Jobs / United States / Intel Corporation
Process Integration and Yield Technician (ICE)
Intel Corporation · 🇺🇸 US, Oregon, Hillsboro
Sponsorship verdict
Sponsorship possible
One solid signal, not two — worth applying, and worth asking about sponsorship early.
- Employer is on a government sponsor recordThe US Department of Labor certified 1,731 H-1B/E-3 labor condition applications for this employer between Oct 2025 and Jun 2026 (latest Jun 2026) — the step every H-1B hire needs first. USCIS also records 1,112 H-1B approvals in FY2023. Source: LCA disclosure data (US Department of Labor (OFLC)).
- The posting doesn’t mention sponsorshipSilence isn’t a refusal — ask the recruiter before investing much time.
- No salary bar for this routeH-1B has no fixed salary bar: the employer must pay at least the prevailing wage for the role and area. Cap-subject employers enter a lottery weighted by wage level. Source: https://www.federalregister.gov/documents/2025/12/29/2025-23853/weighted-selection-process-for-registrants-and-petitioners-seeking-to-file-cap-subject-h-1b, rules effective 2026-02-27.
- What Intel Corporation paid sponsored hires in similar roles287 certified filings for “Process Engineer” (Materials Engineers) in OR: $113k–$133k, median $133k. Most were filed at wage level III (87%) — 3 lottery entries, ≈46% projected selection odds for cap-subject employers. Source: US Department of Labor LCA disclosure data (Oct 2025 – Jun 2026).
- Confirmed live todayWhen a source last listed this job as open.
US H-1B: cap-subject employers enter a lottery weighted by wage level — Level I gets 1 entry, Level IV gets 4 (DHS projected selection odds ≈15% at Level I to ≈61% at Level IV). Universities and non-profit research employers are cap-exempt. The $100,000 fee for new petitions from abroad is currently blocked by a court order (appeal pending).
A verdict summarises public evidence; it is not legal advice and never a guarantee — the employer and the immigration authority decide. Sign in to factor in where you can already work.
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Sponsor Radar — Intel Corporation
The US Department of Labor certified 1,731 H-1B/E-3 labor condition applications for this employer between Oct 2025 and Jun 2026 (latest Jun 2026) — the step every H-1B hire needs first. USCIS also records 1,112 H-1B approvals in FY2023. Source: LCA disclosure data (US Department of Labor (OFLC)).
Past sponsorship or register membership never guarantees sponsorship for this vacancy or for you. Full Sponsor Radar for Intel Corporation →
About the role
Job Details: Job Description: Intel’s Wafer Packaging Manufacturing organization supports semiconductor wafer processing, testing, and die-to-wafer assembly. We are seeking two ORAP (Oregon Advanced Packaging) Integration Yield Technicians to provide manufacturing sustaining and engineering development support across HBI, WLA, Die Prep, and TSVr. You will work closely with integration engineers, factory operations, and cross-functional teams to resolve material issues, contain process excursions, and keep work in process moving safely through the factory. This hands-on role combines real-time troubleshooting, lot disposition, defect investigation, and continuous improvement. HBI ramp support is a major focus, alongside sustaining support for other packaging operations. This position requires regular onsite presence and work in a cleanroom environment using required protective clothing and equipment, including coveralls, hoods, booties, safety glasses, and gloves. The role includes extended periods of standing or sitting while performing technical duties. Shift and coverage: Work a shift 8 compressed work week schedule on the front half of the week or back half of the week. The schedule will consist of three twelve-hour day/nights in a row followed by a four-day/night week every other week (Sunday-Tuesday every other Wednesday 12:00 p.m-12:30 a.m.) or (Thursday-Saturday every other Wednesday 12:00p.m-12:30am). Work in a clean room environment wearing coveralls hoods booties safety glasses and gloves as needed. Spend the majority of time (more than 90 percent less break time) standing/sitting for 9 hours. Be able to lift 11-25lbs. Key responsibilities • Manage material disposition and lot movement. Review held lots, investigate barriers to processing, and execute authorized lot releases, splits, merges, scraps, and conversions in accordance with established procedures. • Maintain accurate manufacturing instructions and flows. Update lot plans, routes, operations, attributes, special instructions, and slot maps to support manufacturing and engineering requirements. • Troubleshoot manufacturing systems and automation issues. Resolve or escalate quantity mismatches, transfer issues, slot discrepancies, carrier identification problems, shipping errors, and other issues affecting material movement. • Respond to factory escalations and process excursions. Serve as an initial point of contact for integration issues, participate in assigned on-call coverage, contain material outside approved process conditions, and escalate risks appropriately. • Support defect investigation and failure analysis. Perform visual and microscope inspections, execute defect inking and disposition activities, collect inspection data, and coordinate material collection and shipment for failure analysis. • Collect and communicate technical data. Use manufacturing systems, SQL, iTech, and Microsoft applications to extract lot information, perform basic analyses, and document findings supporting engineering decisions. • Coordinate daily factory support. Participate in integration huddles, held-lot reviews, and operational follow-up; communicate material status, outstanding actions, and unresolved issues across teams. • Strengthen process quality and team capability. Help refine best-known methods and standard procedures, support engineering experiments, share knowledge with peers, and demonstrate safe, quality-focused behavior, including Stop the Job when appropriate. Behavioral skills: • Commitment with quality. • Critical thinking • Ability to deal with ambiguous situations • Prioritization skills in a highly dynamic environment • Ability to work well across multiple teams • Excellent written, and verbal communication skills • Ability to p