Jobs / United States / Pure Storage INC
Product Engineer, NPI
Pure Storage INC · 🇺🇸 Santa Clara, California
Sponsorship verdict
Sponsorship possible
One solid signal, not two — worth applying, and worth asking about sponsorship early.
- Employer is on a government sponsor recordThe US Department of Labor certified 47 H-1B/E-3 labor condition applications for this employer between Oct 2025 and Jun 2026 (latest Mar 2026) — the step every H-1B hire needs first. USCIS also records 67 H-1B approvals in FY2023. Source: LCA disclosure data (US Department of Labor (OFLC)).
- The posting doesn’t mention sponsorshipSilence isn’t a refusal — ask the recruiter before investing much time.
- No salary bar for this routeH-1B has no fixed salary bar: the employer must pay at least the prevailing wage for the role and area. Cap-subject employers enter a lottery weighted by wage level. Source: https://www.federalregister.gov/documents/2025/12/29/2025-23853/weighted-selection-process-for-registrants-and-petitioners-seeking-to-file-cap-subject-h-1b, rules effective 2026-02-27.
- What Pure Storage INC paid sponsored hires in similar roles1 certified filing for “Product Quality Engineer” (Mechanical Engineers) in CA: $230k–$230k, median $230k. Most were filed at wage level IV (100%) — 4 lottery entries, ≈61% projected selection odds for cap-subject employers. Source: US Department of Labor LCA disclosure data (Oct 2025 – Jun 2026).
- Confirmed live todayWhen a source last listed this job as open.
US H-1B: cap-subject employers enter a lottery weighted by wage level — Level I gets 1 entry, Level IV gets 4 (DHS projected selection odds ≈15% at Level I to ≈61% at Level IV). Universities and non-profit research employers are cap-exempt. The $100,000 fee for new petitions from abroad is currently blocked by a court order (appeal pending).
A verdict summarises public evidence; it is not legal advice and never a guarantee — the employer and the immigration authority decide. Sign in to factor in where you can already work.
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Sponsor Radar — Pure Storage INC
The US Department of Labor certified 47 H-1B/E-3 labor condition applications for this employer between Oct 2025 and Jun 2026 (latest Mar 2026) — the step every H-1B hire needs first. USCIS also records 67 H-1B approvals in FY2023. Source: LCA disclosure data (US Department of Labor (OFLC)).
Past sponsorship or register membership never guarantees sponsorship for this vacancy or for you. Full Sponsor Radar for Pure Storage INC →
About the role
Everpure (NYSE: P) has evolved from storage pioneer to data platform, closing fiscal 2026 with $3.7 billion in revenue, its first billion-dollar quarter, and accelerating growth into FY27. Our strategic agenda spans the companies defining the next era of technology - hyperscalers, AI labs, the AI hardware supply chain, data platform providers, and the broader AI ecosystem. This type of work—work that changes the world—is what the tech industry was founded on. So, if you're ready to seize the endless opportunities and leave your mark, come join us. THE ROLE As a Product Engineer specializing in PCBA Manufacturing and DFM, you will drive the end-to-end design manufacturability, quality, and production readiness of next-generation printed circuit board assemblies powering high-performance server and storage systems. Partnering cross-functionally with Hardware Design, Mechanical Engineering, Test Engineering, and global Contract Manufacturers, you will establish high-yield manufacturing processes, optimize complex stack-ups, and safeguard signal integrity across critical data center hardware. In this high-impact role, your expertise directly ensures our hardware scales seamlessly from early design through full-volume production with industry-leading reliability. WHAT YOU'LL DO • PCB Architecture & Fabrication Optimization : Direct PCB material selection, multilayer stack-up design, dielectric properties, and fabrication requirements in partnership with hardware designers and fabrication suppliers to maximize signal integrity, ensure impedance control, and eliminate manufacturability risks before release. • SMT & Assembly Process Qualification : Define, optimize, and qualify SMT and mixed-technology assembly processes—including solder paste printing, component placement, reflow, and selective soldering—collaborating with Contract Manufacturers to achieve first-pass yield targets and robust solder joint integrity. • Advanced Defect Screening & Testability Engineering : Drive production readiness and defect elimination by deploying and calibrating automated inspection and test strategies (SPI, AOI, X-ray, ICT, and functional test) with test engineering teams, ensuring comprehensive probe access, boundary scan coverage, and rapid root-cause isolation. • DFX Reviews & BOM management (Via PLM Tool) : Lead comprehensive Gerber, fabrication drawing, assembly, test interaction and BOM reviews in PLM tools to mitigate design risks, optimize assembly hierarchies, and accelerate successful NPI transitions to high-volume manufacturing. Structure and maintain accurate BOMs in tools such as Agile, including part relationships, revisions, assembly and manufacturing data. WHAT YOU BRING • Expertise in PCB Fabrication & Stack-up Design : Mastery of PCB materials, dielectric properties, laminate systems, high-layer-count stack-ups, controlled impedance, and transmission-line behavior (including TDR and S-parameter analysis) for high-speed digital architecture. • Comprehensive SMT & PCBA Manufacturing Skills : Deep technical knowledge of surface-mount technology (SMT) assembly, solder paste printing, reflow profile optimization, pick-and-place process tuning, selective soldering, and IPC standards compliance for high-reliability electronics. • Advanced DFX & CAD Data Analysis : Expertise reviewing Gerber files, drill data, CAM tools, and manufacturing drawings to implement actionable Design for Manufacturability (DFM), Design for Assembly (DFA), and Design for Testability (DFT) improvements. • Data-Driven Quality & Inspection Mastery : Hands-on proficiency with process characterization tools including SPI, AOI, X-ray, ICT, test-point strategies, and statistical process control to identify root causes and drive continuous yield improvement.