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Intel Corporation

Module Equipment Development Engineer

US, Oregon, Hillsboro Posted today

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Sponsorship verdict

Sponsorship possible

One solid signal, not two. Worth applying, and worth asking about sponsorship early.

  • Employer is on a government sponsor recordThe US Department of Labor certified 1,731 H-1B/E-3 labor condition applications for this employer between Oct 2025 and Jun 2026 (latest Jun 2026) — the step every H-1B hire needs first.
  • The posting doesn’t mention sponsorshipSilence isn’t a refusal — ask the recruiter before investing much time.
  • No salary bar for this routeH-1B has no fixed salary bar: the employer must pay at least the prevailing wage for the role and area.
  • What Intel Corporation paid sponsored hires in similar roles287 certified filings for “Process Engineer” (Materials Engineers) in OR: $113k–$133k, median $133k.
  • Confirmed live todayWhen a source last listed this job as open.
Details and sources
Employer is on a government sponsor record
The US Department of Labor certified 1,731 H-1B/E-3 labor condition applications for this employer between Oct 2025 and Jun 2026 (latest Jun 2026) — the step every H-1B hire needs first. Source: LCA disclosure data (US Department of Labor (OFLC)).
No salary bar for this route
H-1B has no fixed salary bar: the employer must pay at least the prevailing wage for the role and area. Cap-subject employers enter a lottery weighted by wage level. Source: https://www.federalregister.gov/documents/2025/12/29/2025-23853/weighted-selection-process-for-registrants-and-petitioners-seeking-to-file-cap-subject-h-1b, rules effective 2026-02-27.
What Intel Corporation paid sponsored hires in similar roles
287 certified filings for “Process Engineer” (Materials Engineers) in OR: $113k–$133k, median $133k. Most were filed at wage level III (87%) — 3 lottery entries, ≈46% projected selection odds for cap-subject employers. Source: US Department of Labor LCA disclosure data (Oct 2025 – Jun 2026).

US H-1B: cap-subject employers enter a lottery weighted by wage level — Level I gets 1 entry, Level IV gets 4 (DHS projected selection odds ≈15% at Level I to ≈61% at Level IV). Universities and non-profit research employers are cap-exempt. The $100,000 fee for new petitions from abroad is currently blocked by a court order (appeal pending).

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About the role

Job Details: Job Description: The Role and Impact: As a Module Equipment Development Engineer, you will lead the development and optimization of advanced semiconductor manufacturing equipment and processes, enabling Intel to deliver high-performance devices. Your contributions will directly impact Intel's technological leadership in the semiconductor industry and advance the capabilities of future technologies. Business Group: Intel Foundry Technology Development is focused on advancing semiconductor process engineering and delivering world-class manufacturing solutions that power Intel's product innovation. Working within this group, you will collaborate with global teams to develop cutting-edge technologies that enable the design and production of leading-edge devices, helping Intel maintain its leadership in a competitive and fast-paced market. Key Responsibilities: • Develop Equipment capable of delivering on new process requirements in Dielectrics Thin Films. • Develop robust Equipment modules that can be transferred seamlessly to high volume manufacturing. • Collaborate with equipment and material suppliers to evaluate, qualify, and implement novel technologies into manufacturing processes • Support technology transfer to high-volume manufacturing through training, audits, and maintaining process consistency across sites • Design, execute, and analyze experiments to optimize advanced manufacturing processes, including material selection, equipment metrology, and parameter tuning • Perform feasibility studies and pathfinding activities to support innovative device architectures and future technology roadmaps • Utilize advanced data analysis methods, including Statistical Process Control (SPC) and Design of Experiments (DOE), to guide process improvements and enhance yield • Partner with cross-functional teams to ensure seamless process integration and manufacturability Qualifications: Minimum qualifications are required to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. Requirements listed would be obtained through a combination of industry relevant job experience, internship experiences and or schoolwork/classes/research.   Minimum Qualifications: • Bachelor's degree in Materials Science, Chemical Engineering, Physics, Chemistry, Electrical Engineering, or related STEM field, with 4+ years of industry experience in semiconductor processing OR • Master's degree in relevant STEM fields with 3+ years of domain-specific experience OR • PhD in Materials Science, Chemical Engineering, Physics, Chemistry, or related STEM field with 6+ months experience in semiconductor processing Industry experience in semiconductor processing/domain-specific experience includes one of more of the following: • Proficiency in semiconductor processing techniques such as lithography, etching, thin film deposition, or planarization • Expertise in process characterization methods and statistical analysis tools, such as JMP, MATLAB, or Python • Familiarity with materials characterization techniques like SEM, TEM, XPS, or ellipsometry Preferred Qualifications: • Hands-on experience working with equipment troubleshooting, maintenance, or development in collaboration with suppliers • Experience at a Semiconductor manufacturing tool supplier. • Knowledge of manufacturing technologies including vacuum processes, ALD, or CVD • Strong problem-solving skills with the ability to manage multiple tasks in a fast-paced environment • Collaborative mindset with a proven track record of working across interdisciplinary teams to achieve shared goals For information on Intel’s immigration sponsorship guidelines, pleas

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