Jobs / United States / Intel Corporation
System Technology Research Engineer - (PhD Intern)
Intel Corporation · 🇺🇸 3 Locations
Sponsorship verdict
Sponsorship possible
One solid signal, not two — worth applying, and worth asking about sponsorship early.
- Employer is on a government sponsor recordThe US Department of Labor certified 1,731 H-1B/E-3 labor condition applications for this employer between Oct 2025 and Jun 2026 (latest Jun 2026) — the step every H-1B hire needs first. USCIS also records 1,112 H-1B approvals in FY2023. Source: LCA disclosure data (US Department of Labor (OFLC)).
- The posting doesn’t mention sponsorshipSilence isn’t a refusal — ask the recruiter before investing much time.
- No salary bar for this routeH-1B has no fixed salary bar: the employer must pay at least the prevailing wage for the role and area. Cap-subject employers enter a lottery weighted by wage level. Source: https://www.federalregister.gov/documents/2025/12/29/2025-23853/weighted-selection-process-for-registrants-and-petitioners-seeking-to-file-cap-subject-h-1b, rules effective 2026-02-27.
- What Intel Corporation paid sponsored hires in similar roles1 certified filing for “Operations Research Engineer” (Operations Research Analysts) in AZ: $94k–$94k, median $94k. Most were filed at wage level II (100%) — 2 lottery entries, ≈31% projected selection odds for cap-subject employers. Source: US Department of Labor LCA disclosure data (Oct 2025 – Jun 2026).
- Confirmed live todayWhen a source last listed this job as open.
US H-1B: cap-subject employers enter a lottery weighted by wage level — Level I gets 1 entry, Level IV gets 4 (DHS projected selection odds ≈15% at Level I to ≈61% at Level IV). Universities and non-profit research employers are cap-exempt. The $100,000 fee for new petitions from abroad is currently blocked by a court order (appeal pending).
A verdict summarises public evidence; it is not legal advice and never a guarantee — the employer and the immigration authority decide. Sign in to factor in where you can already work.
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Sponsor Radar — Intel Corporation
The US Department of Labor certified 1,731 H-1B/E-3 labor condition applications for this employer between Oct 2025 and Jun 2026 (latest Jun 2026) — the step every H-1B hire needs first. USCIS also records 1,112 H-1B approvals in FY2023. Source: LCA disclosure data (US Department of Labor (OFLC)).
Past sponsorship or register membership never guarantees sponsorship for this vacancy or for you. Full Sponsor Radar for Intel Corporation →
About the role
Job Details: Job Description: Are you a top-tier university student eager to dive into the world of semiconductor innovation? Intel's Foundry System Technology team is seeking a talented intern to help us push the boundaries of semiconductor and packaging manufacturing technologies. Our team is dedicated to advancing Moore's Law, exploring new product opportunities, and leading industry-defining packaging development through System Technology Co-optimisation (STCO). Position Overview: As a Research Engineer Intern, you will play a crucial role in developing STCO methodology and evaluating 3D/2.5D dis-aggregation schemes using solder microbumps or hybrid bonding for memory and logic stacking across different product architectures. This internship offers a unique opportunity to work on pioneering technologies and contribute to Intel's semiconductor processing and packaging roadmap. What You'll Do: • Develop and enhance STCO methodologies. • Perform system-level evaluations of novel devices, interconnects, patterning, materials, systems, and integration schemes. • Collaborate with diverse teams to drive innovation across various applications. Who We're Looking For: • Driven and Motivated; a self-starter who thrives in a dynamic environment and is committed to delivering high-quality results. • Analytical and Problem-Solving Skills: Ability to tackle complex challenges with a strategic approach. • Organized and Efficient: Strong prioritization and time management skills to handle a fast-paced workflow. • Collaborative and Team-Oriented: Excellent stakeholder management and teamwork ethics. • Flexible and Adaptable: Comfortable working in an agile environment with a tolerance for ambiguity. • Strong Communicator: Good interpersonal skills to facilitate effective collaboration and communication Internship Details: Minimum of 3 months during summer 2026, with potential for extension based on business needs. Why Choose Intel? • Collaborate with industry leaders and innovators. • Gain hands-on experience with cutting-edge technologies. • Contribute to projects that shape the future of semiconductor processing. If you're ready to embark on a journey of innovation and discovery, apply now to join Intel's Foundry System Technology team. We look forward to welcoming you to a transformative internship experience Qualifications: You must possess the below requirements to be initially considered for this position. Preferred qualifications are in addition to the requirements and are considered a plus factor in identifying top candidates. Knowledge and/or experience listed below would be obtained through a combination of your schoolwork and/or classes and/or research and/or relevant previous job and/or internship experiences. Minimum Qualifications: • Active Ph.D. candidacy in one of the following areas of study: Electrical Engineering, Electronics Engineering, Computer Architecture and Design or similar. • 1-2+ years research experience relevant to one or more of the following areas: System architecture modelling, digital circuit analysis and design, VLSI physical layout, electronic design automation, multi-physics modeling of electronic materials or systems. • Familiarity with IC design and physical layout tools such Cadence Virtuoso or Synopsis Fusion Compiler. Preferred Qualifications: • System architecture design and modelling • IC design, simulation, physical layout and tapeout experience. • Familiar with DRAM and SRAM circuit design and layout • Familiar with integrated circuits manufacturing flow and requirements • Familiar with different 2.5D and 3D packaging technologies • 3DIC design and simulation experience • Good programming skills, preferably in Python. Job Type: Student / Intern Shift: