Jobs / United States / General Motors Company
Engineering Group Manager- Electrical Integration & Numerical Optimization
General Motors Company · 🇺🇸 2 Locations
Sponsorship verdict
Sponsorship possible
One solid signal, not two — worth applying, and worth asking about sponsorship early.
- Employer is on a government sponsor recordThe US Department of Labor certified 606 H-1B/E-3 labor condition applications for this employer between Oct 2025 and Jun 2026 (latest Jun 2026) — the step every H-1B hire needs first. USCIS also records 267 H-1B approvals in FY2023. Source: LCA disclosure data (US Department of Labor (OFLC)).
- The posting doesn’t mention sponsorshipSilence isn’t a refusal — ask the recruiter before investing much time.
- No salary bar for this routeH-1B has no fixed salary bar: the employer must pay at least the prevailing wage for the role and area. Cap-subject employers enter a lottery weighted by wage level. Source: https://www.federalregister.gov/documents/2025/12/29/2025-23853/weighted-selection-process-for-registrants-and-petitioners-seeking-to-file-cap-subject-h-1b, rules effective 2026-02-27.
- What General Motors Company paid sponsored hires in similar roles2 certified filings for “Group Manager - Product & Customer Care, GM Energy” (Marketing Managers) in MI: $191k–$222k, median $206k. Most were filed at wage level IV (100%) — 4 lottery entries, ≈61% projected selection odds for cap-subject employers. Source: US Department of Labor LCA disclosure data (Oct 2025 – Jun 2026).
- Confirmed live todayWhen a source last listed this job as open.
US H-1B: cap-subject employers enter a lottery weighted by wage level — Level I gets 1 entry, Level IV gets 4 (DHS projected selection odds ≈15% at Level I to ≈61% at Level IV). Universities and non-profit research employers are cap-exempt. The $100,000 fee for new petitions from abroad is currently blocked by a court order (appeal pending).
A verdict summarises public evidence; it is not legal advice and never a guarantee — the employer and the immigration authority decide. Sign in to factor in where you can already work.
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Sponsor Radar — General Motors Company
The US Department of Labor certified 606 H-1B/E-3 labor condition applications for this employer between Oct 2025 and Jun 2026 (latest Jun 2026) — the step every H-1B hire needs first. USCIS also records 267 H-1B approvals in FY2023. Source: LCA disclosure data (US Department of Labor (OFLC)).
Past sponsorship or register membership never guarantees sponsorship for this vacancy or for you. Full Sponsor Radar for General Motors Company →
About the role
Job Description Why Join General Motors: Join the team shaping the platform behind GM’s next generation of software-defined vehicles. Vehicle Software & Electronics Platform Engineering connects electrical architecture, embedded systems, CI/CD, virtualization, and test infrastructure to help turn complex vehicle content into scalable, launch-ready products. This role is pivotal in ensuring electronics integration becomes a core consideration in vehicle architecture, not an afterthought. At GM, you will have the opportunity to lead at the center of vehicle innovation, influence how software and electronics come together physically across our global lineup, and build the capabilities that will enable faster, safer, smarter, and more cost-efficient vehicles. The Role: We are seeking an experienced, visionary leader to head Electrical Integration & Numerical Optimization . In this role, you will own the development of industry leading Numerical Optimization T ools that are used to determine the optimal placement of electronics in GM’s vehicles globally . You will lead the application of the se tools to lead the industry in integrat ion for GM’s next generation of vehicles. This leader thinks beyond traditional physical part packaging, using modeling, numerical optimization , and data to redefine how electrical and electronics systems are physically realized – bridging advanced analytical methods with real-world vehicle execution to translate complex trade-offs of inputs and outputs into clear, data-driven decisions that improve cost, performance, and development velocity at scale. This role directly shapes platform-level architecture decisions, compounding value across programs and scaling across the portfolio, improving both engineering efficiency and product competitiveness. In addition to leading numerical optimization, you will lead a team of experienced Physical Electrical Integration Engineers to apply the optimization tools while executing the following technologies: • Active Safety • Interior Lighting • Audio • Low Voltage Power • Chassis • Occupant Sensing & Comfort • Compute • Passive Safety • Connectivity • Propulsion • Displays • Vehicle Access & Security Unifying integration strategies across these areas, ensuring packaging, harness optimization, electrical integrity, manufacturability, and cross-functional execution are addressed consistently and early in vehicle development. This position reports to the Director of Electrical Engineering Integration , the organization responsible for the physical integration strategy of electronics across GM vehicles. What You'll Do (Responsibilities): You will drive one of the most cross-functional and high-impact areas of vehicle development at General Motors. • Develop and apply computer-driven optimization of physical product layout/design under real constraints like space, geometry, wiring rules, assembly efficiency, and serviceability. • Build advanced toolchains, methods, and processes that enable rapid optimization of design, packaging, and integration at the speed required for iterative development. • Optimize total enterprise cost across architectures and programs. • Optimize packaging for a given set of modules. • Inform the design of future electrical architectures. • Lead cross-functional collaboration and drive architecture and program development by laying out the electrical system alongside critical architectural systems such as body structure, propulsion, occupant package, and studio theme. • Shape advanced vehicle development by improving electronics packaging strategies that reduce wiring harness cost, complexity, and downstream tradeoff inefficiencies. • Develop expertise and s