Jobs / United States / Intel Corporation
Advanced Packaging Substrate Supplier Enablement Lead
Intel Corporation · 🇺🇸 US, Arizona, Phoenix
Sponsorship verdict
Sponsorship possible
One solid signal, not two — worth applying, and worth asking about sponsorship early.
- Employer is on a government sponsor recordThe US Department of Labor certified 1,731 H-1B/E-3 labor condition applications for this employer between Oct 2025 and Jun 2026 (latest Jun 2026) — the step every H-1B hire needs first. USCIS also records 1,112 H-1B approvals in FY2023. Source: LCA disclosure data (US Department of Labor (OFLC)).
- The posting doesn’t mention sponsorshipSilence isn’t a refusal — ask the recruiter before investing much time.
- No salary bar for this routeH-1B has no fixed salary bar: the employer must pay at least the prevailing wage for the role and area. Cap-subject employers enter a lottery weighted by wage level. Source: https://www.federalregister.gov/documents/2025/12/29/2025-23853/weighted-selection-process-for-registrants-and-petitioners-seeking-to-file-cap-subject-h-1b, rules effective 2026-02-27.
- What Intel Corporation paid sponsored hires in similar roles45 certified filings for “Packaging Engineer” (Electronics Engineers, Except Computer) in AZ: $115k–$143k, median $139k. Most were filed at wage level III (59%) — 3 lottery entries, ≈46% projected selection odds for cap-subject employers. Source: US Department of Labor LCA disclosure data (Oct 2025 – Jun 2026).
- Confirmed live todayWhen a source last listed this job as open.
US H-1B: cap-subject employers enter a lottery weighted by wage level — Level I gets 1 entry, Level IV gets 4 (DHS projected selection odds ≈15% at Level I to ≈61% at Level IV). Universities and non-profit research employers are cap-exempt. The $100,000 fee for new petitions from abroad is currently blocked by a court order (appeal pending).
A verdict summarises public evidence; it is not legal advice and never a guarantee — the employer and the immigration authority decide. Sign in to factor in where you can already work.
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Sponsor Radar — Intel Corporation
The US Department of Labor certified 1,731 H-1B/E-3 labor condition applications for this employer between Oct 2025 and Jun 2026 (latest Jun 2026) — the step every H-1B hire needs first. USCIS also records 1,112 H-1B approvals in FY2023. Source: LCA disclosure data (US Department of Labor (OFLC)).
Past sponsorship or register membership never guarantees sponsorship for this vacancy or for you. Full Sponsor Radar for Intel Corporation →
About the role
Job Details: Job Description: The Advanced Packaging Technology Development (APTD) Substrate and Wafer Assembly organization is responsible for developing cutting edge substrate packaging and wafer assembly solutions for our customers. As a member of the Substrate Technology and Manufacturing Group, you will play a critical role in enabling new manufacturing capacity across advanced packaging suppliers. In this position, you will lead substrate supplier development and qualification activities for advanced technologies such as high density FCBGA, EMIB-T and glass core substrate, ensuring suppliers achieve the required readiness to support growing customer demand. This includes driving technical enablement, managing readiness milestones, and collaborating closely with cross functional engineering teams and supplier partners. A combination of detail-oriented project management, strong technical risk assessment / problem solving skills, and effective supplier / stakeholder management will be needed to be successful. Please note: This role requires periodic evening meetings with suppliers in East Asia, as well as occasional travel to supplier sites to support essential program objectives. Key Responsibilities • Define process integration roadmaps and establish manufacturing procedures to meet technology transfer milestones. • Extract insights from structured and unstructured data, applying statistical analysis and coding techniques for yield improvement. • Lead low yield analysis and corrective actions to address quality excursions in high-volume production environments. • Drive continuous improvement initiatives to minimize defects and optimize process reliability. • Assess quality and reliability risks for manufacturing material and process changes, ensuring sustained product performance. • Collaborate with internal teams and external stakeholders to align process strategies with program goals. Behavioral traits • Demonstrated expertise in structured problem solving and data-driven decision-making. • Proven leadership in supplier management and technology enablement. • Strong collaboration, influencing, and communication skills across global, cross-functional teams. • Strategic mindset with the ability to align technical solutions with organizational objectives. • Enthusiasm for innovation, mentoring, and contributing to Intel's technical leadership. Qualifications: Minimum Qualifications • Bachelor's degree in engineering, physics, materials science, or a related field, with 9+ years of relevant experience; or • Master's degree in engineering, physics, materials science, or a related field, with 6+ years of relevant experience; or • PhD in engineering, physics, materials science, or a related field, with 4+ years of relevant experience. • The experience listed above should be a combination of the following: • Proficiency in process integration methodologies and tools used in semiconductor manufacturing environments. • Experience in advanced packaging, substrates, or semiconductor process development. Join us in shaping the future of manufacturing with your expertise and passion for technology development. Job Type: Experienced Hire Shift: Shift 1 (United States of America) Primary Location: US, Arizona, Phoenix Additional Locations: Posting Statement: All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance. Position