Engineer (Middle Assembly Line)

To develop, optimize, qualify, and establish robust semiconductor assembly processes for semiconductor packages, covering Molding, IR Reflow & Plating. The role is responsible for process development, optimization, qualification, technical problem-solving, and manufacturing readiness to ensure new products meet quality, reliability, productivity, and cost requirements. The engineer will work closely with NPI project management, Production, Process Engineering, Equipment Engineering, Quality Assurance, Product Engineering, Material Engineering, and other cross-functional teams to ensure successful product introduction and smooth transfer to mass production. Key Responsibilities A. NPI Process Development and Qualification • Develop, establish, and optimize assembly process conditions for new products in Molding , Reflow & Plating process. • Prepare and execute process development plans, engineering & qualification builds, and process validation activities. • Establish process parameters, specifications, control limits, and acceptance criteria. • Evaluate process feasibility, identify potential manufacturing risks, and implement preventive actions before mass production. • Review process capability, yield performance, defect trends, and qualification results. • Prepare technical reports, process documentation, and qualification summaries. • Support safe launch activities and ensure all critical process issues are resolved before mass production release. B. Multi-Process Engineering Responsibilities • Molding & PMC - Develop and optimize Molding process and other related process control for Molding. • IR Reflow - Develop and optimize IR Reflow process for new product • Plating & bake - Develop and optimize Plating parameters and other related process control for Plating process C. Cross-Functional Collaboration • Collaborate with Production, Equipment Eng, QA, Product Eng, Material Eng, and other relevant departments • Work with equipment and material suppliers to evaluate new technologies and improvement opportunities. • Provide technical support during engineering builds, qualification builds, troubleshooting, and production ramp-up. • Coordinate process readiness, material availability, and documentation before qualification and mass production. D. Documentation and Mass Production Transfer • Prepare and maintain process specifications, SOPs, work instructions, process flow documents, and risk assessments. • Maintain engineering records, process parameter histories, DOE results, and qualification reports. • Support PFMEA reviews and implementation of appropriate process controls. • Define critical-to-quality parameters and monitoring requirements. • Bachelor's Degree in Engineering (Major in Materials, Chemical , Manufacturing, or related disciplines). • Minimum 5 years experience in semiconductor assembly, packaging, or manufacturing engineering is preferred in MOL processes  (Molding~Plating) • Candidates with relevant experience in multiple assembly processes, particularly power semiconductor or power discrete packaging, will have an added advantage. Skills and Knowledge • Strong analytical, troubleshooting, and problem-solving skills. • Good understanding of semiconductor assembly processes and process interactions. • Knowledge of DOE, SPC, process capability analysis, FMEA, and structured root cause analysis. • Ability to interpret engineering data, identify process risks, and implement effective corrective actions. • Proficiency in Microsoft Excel and PowerPoint for data analysis, technical reporting, and presentation • Good communication and cross-functional collaboration skills. • Ability to manage multiple NPI activities and meet project milestones. Added Advantages • Experience in  SAW Q