Jobs / United States / Intel Corporation
Package Failure Analysis Engineer
Intel Corporation · 🇺🇸 US, Arizona, Phoenix
Sponsorship verdict
Posting rules out sponsorship
The posting rules out sponsorship or requires citizenship/clearance.
- Employer is on a government sponsor recordThe US Department of Labor certified 1,731 H-1B/E-3 labor condition applications for this employer between Oct 2025 and Jun 2026 (latest Jun 2026) — the step every H-1B hire needs first. USCIS also records 1,112 H-1B approvals in FY2023. Source: LCA disclosure data (US Department of Labor (OFLC)).
- The posting doesn’t mention sponsorshipSilence isn’t a refusal — ask the recruiter before investing much time.
- No salary bar for this routeH-1B has no fixed salary bar: the employer must pay at least the prevailing wage for the role and area. Cap-subject employers enter a lottery weighted by wage level. Source: https://www.federalregister.gov/documents/2025/12/29/2025-23853/weighted-selection-process-for-registrants-and-petitioners-seeking-to-file-cap-subject-h-1b, rules effective 2026-02-27.
- What Intel Corporation paid sponsored hires in similar roles78 certified filings for “Software Engineer” (Software Developers) in AZ: $111k–$140k, median $120k. Most were filed at wage level II (59%) — 2 lottery entries, ≈31% projected selection odds for cap-subject employers. Source: US Department of Labor LCA disclosure data (Oct 2025 – Jun 2026).
- Citizenship requirement statedFrom the posting’s own wording.
- Security clearance mentionedFrom the posting’s own wording.
- Confirmed live todayWhen a source last listed this job as open.
US H-1B: cap-subject employers enter a lottery weighted by wage level — Level I gets 1 entry, Level IV gets 4 (DHS projected selection odds ≈15% at Level I to ≈61% at Level IV). Universities and non-profit research employers are cap-exempt. The $100,000 fee for new petitions from abroad is currently blocked by a court order (appeal pending).
A verdict summarises public evidence; it is not legal advice and never a guarantee — the employer and the immigration authority decide. Sign in to factor in where you can already work.
Or apply yourself on the official page →
Why not apply?
Citizenship requirement stated — the posting’s wording suggests candidates who already hold work rights. Read the original listing carefully.
The posting mentions a security clearance — usually restricted to citizens of that country.
SponsorApply flags time-wasters so your applications go where they can land. These come from the posting's own wording — read the original listing to confirm. See better-fit alternatives →
Sponsor Radar — Intel Corporation
The US Department of Labor certified 1,731 H-1B/E-3 labor condition applications for this employer between Oct 2025 and Jun 2026 (latest Jun 2026) — the step every H-1B hire needs first. USCIS also records 1,112 H-1B approvals in FY2023. Source: LCA disclosure data (US Department of Labor (OFLC)).
Past sponsorship or register membership never guarantees sponsorship for this vacancy or for you. Full Sponsor Radar for Intel Corporation →
About the role
Job Details: Job Description: This role will support root cause determination of assembled package yield loss and in-line failures on a back of week compressed shift. The engineer on shift will be responsible for technical functions such as design, test, checkout, modifications, and characterization of assembly technologies. Engineers on back/front of week shift schedules will help bridge support between shift engineering technicians, as well as shift 1 engineers and module partners, yield support, integration and program customers in a collaborative environment. As part of this role, the engineer will help align program priorities, share and provide technical expertise regarding analysis results, and ensure an inclusive work environment. Engineers can expect to work collaboratively with additional engineers and engineering technicians to conduct analyses and engineering tests to accomplish fault isolation of electrical failures and perform defect and/or process characterization in support of identifying key mechanisms that contribute to RC identification. Your main responsibilities include, but are not limited to: • Working across team boundaries to achieve strategic objectives and meet program deliverables. • Understand and support program milestones and schedules. • Interface with a wide variety of internal teams to improve yield and drive innovation. • Conduct hands-on lab work, define data acquisition strategy and data analysis plan, and recommend corrective actions and/or fixes to internal customers. • Develop failure analysis innovative techniques, BKMs, and/or approaches to accelerate failure identification and mechanism understanding. • Provide consultation concerning packaging and/or assembly problems and improvements in the manufacturing process. • Respond to customers' requests or events as they occur. • Candidate should be capable of working effectively across organizational boundaries. • Candidate must exhibit the following traits/skills: Work with ambiguity and flexibility with respect to job roles and working hours, have strong analytical and problem-solving skills, and possess robust communication and presentation skills. This role is lab-based and on-site required. Shift 5 Work Schedule Required- Days front half of week - AM-PM Sun-Tues and alternating Wednesday days #cj Qualifications: Minimum Qualifications • Must possess a Bachelor's Degree or higher in Materials Science and Engineering, Mechanical Engineering, Chemical Engineering, Electrical Engineering, or Chemistry and Physics or related field. • US Citizenship is required. • Ability to obtain and maintain a US Government TS/SCI Security Clearance with Polygraph. • Hands-on experience with 1 or more electrical fault isolation or defect characterization techniques Preferred Qualifications: • Active US Government TS/SCI Security Clearance with Polygraph. • Prior experience working in a lab environment or with lab equipment in academic setting. • Experience including labs or coursework pertaining to optical analysis techniques such as SEM, TEM, x-ray, and optical microscopy • Experience including labs or coursework providing fundamental understanding of electrical circuits. This could include circuits and electronics courses, labs, and hands-on experience with multimeters and other probing equipment including any specialized equipment such as: TDR, EOTPR, EBAC, RIDR, and/or ELITE. • Experience including labs or coursework with chemical compositional analysis techniques such as EDX. AFM, FTIR, Raman, and diffraction techniques such as XRD and EBSD. • Familiarity with CAD software and basic statistical analysis tools such as JMP are a plus. • Ability to communicate findings verbally and through reports to yield engineers, LYA analysts