Jobs / United States / Intel Corporation
Substrate Packaging Research and Development Engineer
Intel Corporation · 🇺🇸 US, Arizona, Phoenix
Sponsorship verdict
Sponsorship possible
One solid signal, not two — worth applying, and worth asking about sponsorship early.
- Employer is on a government sponsor recordThe US Department of Labor certified 1,731 H-1B/E-3 labor condition applications for this employer between Oct 2025 and Jun 2026 (latest Jun 2026) — the step every H-1B hire needs first. USCIS also records 1,112 H-1B approvals in FY2023. Source: LCA disclosure data (US Department of Labor (OFLC)).
- The posting doesn’t mention sponsorshipSilence isn’t a refusal — ask the recruiter before investing much time.
- No salary bar for this routeH-1B has no fixed salary bar: the employer must pay at least the prevailing wage for the role and area. Cap-subject employers enter a lottery weighted by wage level. Source: https://www.federalregister.gov/documents/2025/12/29/2025-23853/weighted-selection-process-for-registrants-and-petitioners-seeking-to-file-cap-subject-h-1b, rules effective 2026-02-27.
- What Intel Corporation paid sponsored hires in similar roles45 certified filings for “Packaging Engineer” (Electronics Engineers, Except Computer) in AZ: $115k–$143k, median $139k. Most were filed at wage level III (59%) — 3 lottery entries, ≈46% projected selection odds for cap-subject employers. Source: US Department of Labor LCA disclosure data (Oct 2025 – Jun 2026).
- Confirmed live todayWhen a source last listed this job as open.
US H-1B: cap-subject employers enter a lottery weighted by wage level — Level I gets 1 entry, Level IV gets 4 (DHS projected selection odds ≈15% at Level I to ≈61% at Level IV). Universities and non-profit research employers are cap-exempt. The $100,000 fee for new petitions from abroad is currently blocked by a court order (appeal pending).
A verdict summarises public evidence; it is not legal advice and never a guarantee — the employer and the immigration authority decide. Sign in to factor in where you can already work.
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Sponsor Radar — Intel Corporation
The US Department of Labor certified 1,731 H-1B/E-3 labor condition applications for this employer between Oct 2025 and Jun 2026 (latest Jun 2026) — the step every H-1B hire needs first. USCIS also records 1,112 H-1B approvals in FY2023. Source: LCA disclosure data (US Department of Labor (OFLC)).
Past sponsorship or register membership never guarantees sponsorship for this vacancy or for you. Full Sponsor Radar for Intel Corporation →
About the role
Job Details: Job Description: As a Packaging Module Development Engineer, you will play a vital role in advancing Intel's semiconductor manufacturing capabilities by developing innovative packaging processes and equipment. Your day-to-day responsibilities will focus on optimizing assembly methods to achieve quality, reliability, and efficiency goals in high-volume manufacturing environments. By collaborating with cross-functional teams, you will help shape Intel's next-generation packaging technologies, directly contributing to the company's success in the semiconductor industry. Business group This position is part of Intel Corporation's Substrate Packaging Technology Development (SPTD) organization, which drives advancements in substrate packaging to support Intel's global technology leadership. The group focuses on delivering next-generation solutions for high-performance and mobile computing applications, enabling heterogeneous integration and die disaggregation across Intel's product portfolio. Key Responsibilities • Develop and optimize advanced packaging processes, materials, and equipment to meet reliability, quality, and cost targets. • Design and implement process specifications, workflows, and equipment configurations for new technologies. • Conduct design of experiments (DOE) to characterize process windows and interactions between equipment, materials, and chemistry. • Drive continuous improvement efforts to enhance process capability, stability, and productivity. • Collaborate with cross-functional teams to resolve technical challenges and deliver impactful solutions. • Establish material specifications and partner with suppliers to ensure adherence to performance and quality standards. • Document advancements and process innovations through technical reports and white papers. • Provide sustaining support for equipment performance and process health in high-volume manufacturing environments. Behavioral traits: • Team Collaboration: Works effectively across cross-functional teams and builds strong partnerships. • Comfort with Ambiguity: Thrives in undefined or evolving projects and takes initiative to create direction. • Performs Under Pressure: Manages multiple priorities, tight deadlines, and technical challenges while remaining focused on results. • Conflict Resolution: Handles disagreements professionally, using data and communication to align stakeholders and reach solutions. • Ownership & Problem Solving: Takes accountability, proactively addresses issues, and drives innovative solutions to completion. Qualifications: Minimum qualifications are required to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. Minimum Qualifications • PhD degree in Materials Science, Mechanical Engineering, Electrical Engineering, Chemical Engineering, Organic Chemistry, Polymer Engineering, or other similar engineering degree and 1+years of related experience. • 1+year of experience in: • Combining engineering judgement and data analysis skills to draw conclusions, build models and design experiments. • Materials science and engineering, and in material characterization techniques. • Knowledge and experience in design of experiments (DOE), statistical data analysis and statistical process control (SPC). Preferred Qualifications • Working knowledge and/or prior experience in optics and lasers, laser micro-machining and micro-fabrication. Become part of Intel's cutting-edge technology development team, where your expertise and creativity will drive innovation and shape the future of semiconductor manufacturing. Apply today and join us in advancing the boundaries of what's