Jobs / United States / Doordash INC
Layout Engineer - Labs, DoorDash Air
Doordash INC · 🇺🇸 San Francisco, CA
Sponsorship verdict
Sponsorship possible
One solid signal, not two — worth applying, and worth asking about sponsorship early.
- Employer is on a government sponsor recordThe US Department of Labor certified 396 H-1B/E-3 labor condition applications for this employer between Oct 2025 and Jun 2026 (latest Jun 2026) — the step every H-1B hire needs first. USCIS also records 147 H-1B approvals in FY2023. Source: LCA disclosure data (US Department of Labor (OFLC)).
- The posting doesn’t mention sponsorshipSilence isn’t a refusal — ask the recruiter before investing much time.
- No salary bar for this routeH-1B has no fixed salary bar: the employer must pay at least the prevailing wage for the role and area. Cap-subject employers enter a lottery weighted by wage level. Source: https://www.federalregister.gov/documents/2025/12/29/2025-23853/weighted-selection-process-for-registrants-and-petitioners-seeking-to-file-cap-subject-h-1b, rules effective 2026-02-27.
- What Doordash INC paid sponsored hires in similar roles2 certified filings for “Electrical Engineer – Labs” (Electrical Engineers) in CA: $134k–$250k, median $192k. Most were filed at wage level II (50%) — 2 lottery entries, ≈31% projected selection odds for cap-subject employers. Source: US Department of Labor LCA disclosure data (Oct 2025 – Jun 2026).
- Confirmed live todayWhen a source last listed this job as open.
US H-1B: cap-subject employers enter a lottery weighted by wage level — Level I gets 1 entry, Level IV gets 4 (DHS projected selection odds ≈15% at Level I to ≈61% at Level IV). Universities and non-profit research employers are cap-exempt. The $100,000 fee for new petitions from abroad is currently blocked by a court order (appeal pending).
A verdict summarises public evidence; it is not legal advice and never a guarantee — the employer and the immigration authority decide. Sign in to factor in where you can already work.
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Sponsor Radar — Doordash INC
The US Department of Labor certified 396 H-1B/E-3 labor condition applications for this employer between Oct 2025 and Jun 2026 (latest Jun 2026) — the step every H-1B hire needs first. USCIS also records 147 H-1B approvals in FY2023. Source: LCA disclosure data (US Department of Labor (OFLC)).
Past sponsorship or register membership never guarantees sponsorship for this vacancy or for you. Full Sponsor Radar for Doordash INC →
About the role
About Us DoorDash Labs, established in 2018, serves as the innovation hub for DoorDash, focusing on developing automation and robotics solutions to enhance last-mile logistics. The team's mission is to create technologies that support and augment human networks, aiming to improve efficiency for Dashers, merchants, and consumers alike. We’re ruthlessly focused on business impact. We are a highly senior team composed of former pioneers from a variety of different robotics industries. As of 2025, DoorDash has completed 10B lifetime deliveries. We’re focused on how to do the next 10B even better. About The Team DoorDash Labs is building the future of drone delivery, and you'll be our sole PCB Layout Engineer — owning the physical design of the electronics that get our aircraft flying and keep them safe. You'll take boards from schematic handoff through fabrication, assembly, and bring-up, turning complex mixed-signal designs into manufacturable, flight-ready hardware About The Role This is a high-ownership role on a small, highly senior team. You'll be the layout expert the hardware team relies on, partnering daily with electrical, mechanical, power, reliability, and manufacturing engineers. If you love owning the entire layout problem end-to-end — power, RF, and high-speed digital on the same dense board — and want your work flying on real aircraft delivering to real customers, we'd love to talk. Key Responsibilities • Own end-to-end PCB layout in Altium Designer — floorplanning, component placement, routing, and release to fabrication and assembly. • Design dense, multi-layer, controlled-impedance boards that combine power/motor-drive, RF/comms, and high-speed digital on a single flight-ready assembly. • Optimize layouts for the size, weight, and thermal constraints of airborne hardware while meeting signal- and power-integrity requirements. • Own DFM/DFA/DFT and produce complete fabrication and assembly packages — stackups, fab/assembly drawings, and Gerber/ODB++ outputs. • Apply EMI/EMC-aware layout and grounding strategies to meet reliability and regulatory requirements. • Create and maintain footprint/component libraries and establish layout standards for a fast-growing hardware program. • Partner closely with EE, mechanical, power, reliability, and manufacturing teams, and support board bring-up, debug, and rework. Required Qualifications • Bachelor’s or Master’s degree in Electrical Engineering or a related field, or equivalent hands-on PCB layout experience. • 8+ years of hands-on PCB layout experience, with a portfolio of complex, shipped multi-layer boards. • Expert-level proficiency in Altium Designer. • Proven ability to own board layout end-to-end, from placement and routing through fabrication and assembly release. • Strong command of signal integrity, power integrity, and controlled-impedance design (return paths, decoupling, stackup, and plane design). • Experience with mixed-signal layout spanning power, RF, and high-speed digital domains. • Working knowledge of DFM/DFA and IPC standards (e.g., IPC-2221/2222, IPC-A-600/610). • Excellent cross-functional collaboration skills and the ability to work independently as the sole layout owner. Preferred Qualifications • Experience with drone/UAV, aerospace, robotics, or EV (flight or motion) hardware. • Rigid-flex and flex PCB layout for weight- and space-constrained designs. • RF and antenna layout (GPS, 2.4/5 GHz, cellular/telemetry) with controlled impedance. • High-current power, ESC, or motor-drive layout experience. • ECAD↔MCAD co-design (Altium with SolidWorks or Creo). • High-reliability or harsh-environment design (vibration, thermal cycling). • Experience standing up layout processes and standards in an early-stage hardware organizati