Jobs / United States / Intel Corporation
Senior Thin Film Metrology Engineer
Intel Corporation · 🇺🇸 2 Locations
Sponsorship verdict
Sponsorship possible
One solid signal, not two — worth applying, and worth asking about sponsorship early.
- Employer is on a government sponsor recordThe US Department of Labor certified 1,731 H-1B/E-3 labor condition applications for this employer between Oct 2025 and Jun 2026 (latest Jun 2026) — the step every H-1B hire needs first. USCIS also records 1,112 H-1B approvals in FY2023. Source: LCA disclosure data (US Department of Labor (OFLC)).
- The posting doesn’t mention sponsorshipSilence isn’t a refusal — ask the recruiter before investing much time.
- No salary bar for this routeH-1B has no fixed salary bar: the employer must pay at least the prevailing wage for the role and area. Cap-subject employers enter a lottery weighted by wage level. Source: https://www.federalregister.gov/documents/2025/12/29/2025-23853/weighted-selection-process-for-registrants-and-petitioners-seeking-to-file-cap-subject-h-1b, rules effective 2026-02-27.
- What Intel Corporation paid sponsored hires in similar roles287 certified filings for “Process Engineer” (Materials Engineers) in OR: $113k–$133k, median $133k. Most were filed at wage level III (87%) — 3 lottery entries, ≈46% projected selection odds for cap-subject employers. Source: US Department of Labor LCA disclosure data (Oct 2025 – Jun 2026).
- Confirmed live todayWhen a source last listed this job as open.
US H-1B: cap-subject employers enter a lottery weighted by wage level — Level I gets 1 entry, Level IV gets 4 (DHS projected selection odds ≈15% at Level I to ≈61% at Level IV). Universities and non-profit research employers are cap-exempt. The $100,000 fee for new petitions from abroad is currently blocked by a court order (appeal pending).
A verdict summarises public evidence; it is not legal advice and never a guarantee — the employer and the immigration authority decide. Sign in to factor in where you can already work.
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Sponsor Radar — Intel Corporation
The US Department of Labor certified 1,731 H-1B/E-3 labor condition applications for this employer between Oct 2025 and Jun 2026 (latest Jun 2026) — the step every H-1B hire needs first. USCIS also records 1,112 H-1B approvals in FY2023. Source: LCA disclosure data (US Department of Labor (OFLC)).
Past sponsorship or register membership never guarantees sponsorship for this vacancy or for you. Full Sponsor Radar for Intel Corporation →
About the role
Job Details: Job Description: About the Group The MDCE (Manufacturing Development and Customer Engineering) organization is responsible for enabling advanced manufacturing capability, metrology readiness, and yield learning across Intel’s global high-volume manufacturing (HVM) fabs, including Arizona, Ireland, Israel, Oregon, and other global sites. As part of Intel’s IDM 2.0 strategy, MDCE plays a critical role in supporting rapid technology transitions, high volume manufacturing ramp up, and sustained manufacturing excellence for both internal products and external foundry customers. About the Role This requisition seeks a Senior Thin Film Metrology Engineer to support 18A (1278) technology within the Thin Film Metrology area. The engineer will be responsible for driving thin film metrology execution across the segment, including recipe development, process qualification, production support, tool ownership, and technical problem solving. The role requires close collaboration with fab, process, and technology development teams to ensure successful execution throughout the early HVM ramp and sustaining production phases, while supporting the Thin Film Metrology roadmap and strategic objectives. The selected candidate will work closely with fab module teams, Process Integration, Yield, and Technology Development (TD) organizations to ensure thin film metrology capability, readiness, and continuous improvement. Key Responsibilities • Perform detailed data analysis using various statistical/data mining tools to identify the root cause of parametric mismatches and OCD model integrity. • Provide technical guidance on thin film process monitoring, tool matching, and metrology optimization. • Lead/participate in continuous improvement projects on products and processes for improved yield performance. • Provide expertise on process flow segments and control all aspects analysis related to these areas. • Lead/participate in multi-area problem solving teams to provide model expertise to troubleshoot complex yield problems. • Design and implement metrology models to deliver quick, precise feedback on product integrity and resolve yield-impacting issues. • Collaborate closely with: • • Technology Development teams • • Yield organizations • • Process Integration teams • • Fab module teams • Drive thin film metrology readiness for 18A technology introductions into production fabs. • Ensure alignment of metrology capability, sampling strategies, and tool readiness with manufacturing and technology requirements. • Drive cross‑site alignment and best‑practice sharing across global manufacturing fabs. • Execute new product introductions and enable design-technology co-optimization through participation in factory task forces and design of experiments Core Competencies • Strong problem‑solving capability and communication skills, with the ability to distill complex technical information for diverse audiences. • Proven ability to manage and execute multiple projects simultaneously, meeting tight deadlines without compromising quality. • Track record of success working in matrixed organizations with competing priorities. • Demonstrate experience in cross-functional teamwork and collaboration. • Excellent verbal and written communication skills. • Passion for innovation and driving meaningful results in a fast-paced environment Qualifications: Minimum Qualifications • Bachelor's degree in Chemical Engineering, Materials Science, Electrical Engineering, Mechanical Engineering, Physics, or in a related engineering/science field. • 4+ years of experience in thin film metrology techniques, applications and their interaction with high‑volume manufacturing. • 4+ years of experience in adv