Jobs / United States / Intel Corporation
Module Development Engineer
Intel Corporation · 🇺🇸 US, Oregon, Hillsboro
Sponsorship verdict
Sponsorship possible
One solid signal, not two — worth applying, and worth asking about sponsorship early.
- Employer is on a government sponsor recordThe US Department of Labor certified 1,731 H-1B/E-3 labor condition applications for this employer between Oct 2025 and Jun 2026 (latest Jun 2026) — the step every H-1B hire needs first. USCIS also records 1,112 H-1B approvals in FY2023. Source: LCA disclosure data (US Department of Labor (OFLC)).
- The posting doesn’t mention sponsorshipSilence isn’t a refusal — ask the recruiter before investing much time.
- No salary bar for this routeH-1B has no fixed salary bar: the employer must pay at least the prevailing wage for the role and area. Cap-subject employers enter a lottery weighted by wage level. Source: https://www.federalregister.gov/documents/2025/12/29/2025-23853/weighted-selection-process-for-registrants-and-petitioners-seeking-to-file-cap-subject-h-1b, rules effective 2026-02-27.
- What Intel Corporation paid sponsored hires in similar roles287 certified filings for “Process Engineer” (Materials Engineers) in OR: $113k–$133k, median $133k. Most were filed at wage level III (87%) — 3 lottery entries, ≈46% projected selection odds for cap-subject employers. Source: US Department of Labor LCA disclosure data (Oct 2025 – Jun 2026).
- Confirmed live todayWhen a source last listed this job as open.
US H-1B: cap-subject employers enter a lottery weighted by wage level — Level I gets 1 entry, Level IV gets 4 (DHS projected selection odds ≈15% at Level I to ≈61% at Level IV). Universities and non-profit research employers are cap-exempt. The $100,000 fee for new petitions from abroad is currently blocked by a court order (appeal pending).
A verdict summarises public evidence; it is not legal advice and never a guarantee — the employer and the immigration authority decide. Sign in to factor in where you can already work.
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Sponsor Radar — Intel Corporation
The US Department of Labor certified 1,731 H-1B/E-3 labor condition applications for this employer between Oct 2025 and Jun 2026 (latest Jun 2026) — the step every H-1B hire needs first. USCIS also records 1,112 H-1B approvals in FY2023. Source: LCA disclosure data (US Department of Labor (OFLC)).
Past sponsorship or register membership never guarantees sponsorship for this vacancy or for you. Full Sponsor Radar for Intel Corporation →
About the role
Job Details: Job Description: Join Intel - and build a better tomorrow. Intel is in the midst of an exciting transformation, with a vision to create and extend computing technology to connect and enrich the lives of every person on Earth. Join us and help us create the next generation of technologies that will shape the future for decades to come. Engineers within Intel's Logic Technology Development (LTD) organization are chartered with continuing to meet the challenge of Moore's Law in the 21st century. We innovate leading edge fabrication processes and continue to overcome seemingly impossible barriers as tolerances and specifications for building best-in-class computing devices become increasingly rigorous. The role of a Chemical Mechanical Planarization (CMP) Process Development Engineer in LTD encompasses developing and sustaining planarization techniques for a variety of materials and architectures, enabling rapid miniaturization in the semiconductor industry and the mass production of integrated circuits. CMP techniques leverage physics, chemistry, materials science and surface science concepts, and exist at the intersection of these disciplines. As a result, our team has a diverse set of scientific backgrounds that relies on strong collaboration and shared learning. The role’s responsibilities include, but are not limited to: • Drives technology development and enablement for both high volume manufacturing and future technology, provides process integration and equipment solutions, and performs feasibility studies to meet desired device specifications • Leads design and development of technically sophisticated manufacturing processes and/or repair reverse engineering including material selection, parameter optimization, equipment metrology, and system design to enable new product designs and functional requirements • Performs pathfinding activities in support of process and hardware development enabling manufacturing of innovative device architectures and develops roadmaps for technologies enabling future roadmap • Recommends and implements modifications for operating equipment to improve production efficiency, manufacturing techniques, and optimizing production output for existing products • Partners with key equipment and materials suppliers to develop and implement enabling elements of the technology • Performs process technology feasibility studies through theoretical simulations and/or practical engineering methods • Remains updated on relevant industrial process and material manufacturing technical trends and develops view of inherent future Intel process technology needs to push industry forward by partnering with vendor ecosystem to build cost sensitive roadmap Qualifications: You must possess the minimum qualifications below to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. Requirements listed would be obtained through a combination of industry relevant job experience, internship experiences and or schoolwork/classes/research. Minimum Qualifications: • PhD degree in Electrical Engineering, Electrical Computer Engineering, Chemical Engineering, Material Science, Physics, Chemistry, Computer Science, or a Semiconductor-related STEM (Science Technology Engineering Math) field of study (with a focus on hands-on experimental research). Preferred Qualifications: • Statistics Coursework, Statistical Process Control (SPC) or Design of Experiments (DOE) principles, and engineering analysis tools • Experimental lab work • Semiconductor and transistor device physics • Advanced transistor device structures and architectures including fabrication (e.g., lithography, etch, film