Jobs / United States / Intel Corporation
Senior Analog Design Engineer
Intel Corporation · 🇺🇸 US, California, Santa Clara
Sponsorship verdict
Sponsorship possible
One solid signal, not two — worth applying, and worth asking about sponsorship early.
- Employer is on a government sponsor recordThe US Department of Labor certified 1,731 H-1B/E-3 labor condition applications for this employer between Oct 2025 and Jun 2026 (latest Jun 2026) — the step every H-1B hire needs first. USCIS also records 1,112 H-1B approvals in FY2023. Source: LCA disclosure data (US Department of Labor (OFLC)).
- The posting doesn’t mention sponsorshipSilence isn’t a refusal — ask the recruiter before investing much time.
- No salary bar for this routeH-1B has no fixed salary bar: the employer must pay at least the prevailing wage for the role and area. Cap-subject employers enter a lottery weighted by wage level. Source: https://www.federalregister.gov/documents/2025/12/29/2025-23853/weighted-selection-process-for-registrants-and-petitioners-seeking-to-file-cap-subject-h-1b, rules effective 2026-02-27.
- What Intel Corporation paid sponsored hires in similar roles211 certified filings for “Component Design Engineer” (Electronics Engineers, Except Computer) in CA: $125k–$167k, median $142k. Most were filed at wage level III (43%) — 3 lottery entries, ≈46% projected selection odds for cap-subject employers. Source: US Department of Labor LCA disclosure data (Oct 2025 – Jun 2026).
- Confirmed live todayWhen a source last listed this job as open.
US H-1B: cap-subject employers enter a lottery weighted by wage level — Level I gets 1 entry, Level IV gets 4 (DHS projected selection odds ≈15% at Level I to ≈61% at Level IV). Universities and non-profit research employers are cap-exempt. The $100,000 fee for new petitions from abroad is currently blocked by a court order (appeal pending).
A verdict summarises public evidence; it is not legal advice and never a guarantee — the employer and the immigration authority decide. Sign in to factor in where you can already work.
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Sponsor Radar — Intel Corporation
The US Department of Labor certified 1,731 H-1B/E-3 labor condition applications for this employer between Oct 2025 and Jun 2026 (latest Jun 2026) — the step every H-1B hire needs first. USCIS also records 1,112 H-1B approvals in FY2023. Source: LCA disclosure data (US Department of Labor (OFLC)).
Past sponsorship or register membership never guarantees sponsorship for this vacancy or for you. Full Sponsor Radar for Intel Corporation →
About the role
Job Details: Job Description: The world is transforming - and so is Intel. Intel is a company of bold and curious inventors and problem solvers who create some of the most astounding technology advancements and experiences in the world. With a legacy of relentless innovation and a commitment to bring smart, connected devices to every person on Earth, our diverse and brilliant teams are continually searching for tomorrow's technology and revel in the challenge that changing the world for the better brings. We work every single day to design and manufacture silicon products that empower people's digital lives. Come join us and do something wonderful. Business group Intel Integrated Photonics Solutions (IPS), part of the Data Center Group, is a leader in silicon photonics integration. Our team drives innovation through advanced technology and scalable, high-volume manufacturing of silicon photonics products. We are committed to developing next-generation optical connectivity solutions that enable continued data center bandwidth growth through smaller form factors, co-packaged optics, and data rates scaling from 400G today to 3.2T and beyond. The Role and Impact We are seeking a highly motivated Senior Analog Design Engineer to join our growing team and help accelerate the development of industry-leading silicon photonics solutions. As a Senior Analog Design Engineer, you will contribute to the Silicon Photonics Solutions Group's mission of transforming data center connectivity and strengthening Intel's leadership in networking technologies. In this role, you will be responsible for: • The architecture, design, implementation, and validation of high-speed analog and mixed-signal integrated circuits used in advanced optical interconnect products. • You will collaborate closely with cross-functional design teams to deliver innovative solutions from concept through production. • Define circuit architectures and develop designs that meet power, performance, and functionality requirements for next-generation optical interconnects. • Lead block-level design and collaborate with multidisciplinary teams to deliver key integrated circuit components. • Architect, design, and validate high-speed, low-voltage, low-power analog and mixed-signal integrated circuits. • Work closely with digital design teams to ensure successful integration and product execution. • Plan and execute design activities while balancing performance, schedule, and quality objectives. • Guide to the development of post-silicon test and characterization plans. • Create and maintain comprehensive design documentation, including design specifications, reviews, and technical reports. Qualifications: You must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. Experience listed below would be obtained through a combination of your degree, research and or relevant previous job and or internship experiences. Minimum Qualifications: M.S. degree in Electrical Engineering or a related field with 3+ years of industry experience or PhD & 0 years in the following: • Hands-on experience designing high-speed circuit blocks such as amplifiers, drivers, equalizers, PLLs, phase interpolators, and clock and data recovery (CDR) circuits for data rates of 32 Gbps and above. • Experience designing inductors, transmission lines, transimpedance amplifiers (TIAs), and optical modulator drivers. • Strong expertise in high-speed serial link design and analog CMOS/BiCMOS circuit design using deep-submicron process technologies. • Experience with full-chip integration, ESD design considerations, and verification met