New Mexico Wafer Packaging Manufacturing Advanced Packaging Die Pick Engineering Group Leader

Job Details: Job Description: The Role and Impact As a Module Engineering Manager, you will lead a team of engineers to support high-volume manufacturing processes and drive advancements within Intel's next-generation packaging technologies. You will oversee daily operations, facilitate continuous improvement initiatives, and execute engineering strategies that enhance safety, quality, and productivity. Your leadership will play a pivotal role in enabling Intel to deliver innovative, industry-leading products while fostering a collaborative and inclusive work environment. Business group Intel Corporation's Wafer Packaging Manufacturing (WPM) organization focuses on developing and sustaining advanced manufacturing processes to support Intel's high-volume production goals. This group plays a key role in enabling Intel's innovative packaging and semiconductor technologies, contributing to operational excellence, quality improvements, and cost efficiencies across Intel's global manufacturing network. Key Responsibilities • Lead and manage a team of engineers to support safe, high-volume manufacturing processes while driving continuous improvements in quality, output, cost, and yield. • Provide tactical direction and prioritize activities for sustaining operations, systematic troubleshooting, and process optimization. • Collaborate with cross-functional engineering and manufacturing teams to address integrated process and equipment challenges. • Develop and mentor engineers, cultivating technical expertise, leadership skills, and long-term growth opportunities within the team. You will also need to develop hands on technical expertise in the modules you own in order to drive the deep technical improvement projects required to drive the team to success. • Facilitate technology transfer and ensure matched processing across global sites through training sessions and audits. • Oversee the installation, qualification, and ramp production of Early Tool Sets during factory transitions. • Mentor and develop an internal technical team to facilitate the qualification and ramp of next generation Die Pick toolsets. • Develop and execute long-term strategies to enhance engineering capabilities and meet evolving manufacturing requirements. • Drive results through effective decision-making, goal setting, differentiated performance management, and maintaining accountability. • Champion a culture of innovation, inclusion, and disciplined execution to achieve operational excellence. Qualifications: Minimum qualifications are required to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.  Minimum Qualifications • Bachelor's degree in engineering, materials science, physics, or a related technical field with 6+ years of relevant experience. • Relevant experience should include the following: • 2+ years experience leading an engineering or manufacturing team with demonstrated ability to lead teams, manage performance, and drive results in alignment with organizational goals. • Experience in process characterization, troubleshooting, and process improvement within a high-volume manufacturing environment. • Experience with manufacturing practices and lean manufacturing principles. Preferred Qualifications • 4+ years experience with a Master's degree, or 2+ years of experience with a PhD. • Extensive experience leading engineering teams with a focus on operational excellence and innovation. • Advanced knowledge of semiconductor processing or packaging technologies. • Proven ability to collaborate with vendors and drive cross-functional results. • Exceptional communication and leadership skills with a track recor