Strong execution of ramps into volume manufacturing. • Effective collaboration across global partners. • Contribution to a culture focused on doing things right, every time. Qualifications: Minimum Qualifications • Candidate must have a minimum of a Level 8 qualification , as per the National Framework of Qualifications NFQ, in an approved Science or Engineering discipline.. E.G: Bachelor degree in Mechanical Engineering, Chemical Engineering, Materials Science, Electrical Engineering, Physics, or a related STEM discipline. • 1+ years experience with a Bachelor degree, or completion of a Master degree in semiconductor or advanced manufacturing environments. • Strong analytical and problem solving cap