Jobs / United States / Intel Corporation
Senior Thin Films Metals Deposition Engineer
Intel Corporation · 🇺🇸 US, Oregon, Hillsboro
Sponsorship verdict
Sponsorship possible
One solid signal, not two — worth applying, and worth asking about sponsorship early.
- Employer is on a government sponsor recordThe US Department of Labor certified 1,731 H-1B/E-3 labor condition applications for this employer between Oct 2025 and Jun 2026 (latest Jun 2026) — the step every H-1B hire needs first. USCIS also records 1,112 H-1B approvals in FY2023. Source: LCA disclosure data (US Department of Labor (OFLC)).
- The posting doesn’t mention sponsorshipSilence isn’t a refusal — ask the recruiter before investing much time.
- No salary bar for this routeH-1B has no fixed salary bar: the employer must pay at least the prevailing wage for the role and area. Cap-subject employers enter a lottery weighted by wage level. Source: https://www.federalregister.gov/documents/2025/12/29/2025-23853/weighted-selection-process-for-registrants-and-petitioners-seeking-to-file-cap-subject-h-1b, rules effective 2026-02-27.
- What Intel Corporation paid sponsored hires in similar roles287 certified filings for “Process Engineer” (Materials Engineers) in OR: $113k–$133k, median $133k. Most were filed at wage level III (87%) — 3 lottery entries, ≈46% projected selection odds for cap-subject employers. Source: US Department of Labor LCA disclosure data (Oct 2025 – Jun 2026).
- Confirmed live todayWhen a source last listed this job as open.
US H-1B: cap-subject employers enter a lottery weighted by wage level — Level I gets 1 entry, Level IV gets 4 (DHS projected selection odds ≈15% at Level I to ≈61% at Level IV). Universities and non-profit research employers are cap-exempt. The $100,000 fee for new petitions from abroad is currently blocked by a court order (appeal pending).
A verdict summarises public evidence; it is not legal advice and never a guarantee — the employer and the immigration authority decide. Sign in to factor in where you can already work.
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Sponsor Radar — Intel Corporation
The US Department of Labor certified 1,731 H-1B/E-3 labor condition applications for this employer between Oct 2025 and Jun 2026 (latest Jun 2026) — the step every H-1B hire needs first. USCIS also records 1,112 H-1B approvals in FY2023. Source: LCA disclosure data (US Department of Labor (OFLC)).
Past sponsorship or register membership never guarantees sponsorship for this vacancy or for you. Full Sponsor Radar for Intel Corporation →
About the role
Job Details: Job Description: About the Group Manufacturing Development Customer Engineering (MDCE) is a new organization within Intel Foundry Technology Manufacturing focused on improving process capability for Intel's technology nodes from initial product qualification to high volume manufacturing with the vision of making technology ramp a competitive advantage for Intel foundry. This team is responsible for transferring new technologies into high-volume manufacturing, driving process optimization and continuous improvement, resolving complex yield and manufacturing issues, partnering closely with technology development and factory teams to ensure robust, predictable silicon delivery. About the Role MDCE Metals Deposition Engineer is responsible for enabling best-in-class process performance and manufacturability for advanced metals deposition modules across Intel 18A, Intel 3, and Intel 12nm technology nodes. This role sits at the intersection of Technology Development (TD), High Volume Manufacturing (HVM), and Customer Engineering, driving module readiness from early development through full HVM ramp and sustaining. The Ideal Candidate Will Possess • Leadership and Trust: Strong leadership, resourcefulness, and the ability to manage extremely sensitive information. • Competency, Performance: A high performer with a track record of significant accomplishments. • Experience Expertise: Cross-functional team leadership is a plus, significant expertise spanning multiple technology nodes and modules driving improvement to yield, performance, variation. • Technical and Business Acumen: A combination of technical capability, business acumen, and executive expertise to drive results across multiple groups and disciplines. • Communication Skills: Excellent written and verbal communication skills, with the ability to interpret and present technical information clearly to various audiences. • Initiative and Perseverance: Strong self-initiative, persistence, and the ability to navigate ambiguity and drive clarity in key areas. • Detail Orientation: Ability to gather, analyze, and interpret data to drive results. • Pressure Handling: Willingness to handle high degrees of task and deadline pressure in a dynamic environment while remaining focused. • Industry Knowledge: Deep knowledge of technology development and manufacturing strategies, products, processes, fab structure, and transfer methodology. Demonstrated ability to understand and interpret industry trends, create and drive strategies, work independently, simultaneously manage diverse and extensive assignments while remaining organized and productive. • Cultural Change: Demonstrated results in driving organizational culture change through workplace of choice efforts. Job Responsibilities Include but Are Not Limited To: • Strategic Alignment and Customer-first Execution: Align organizational goals with technical vision, formulate technical strategies to deliver cutting-edge solutions, and demonstrate relentless execution to meet customer needs on time. • Synthesis of Diverse Information: Ability to gather diverse inputs, uplevel to the right strategic response. • Problem Solving: Own the resolution of technical challenges and integrate solutions across multiple groups (including technology development and high volume manufacturing) Demonstrated ability to perform data driven root cause analysis using structured problem-solving methods and common data/analytics tools. • Collaboration: Work closely with direct and extended technology development (TD) and manufacturing (TFSM) members and Business Groups to achieve common goals. • Stakeholder Engagement: Engage and interface with internal and external stakeholders, including Integration, Device, Yield, Defect Metrology