Jobs / United States / Intel Corporation
Process Integration Development Engineer - TD Defect Metrology
Intel Corporation · 🇺🇸 US, Oregon, Hillsboro
Sponsorship verdict
Sponsorship possible
One solid signal, not two — worth applying, and worth asking about sponsorship early.
- Employer is on a government sponsor recordThe US Department of Labor certified 1,731 H-1B/E-3 labor condition applications for this employer between Oct 2025 and Jun 2026 (latest Jun 2026) — the step every H-1B hire needs first. USCIS also records 1,112 H-1B approvals in FY2023. Source: LCA disclosure data (US Department of Labor (OFLC)).
- The posting doesn’t mention sponsorshipSilence isn’t a refusal — ask the recruiter before investing much time.
- No salary bar for this routeH-1B has no fixed salary bar: the employer must pay at least the prevailing wage for the role and area. Cap-subject employers enter a lottery weighted by wage level. Source: https://www.federalregister.gov/documents/2025/12/29/2025-23853/weighted-selection-process-for-registrants-and-petitioners-seeking-to-file-cap-subject-h-1b, rules effective 2026-02-27.
- What Intel Corporation paid sponsored hires in similar roles287 certified filings for “Process Engineer” (Materials Engineers) in OR: $113k–$133k, median $133k. Most were filed at wage level III (87%) — 3 lottery entries, ≈46% projected selection odds for cap-subject employers. Source: US Department of Labor LCA disclosure data (Oct 2025 – Jun 2026).
- Confirmed live todayWhen a source last listed this job as open.
US H-1B: cap-subject employers enter a lottery weighted by wage level — Level I gets 1 entry, Level IV gets 4 (DHS projected selection odds ≈15% at Level I to ≈61% at Level IV). Universities and non-profit research employers are cap-exempt. The $100,000 fee for new petitions from abroad is currently blocked by a court order (appeal pending).
A verdict summarises public evidence; it is not legal advice and never a guarantee — the employer and the immigration authority decide. Sign in to factor in where you can already work.
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Sponsor Radar — Intel Corporation
The US Department of Labor certified 1,731 H-1B/E-3 labor condition applications for this employer between Oct 2025 and Jun 2026 (latest Jun 2026) — the step every H-1B hire needs first. USCIS also records 1,112 H-1B approvals in FY2023. Source: LCA disclosure data (US Department of Labor (OFLC)).
Past sponsorship or register membership never guarantees sponsorship for this vacancy or for you. Full Sponsor Radar for Intel Corporation →
About the role
Job Details: Job Description: Embark with us on a journey of growth and transformation as we create exceptionally engineered technology and bring AI everywhere. As a valued team member, your adaptability and attention to detail will contribute to our drive for results and relentless pursuit of quality, ensuring we meet our customers' needs with precision. Join us and build on our legacy of innovation and collaboration as we deliver world‑changing technology that improves the life of every person on the planet. Life at Intel: https://jobs.intel.com/en/life-at-intel As a Process Integration Development Engineer, you will play a pivotal role in advancing semiconductor technology by designing, executing, and analyzing experiments to enhance process performance. Using cutting-edge materials and equipment, you will develop integrated solutions to meet quality, reliability, and manufacturability requirements, driving technology transfer to high-volume manufacturing. Your work will directly contribute to optimizing outputs and shaping Intel's future innovations. Joining Intel Foundry's Logic Technology Development (LTD), you will be part of a team focused on driving advancements in silicon process technology. LTD is at the forefront of sustaining Moore's Law by enabling world-class semiconductor manufacturing. The group collaborates across engineering disciplines to develop processes that meet Intel's high standards for yield, performance, and reliability, ensuring the delivery of groundbreaking technology to our customers. Your responsibilities may include but not limited to: • Plan and execute experiments to fully characterize processes throughout the development cycle and improve product performance. • Develop and qualify materials and equipment to meet reliability, cost, and manufacturability requirements. • Conduct feasibility studies and identify process solutions in collaboration with product and module engineering teams. • Leverage big data analysis to identify and resolve process design weaknesses or manufacturing tool issues. • Lead new product qualifications and ensure seamless technology transfers to high-volume manufacturing using the Copy Exactly methodology. • Collaborate with development teams and material suppliers to align processes with technology roadmaps. • Organize and present process solutions to engineering teams to address customer requests or resolve issues. Qualifications: Candidates must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. The experience listed below may be obtained through schoolwork, classes and project work, internships, military training, and/or work experience. Minimum Qualifications : • Ph.D. in Computer Science, Physics, Materials Science and Engineering, Chemical Engineering, Electrical Engineering, Mechanical Engineering, Nuclear Engineering, Optics, Chemistry, or a related field; OR a Master's degree in the aforementioned fields with 4+ years of engineering industry experience. • Experience in materials characterization techniques such as SEM, TEM, Spectroscopy or other metrology tools. • Experience with semiconductor processing fundamentals, including lithography, etching, polishing, chemical/physical reactions, or device physics. • Experience in statistical or data analysis tools like MATLAB, JMP, or Excel, and familiarity with design of experiments (DOE) principles. Preferred Qualifications: • Proven experience in defect reduction or process integration within semiconductor manufacturing. • Knowledge of Statistical Process Control (SPC) methods or advanced process controls (APC). • Expertise in