Jobs / United States / Intel Corporation

Intel Corporation

AI Silicon Performance Modeling and Analysis Engineer

US, California, Santa Clara Posted today

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Sponsorship verdict

Sponsorship possible

One solid signal, not two. Worth applying, and worth asking about sponsorship early.

  • Employer is on a government sponsor recordThe US Department of Labor certified 1,731 H-1B/E-3 labor condition applications for this employer between Oct 2025 and Jun 2026 (latest Jun 2026) — the step every H-1B hire needs first.
  • The posting doesn’t mention sponsorshipSilence isn’t a refusal — ask the recruiter before investing much time.
  • No salary bar for this routeH-1B has no fixed salary bar: the employer must pay at least the prevailing wage for the role and area.
  • What Intel Corporation paid sponsored hires in similar roles211 certified filings for “Component Design Engineer” (Electronics Engineers, Except Computer) in CA: $125k–$167k, median $142k.
  • Confirmed live todayWhen a source last listed this job as open.
Details and sources
Employer is on a government sponsor record
The US Department of Labor certified 1,731 H-1B/E-3 labor condition applications for this employer between Oct 2025 and Jun 2026 (latest Jun 2026) — the step every H-1B hire needs first. Source: LCA disclosure data (US Department of Labor (OFLC)).
No salary bar for this route
H-1B has no fixed salary bar: the employer must pay at least the prevailing wage for the role and area. Cap-subject employers enter a lottery weighted by wage level. Source: https://www.federalregister.gov/documents/2025/12/29/2025-23853/weighted-selection-process-for-registrants-and-petitioners-seeking-to-file-cap-subject-h-1b, rules effective 2026-02-27.
What Intel Corporation paid sponsored hires in similar roles
211 certified filings for “Component Design Engineer” (Electronics Engineers, Except Computer) in CA: $125k–$167k, median $142k. Most were filed at wage level III (43%) — 3 lottery entries, ≈46% projected selection odds for cap-subject employers. Source: US Department of Labor LCA disclosure data (Oct 2025 – Jun 2026).

US H-1B: cap-subject employers enter a lottery weighted by wage level — Level I gets 1 entry, Level IV gets 4 (DHS projected selection odds ≈15% at Level I to ≈61% at Level IV). Universities and non-profit research employers are cap-exempt. The $100,000 fee for new petitions from abroad is currently blocked by a court order (appeal pending).

A verdict summarises public evidence. It is not legal advice and never a guarantee: the employer and the immigration authority decide. Sign in to factor in where you can already work.

About the role

Job Details: Job Description: About the Role and Team The AI Silicon Architecture and Performance Engineering team is responsible for developing and maintaining performance models that enable architecture exploration, design evaluation, scalability analysis, and performance projection for next-generation AI silicon products. These models are a critical component of the product development process, providing early visibility into architectural tradeoffs, bottlenecks, and optimization opportunities long before silicon availability. We are seeking a highly experienced and motivated engineer to drive AI silicon performance modeling, validation, architectural analysis, and stakeholder engagement activities. The candidate will work closely with architects, performance stimulus generation teams, silicon design teams, and product stakeholders to evaluate and optimize key AI silicon subsystems that determine overall platform scalability and performance. The role focuses on performance modeling and analysis of AI SoC communication fabrics, memory subsystems, scale-up and scale-out interconnects, host-device memory paths, and end-to-end data movement infrastructure. The successful candidate will leverage SystemC/TLM-based modeling methodologies to generate actionable insights that directly influence architecture and product decisions. This position requires a unique combination of software development expertise, architecture understanding, analytical problem solving, and cross-functional technical leadership. The engineer will be expected to independently drive complex technical initiatives while serving as a trusted performance expert across multiple organizations. Key Responsibilities:   AI Silicon Performance Model Development   • Implement new architectural features and capabilities based on evolving product requirements. • Improve model fidelity, scalability, maintainability, and simulation performance.   • Perform detailed debugging and root-cause analysis of model issues and performance anomalies. • Contribute to the evolution of modeling infrastructure, methodologies, and best practices. • Develop, maintain, and enhance SystemC/TLM-based performance models representing critical AI silicon subsystems.   • • Drive modeling of key architectural components including: • SoC fabrics and on-chip communication networks • Memory controllers and memory subsystem behavior • Scale-up controllers and fabrics enabling accelerator-to-accelerator communication within a node, tray, or pod • Scale-out controllers and fabrics enabling communication across nodes, racks, and larger AI clusters • Host CPU to accelerator memory paths • Local, host, and remote memory access paths • End-to-end data movement architectures   Functional Validation and Model Correlation:   • Define and execute comprehensive validation strategies to ensure correctness and architectural accuracy of performance models. • Develop validation plans, regression suites, coverage methodologies, and quality metrics. • Correlate modeled behavior against architectural expectations, reference simulations, performance projections, and available hardware measurements. • Investigate and resolve discrepancies between expected and observed behavior. • Establish robust validation frameworks that improve stakeholder confidence in model-generated performance projections. • Continuously improve validation methodologies and model quality.     AI Silicon Performance Characterization and Architectural Analysis:   • Design and execute performance studies covering a wide range of workloads, traffic patterns, and system configurations. • Analyze performance of communication fabrics, memory systems, and data movement paths under representative AI workloads. • Evaluate bandwi

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