Jobs / United States / Intel Corporation

Ocotillo Technology Fabrication Defect Metrology Layer Owner

Intel Corporation · 🇺🇸 US, Arizona, Phoenix

Sponsorship verdict

Posting rules out sponsorship

The posting rules out sponsorship or requires citizenship/clearance.

  • Employer is on a government sponsor recordThe US Department of Labor certified 1,731 H-1B/E-3 labor condition applications for this employer between Oct 2025 and Jun 2026 (latest Jun 2026) — the step every H-1B hire needs first. USCIS also records 1,112 H-1B approvals in FY2023. Source: LCA disclosure data (US Department of Labor (OFLC)).
  • The posting doesn’t mention sponsorshipSilence isn’t a refusal — ask the recruiter before investing much time.
  • No salary bar for this routeH-1B has no fixed salary bar: the employer must pay at least the prevailing wage for the role and area. Cap-subject employers enter a lottery weighted by wage level. Source: https://www.federalregister.gov/documents/2025/12/29/2025-23853/weighted-selection-process-for-registrants-and-petitioners-seeking-to-file-cap-subject-h-1b, rules effective 2026-02-27.
  • What Intel Corporation paid sponsored hires in similar roles3 certified filings for “Program Manager Technical” (Information Technology Project Managers) in AZ: $157k–$205k, median $157k. Most were filed at wage level IV (100%) — 4 lottery entries, ≈61% projected selection odds for cap-subject employers. Source: US Department of Labor LCA disclosure data (Oct 2025 – Jun 2026).
  • Security clearance mentionedFrom the posting’s own wording.
  • Confirmed live todayWhen a source last listed this job as open.

US H-1B: cap-subject employers enter a lottery weighted by wage level — Level I gets 1 entry, Level IV gets 4 (DHS projected selection odds ≈15% at Level I to ≈61% at Level IV). Universities and non-profit research employers are cap-exempt. The $100,000 fee for new petitions from abroad is currently blocked by a court order (appeal pending).

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Requirement gap

The posting mentions a security clearance — usually restricted to citizens of that country.

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Sponsor Radar — Intel Corporation

1,731 H-1B filings certified since Oct 2025

The US Department of Labor certified 1,731 H-1B/E-3 labor condition applications for this employer between Oct 2025 and Jun 2026 (latest Jun 2026) — the step every H-1B hire needs first. USCIS also records 1,112 H-1B approvals in FY2023. Source: LCA disclosure data (US Department of Labor (OFLC)).

Past sponsorship or register membership never guarantees sponsorship for this vacancy or for you. Full Sponsor Radar for Intel Corporation →

About the role

Job Details: Job Description: Intel is looking for highly motivated individuals with strong technical background and capabilities to sustain, ramp, and transfer all technology nodes in Arizona. They will drive rapid continuous improvements in safety, quality, yield, reliability, cost, process stability/capability, and productivity while maintaining rigorous quality control. Intel Foundry is increasing its investment in defect metrology technology, implementing a new Win It Inline initiative using advanced real-time monitoring to improve yield learning cycles. Investing in inline metrology will give engineers more data throughout the manufacturing process, as opposed to waiting for end of the line data - a fundamental shift in how we leverage data to build chips. The Defect Metrology Layer Owner role is to deliver high-quality analytical insights that influences / directs the factory resources to minimize defects for a segment of the manufacturing line by working with the process engineers for that segment to improve the capability of the tools and process. The primary responsibilities for this role will include, but are not limited to: • Performing detailed data analysis using various statistical/data mining tools to identify the root cause of defect issues. • Identifying exclusionary or baseline sources of defects and recommending/leading corrective actions/fixes. • Lead/participate continuous improvement projects on products and processes for improved defect performance. • Provide expertise on process flow segments and control all aspects of defect analysis related to these areas. • Lead/participate in multi-area problem solving teams to provide defect reduction expertise to troubleshoot complex yield problems. A successful candidate will demonstrate the following skills and behavioral traits: • Analytical skills and a passion for data analysis and problem solving. • Organizational skills with an attention to detail. • Interpersonal skills with the ability to work with people at all levels. • Communication and presentation skills to influence a wide variety of groups at all levels. • Support manufacturing technicians and interact with on-site vendor field service engineering, the capability of working in a high performing team culture which includes excellent teamwork and leadership skills, demonstrated problem solving and prioritization skills, and driving high performance maintenance goals for the group. Qualifications: You must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. Minimum Qualifications: • Bachelor's Degree in Electrical Engineering, Microelectronics Engineering, Material Science Engineering, Chemical Engineering, Mechanical Engineering, Optical Engineering, Statistics/Data Science, Chemistry, Physics, or related field of study • 2+ years relevant experience in Semiconductor fabrication and processing techniques (Lithography, Etch, CMP, Thin Films, Plating, etc.) OR Master’s degree in related field • Experience with Statistical Process Control (SPC), Design of experiments (DOE) principles, and Statistical data analysis Preferred Qualifications: • Active US Government TS Security Clearance with SCI access OR the ability to obtain and maintain a US Government TS Security Clearance with SCI access (requires US Citizenship) • Statistical Data Analysis and Programing Experience in JMP/JSL, Python, R and SQL. • 3+ years of New Technology startup experience. • 3+ years of relevant experience in Process/Yield Engineering. • Demonstrate strong technical and troubleshooting skills. • Experience in manufacturing environment. • Exp

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Source: Employer career site (Workday) First seen: 2026-10-01 Last confirmed: 2026-10-02 How our data works → Report this job

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