Jobs / United States / Intel Corporation
Thermal Analysis Engineer
Intel Corporation · 🇺🇸 US, Arizona, Phoenix
Sponsorship verdict
Sponsorship possible
One solid signal, not two — worth applying, and worth asking about sponsorship early.
- Employer is on a government sponsor recordThe US Department of Labor certified 1,731 H-1B/E-3 labor condition applications for this employer between Oct 2025 and Jun 2026 (latest Jun 2026) — the step every H-1B hire needs first. USCIS also records 1,112 H-1B approvals in FY2023. Source: LCA disclosure data (US Department of Labor (OFLC)).
- The posting doesn’t mention sponsorshipSilence isn’t a refusal — ask the recruiter before investing much time.
- No salary bar for this routeH-1B has no fixed salary bar: the employer must pay at least the prevailing wage for the role and area. Cap-subject employers enter a lottery weighted by wage level. Source: https://www.federalregister.gov/documents/2025/12/29/2025-23853/weighted-selection-process-for-registrants-and-petitioners-seeking-to-file-cap-subject-h-1b, rules effective 2026-02-27.
- What Intel Corporation paid sponsored hires in similar roles78 certified filings for “Software Engineer” (Software Developers) in AZ: $111k–$140k, median $120k. Most were filed at wage level II (59%) — 2 lottery entries, ≈31% projected selection odds for cap-subject employers. Source: US Department of Labor LCA disclosure data (Oct 2025 – Jun 2026).
- Confirmed live todayWhen a source last listed this job as open.
US H-1B: cap-subject employers enter a lottery weighted by wage level — Level I gets 1 entry, Level IV gets 4 (DHS projected selection odds ≈15% at Level I to ≈61% at Level IV). Universities and non-profit research employers are cap-exempt. The $100,000 fee for new petitions from abroad is currently blocked by a court order (appeal pending).
A verdict summarises public evidence; it is not legal advice and never a guarantee — the employer and the immigration authority decide. Sign in to factor in where you can already work.
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Sponsor Radar — Intel Corporation
The US Department of Labor certified 1,731 H-1B/E-3 labor condition applications for this employer between Oct 2025 and Jun 2026 (latest Jun 2026) — the step every H-1B hire needs first. USCIS also records 1,112 H-1B approvals in FY2023. Source: LCA disclosure data (US Department of Labor (OFLC)).
Past sponsorship or register membership never guarantees sponsorship for this vacancy or for you. Full Sponsor Radar for Intel Corporation →
About the role
Job Details: Job Description: As a Semiconductor Research Engineer, you will drive scientific innovation and research that shapes the future of semiconductor technologies. This role focuses on designing, simulating, and developing novel devices, packages, and interconnects using device physics, electromagnetics, and advanced materials science. You'll lead hands-on experiments to build prototypes that demonstrate groundbreaking concepts and collaborate across teams to establish methodologies that optimize performance, reliability, and cost. Your contributions will directly impact Intel's advancements in assembly packaging platform technologies, ensuring the company remains at the forefront of the industry. Business Group Join Intel Corporation's Thermal Core Comp organization, a team dedicated to enabling next-generation semiconductor technologies. This group leverages cutting-edge research and development efforts to ensure Intel delivers innovative assembly and packaging solutions that advance device miniaturization, high-speed signaling, and thermomechanical capabilities. As part of this team, you'll contribute to Intel's mission of transforming technology landscapes and driving industry progress. The primary responsibilities for this role will include, but are not limited to: • Conduct research leveraging device physics, thermomechanical analysis, materials science, and process innovations to enable novel devices and systems. • Design and fabricate prototypes to demonstrate proof-of-concepts for groundbreaking packaging and interconnect technologies. • Perform electrical testing and establish methodologies for device characterization, including DC, RF signal analysis, pulsing, and stressing. • Develop process solutions across production modules, such as lithography, etch, diffusion, CVD, PVD, and CMP, to address technological challenges. • Plan and execute experiments in collaboration with device, reliability, and fabrication teams to benchmark results against industry standards. • Develop models and measurements to advance the understanding of device physics, packaging, and systems for future technology platforms. • Engage with external vendors and researchers to support collaborations and Intel's research pipeline. Qualifications: Minimum Qualifications : Minimum qualifications are required to be initially considered for this position. • Bachelor's or BS degree in Electrical Engineering, Physics, Materials Science, Mechanical Engineering, or a related field. • 6+ years of experience with a bachelor's degree, 4+ years with a master's degree, or 2+ years with a PhD. • Advanced experience in semiconductor fabrication processes, such as lithography, etch, diffusion, and packaging design methodologies. • Advanced experience in simulation tools (e.g., Ansys, Abaqus) for finite element analysis and computational fluid dynamics. • Advanced experience in programming skills in Python or MATLAB for engineering applications. • Hands-on experience with experimental setups and data analysis techniques for lab testing. Minimum Qualifications : Minimum qualifications are required to be initially considered for this position. • Experience with advanced packaging technologies, including EMIB and Foveros architectures. • Expertise in Design of Experiments (DOE), statistical analysis methods, and model-based problem-solving techniques. • Familiarity with materials characterization techniques and cross-disciplinary collaboration with academia and external partners. • Proven ability to lead and influence technical teams to achieve milestones and drive performance improvements. • Strong analytical and problem-solving abilities to address unique engineering challenges effectively. • Excellent organizational and commu